公开(公告)号：US20230422412A1

公开(公告)日：2023-12-28

申请号：US18244182

申请日：2023-09-08

Applicant: TOPPAN INC.

Inventor： Akihiro HAYASHI ,  Masahito TANABE ,  Tetsuyuki TSUCHIDA

IPC: H05K3/46 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K3/4655 ,  H01L24/16 ,  H01L24/73 ,  H01L24/32 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H05K3/429 ,  H05K1/116 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2924/15174 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09636

Abstract: A multilayer wiring board includes two or more layers laminated together, each layer includes an insulating resin layer having a first surface and a second surface, and a conductor layer. The insulating resin layer includes a first recess that is open to the first surface, a groove section that is open to the first surface, and a second recess that is open to the second surface and communicates with one or more of the first recesses. Each insulating resin layer is integrally formed in a thickness direction thereof. The conductor layer includes a land portion and a wiring portion filling the first recess and the groove section, and a via portion protruding from the first surface at a position of the land portion. The via portion protruding from the first surface of the insulating resin layer fills a recess of another insulating resin layer adjacent to the first surface.