公开(公告)号：US20210371275A1

公开(公告)日：2021-12-02

申请号：US17399896

申请日：2021-08-11

Applicant: Texas Instruments Incorporated

Inventor： Simon Joshua Jacobs ,  Molly Nelis Sing ,  Lawerence Tucker Latham

IPC: B81C1/00 ,  B81B3/00

Abstract: In described examples, a MEMS device component includes a passivation layer formed from a vapor and/or a liquid compound that may include precursors. The compound may contain amino acid, antioxidants, nitriles or other compounds, and may be disposed on a surface of the MEMS device component and/or a package or package portion thereof. If the compound is a precursor, it may be treated to cause formation of the passivation layer from the precursor.

公开(公告)号：US10081536B2

公开(公告)日：2018-09-25

申请号：US15379401

申请日：2016-12-14

Applicant: Texas Instruments Incorporated

Inventor： Simon Joshua Jacobs ,  Molly Nelis Sing

IPC: H01L29/12 ,  H01L29/84 ,  H01L23/10 ,  B81B7/00 ,  B81C1/00 ,  B81B7/02 ,  H01L23/20 ,  H01L21/56 ,  B29C65/48 ,  H01L21/67

CPC classification number: B81B7/0038 ,  B29C65/48 ,  B81B3/0016 ,  B81B7/02 ,  B81C1/00214 ,  H01L21/56 ,  H01L21/67 ,  H01L23/10 ,  H01L23/20 ,  H01L29/12 ,  H01L29/84

Abstract: In described examples, a MEMS device is enclosed within a sealed package including nonmetal oxide gasses at levels greater than 1% by volume. In at least one example, the MEMS device is protected against premature failure from various causes, including charging, particle growth and stiction by moieties of the nonmetal oxide gasses reacting with various exposed surfaces within the package of the MEMS device and/or the adsorbed water layers on said surfaces.

公开(公告)号：US20250002334A1

公开(公告)日：2025-01-02

申请号：US18887130

申请日：2024-09-17

Applicant: Texas Instruments Incorporated

Inventor： Simon Joshua Jacobs ,  Molly Nelis Sing ,  Lawerence Tucker Latham

IPC: B81C1/00 ,  B81B3/00

Abstract: In described examples, a MEMS device component includes a passivation layer formed from a vapor and/or a liquid compound that may include precursors. The compound may contain amino acid, antioxidants, nitriles or other compounds, and may be disposed on a surface of the MEMS device component and/or a package or package portion thereof. If the compound is a precursor, it may be treated to cause formation of the passivation layer from the precursor.

公开(公告)号：US11536950B2

公开(公告)日：2022-12-27

申请号：US16226420

申请日：2018-12-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Robert F. Payne ,  Molly Nelis Sing

IPC: G02B26/00 ,  G02B26/08 ,  G01B7/30 ,  H03K21/38 ,  G09G3/34 ,  G11C11/413 ,  G11C11/41

Abstract: A digital micromirror device includes a plurality of micromirror cells on a semiconductor die. Each respective cell includes a memory circuit and an electrode selection circuit. At least some of the micromirror cells include a micromirror and each respective memory circuit controls a micromirror tilt angle. For a given memory circuit controlled to a first tilt angle, a measurement circuit measures a first value indicative of a capacitance between a first electrode and the micromirror and measures a second value indicative of a capacitance on the second electrode. For a second micromirror tilt angle, the measurement circuit measures a third value indicative of a capacitance between the first electrode and the micromirror and measures a fourth value indicative of a capacitance on the second electrode. The measurement circuit generates a signal indicative of whether the micromirror is stuck at a particular angle or missing.

公开(公告)号：US10029908B1

公开(公告)日：2018-07-24

申请号：US15395029

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Simon Joshua Jacobs ,  Molly Nelis Sing ,  Kelly Jay Taylor

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00

Abstract: In described examples, a method of forming a microelectromechanical device comprises: forming a first metallic layer comprising a conducting layer on a substrate; forming a first dielectric layer on the first metallic layer, wherein the first dielectric layer comprises one or more individual dielectric layers; forming a sacrificial layer on the first dielectric layer; forming a second dielectric layer on the sacrificial layer; forming a second metallic layer on the second dielectric layer; and removing the sacrificial layer to form a spacing between the second dielectric layer and the first dielectric layer. Removing the sacrificial layer enables movement of the second dielectric layer relative to the first dielectric layer in at least one direction.

公开(公告)号：US20180162721A1

公开(公告)日：2018-06-14

申请号：US15379401

申请日：2016-12-14

Applicant: Texas Instruments Incorporated

Inventor： Simon Joshua Jacobs ,  Molly Nelis Sing

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B29C65/48 ,  B81B7/02 ,  B81B2201/042 ,  B81C1/00214 ,  B81C1/00285 ,  B81C2201/11 ,  H01L21/56 ,  H01L21/67 ,  H01L23/10 ,  H01L23/20 ,  H01L29/12 ,  H01L29/84

Abstract: In described examples, a MEMS device is enclosed within a sealed package including nonmetal oxide gasses at levels greater than 1% by volume. In at least one example, the MEMS device is protected against premature failure from various causes, including charging, particle growth and stiction by moieties of the nonmetal oxide gasses reacting with various exposed surfaces within the package of the MEMS device and/or the adsorbed water layers on said surfaces.