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公开(公告)号:US12156479B2
公开(公告)日:2024-11-26
申请号:US17518789
申请日:2021-11-04
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yen-Lin Huang , MingYuan Song , Chien-Min Lee , Shy-Jay Lin , Chi-Feng Pai , Chen-Yu Hu , Chao-Chung Huang , Kuan-Hao Chen , Chia-Chin Tsai , Yu-Fang Chiu , Cheng-Wei Peng
IPC: H10N50/85 , C22C5/04 , H01F10/32 , H10B61/00 , H10N50/10 , H10N50/80 , H10N52/00 , H10N52/01 , H10N52/80
Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a magnetic tunneling junction (MTJ) and a spin Hall electrode (SHE). The MTJ includes a free layer, a reference layer and a barrier layer lying between the free layer and the reference layer. The SHE is in contact with the MTJ, and configured to convert a charge current to a spin current for programming the MTJ. The SHE is formed of an alloy comprising at least one heavy metal element and at least one light transition metal element. The heavy metal element is selected from metal elements with one or more valence electrons filling in 5d orbitals, and the light transition metal element is selected from transition metal elements with one or more valence electrons partially filling in 3d orbitals.
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公开(公告)号:US20230292631A1
公开(公告)日:2023-09-14
申请号:US18308914
申请日:2023-04-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Min Lee , Shy-Jay Lin , Yen-Lin Huang , MingYuan Song , Tung Ying Lee
Abstract: Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.
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公开(公告)号:US20220216396A1
公开(公告)日:2022-07-07
申请号:US17518789
申请日:2021-11-04
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yen-Lin Huang , MingYuan Song , Chien-Min Lee , Shy-Jay Lin , Chi-Feng Pai , Chen-Yu Hu , Chao-Chung Huang , Kuan-Hao Chen , Chia-Chin Tsai , Yu-Fang Chiu , Cheng-Wei Peng
Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a magnetic tunneling junction (MTJ) and a spin Hall electrode (SHE). The MTJ includes a free layer, a reference layer and a barrier layer lying between the free layer and the reference layer. The SHE is in contact with the MTJ, and configured to convert a charge current to a spin current for programming the MTJ. The SHE is formed of an alloy comprising at least one heavy metal element and at least one light transition metal element. The heavy metal element is selected from metal elements with one or more valence electrons filling in 5d orbitals, and the light transition metal element is selected from transition metal elements with one or more valence electrons partially filling in 3d orbitals.
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公开(公告)号:US20210408115A1
公开(公告)日:2021-12-30
申请号:US17216162
申请日:2021-03-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , MingYuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H01L27/22 , H01L21/8234 , H01L21/768 , H01L23/528
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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公开(公告)号:US20240381788A1
公开(公告)日:2024-11-14
申请号:US18780824
申请日:2024-07-23
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Min Lee , Shy-Jay Lin , Yen-Lin Huang , MingYuan Song , Tung Ying Lee
Abstract: Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.
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公开(公告)号:US11672186B2
公开(公告)日:2023-06-06
申请号:US17369484
申请日:2021-07-07
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Min Lee , Shy-Jay Lin , Yen-Lin Huang , MingYuan Song , Tung Ying Lee
CPC classification number: H01L43/04 , H01L27/228 , H01L43/10 , H01L43/14
Abstract: Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.
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公开(公告)号:US20240315051A1
公开(公告)日:2024-09-19
申请号:US18679002
申请日:2024-05-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , MingYuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H10B61/00 , H01L21/768 , H01L21/8234 , H01L23/528
CPC classification number: H10B61/22 , H01L21/76898 , H01L21/823475 , H01L23/528
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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公开(公告)号:US11723218B2
公开(公告)日:2023-08-08
申请号:US17216162
申请日:2021-03-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shy-Jay Lin , Chien-Min Lee , Hiroki Noguchi , Mingyuan Song , Yen-Lin Huang , William Joseph Gallagher
IPC: H01L21/00 , H10B61/00 , H01L23/528 , H01L21/768 , H01L21/8234
CPC classification number: H10B61/22 , H01L21/76898 , H01L21/823475 , H01L23/528
Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.
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公开(公告)号:US11706999B2
公开(公告)日:2023-07-18
申请号:US17369484
申请日:2021-07-07
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Min Lee , Shy-Jay Lin , Yen-Lin Huang , MingYuan Song , Tung Ying Lee
CPC classification number: H01L43/04 , H01L27/228 , H01L43/10 , H01L43/14
Abstract: Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.
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公开(公告)号:US20220223785A1
公开(公告)日:2022-07-14
申请号:US17369484
申请日:2021-07-07
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Min Lee , Shy-Jay Lin , Yen-Lin Huang , MingYuan Song , Tung Ying Lee
Abstract: Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.
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