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公开(公告)号:US20210134339A1
公开(公告)日:2021-05-06
申请号:US17002351
申请日:2020-08-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: MingYuan Song , Shy-Jay Lin , Chien-Min Lee , William Joseph Gallagher
Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a shared selector layer coupled to the first terminal.
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公开(公告)号:US20210408115A1
公开(公告)日:2021-12-30
申请号:US17216162
申请日:2021-03-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , MingYuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H01L27/22 , H01L21/8234 , H01L21/768 , H01L23/528
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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公开(公告)号:US11289143B2
公开(公告)日:2022-03-29
申请号:US17002351
申请日:2020-08-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: MingYuan Song , Shy-Jay Lin , Chien-Min Lee , William Joseph Gallagher
Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a shared selector layer coupled to the first terminal.
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公开(公告)号:US12022665B2
公开(公告)日:2024-06-25
申请号:US18335816
申请日:2023-06-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , MingYuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H01L21/00 , H01L21/768 , H01L21/8234 , H01L23/528 , H10B61/00
CPC classification number: H10B61/22 , H01L21/76898 , H01L21/823475 , H01L23/528
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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公开(公告)号:US20230345738A1
公开(公告)日:2023-10-26
申请号:US18335816
申请日:2023-06-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , MingYuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H10B61/00 , H01L23/528 , H01L21/768 , H01L21/8234
CPC classification number: H10B61/22 , H01L23/528 , H01L21/76898 , H01L21/823475
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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公开(公告)号:US11699474B2
公开(公告)日:2023-07-11
申请号:US17696394
申请日:2022-03-16
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: MingYuan Song , Shy-Jay Lin , Chien-Min Lee , William Joseph Gallagher
IPC: G11C11/16 , G01R33/09 , H01L27/22 , H01L43/04 , H01L43/08 , H01L43/10 , H01L43/14 , H10B61/00 , H10N50/10 , H10N50/85 , H10N52/01 , H10N52/80
CPC classification number: G11C11/1675 , G01R33/093 , G11C11/161 , H10B61/22 , H10N50/10 , H10N50/85 , H10N52/01 , H10N52/80
Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a shared selector layer coupled to the first terminal.
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公开(公告)号:US20220208244A1
公开(公告)日:2022-06-30
申请号:US17696394
申请日:2022-03-16
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: MingYuan Song , Shy-Jay Lin , Chien-Min Lee , William Joseph Gallagher
Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a shared selector layer coupled to the first terminal.
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公开(公告)号:US20240315051A1
公开(公告)日:2024-09-19
申请号:US18679002
申请日:2024-05-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , MingYuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H10B61/00 , H01L21/768 , H01L21/8234 , H01L23/528
CPC classification number: H10B61/22 , H01L21/76898 , H01L21/823475 , H01L23/528
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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公开(公告)号:US20230326508A1
公开(公告)日:2023-10-12
申请号:US18321196
申请日:2023-05-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: MingYuan Song , Shy-Jay Lin , Chien-Min Lee , William Joseph Gallagher
CPC classification number: G11C11/1675 , G01R33/093 , G11C11/161 , H10B61/22 , H10N50/10 , H10N50/85 , H10N52/01 , H10N52/80
Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a shared selector layer coupled to the first terminal.
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公开(公告)号:US11723218B2
公开(公告)日:2023-08-08
申请号:US17216162
申请日:2021-03-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , Mingyuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H01L21/00 , H10B61/00 , H01L23/528 , H01L21/768 , H01L21/8234
CPC classification number: H10B61/22 , H01L21/76898 , H01L21/823475 , H01L23/528
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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