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公开(公告)号：US20240361527A1
公开(公告)日：2024-10-31
申请号：US18767949
申请日：2024-07-09
发明人： Feng-Wei Kuo , Wen-Shiang Liao
CPC分类号： G02B6/124 , G02B6/13 , G02B2006/12107
摘要： An integrated optical device includes a substrate, a waveguide structure and a grating structure. The substrate has a waveguide region and a grating region adjacent to each other. The waveguide structure is disposed on the substrate in the waveguide region. The grating structure is disposed on the substrate in the grating region. In some embodiments, the grating structure includes grating bars and grating intervals arranged alternately, and widths of the grating bars of the grating structure are varied.
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公开(公告)号：US12132074B2
公开(公告)日：2024-10-29
申请号：US18306222
申请日：2023-04-24
发明人： Wen-Shiang Liao , Chih-Hang Tung
IPC分类号： H01L23/495 , H01F27/24 , H01F27/28 , H01F41/04 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/00 , H01L23/31 , H01L23/498 , H01L49/02
CPC分类号： H01L28/10 , H01F27/24 , H01F27/2804 , H01F41/041 , H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L23/49838 , H01L24/19 , H01L24/20 , H01L24/97 , H01F2027/2809 , H01L2224/211 , H01L2224/221 , H01L2224/95001 , H01L2924/1427 , H01L2924/19042
摘要： A package includes a first redistribution structure, a second redistribution structure, an inductor, a permalloy core, and a die. The second redistribution structure is over the first redistribution structure. The inductor includes a first portion, a second portion, and a third portion. The first portion is embedded in the first redistribution structure, the third portion is embedded in the second redistribution structure, and the second portion connects the first and third portions of the inductor. The permalloy core is located between the first and third portions of the inductor. The die is disposed adjacent to the second portion of the inductor.
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公开(公告)号：US11978697B2
公开(公告)日：2024-05-07
申请号：US17575654
申请日：2022-01-14
发明人： Wen-Shiang Liao
IPC分类号： H01L23/498 , H01L23/31 , H01L23/58 , H01Q1/22 , H01Q9/04
CPC分类号： H01L23/49822 , H01L23/3107 , H01L23/585 , H01Q1/2283 , H01Q9/0414
摘要： A package structure including a first radio frequency die, a second radio frequency die, an insulating encapsulant, a redistribution circuit structure, a first oscillation cavity and a second oscillation cavity is provided. A first frequency range of the first radio frequency die is different from a second frequency range of the second radio frequency die. The insulating encapsulant laterally encapsulates the first radio frequency die and the second radio frequency die. The redistribution circuit structure is disposed on the first radio frequency die, the second die and the insulating encapsulant. The first oscillation cavity is electrically connected to the first radio frequency die, and the second oscillation cavity is electrically connected to the second radio frequency die.
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公开(公告)号：US20230341624A1
公开(公告)日：2023-10-26
申请号：US17725558
申请日：2022-04-21
发明人： Feng-Wei Kuo , Wen-Shiang Liao
CPC分类号： G02B6/124 , G02B6/13 , G02B2006/12107
摘要： An integrated optical device includes a substrate, a waveguide structure and a grating structure. The substrate has a waveguide region and a grating region adjacent to each other. The waveguide structure is disposed on the substrate in the waveguide region. The grating structure is disposed on the substrate in the grating region. In some embodiments, the grating structure includes grating bars and grating intervals arranged alternately, and widths of the grating bars of the grating structure are varied.
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公开(公告)号：US20230230970A1
公开(公告)日：2023-07-20
申请号：US17578469
申请日：2022-01-19
发明人： Wen-Shiang Liao
CPC分类号： H01L25/18 , H01L28/40 , H01L23/481 , H01L24/80 , H01L2224/80895 , H01L2224/80896
摘要： A package having a capacitor structure and a method of forming the same are provided. The package includes a first die; a second die bonded onto the first die; an isolation region disposed on the first die and laterally encapsulating the second die; at least one first through-via disposed aside the second die and penetrating through the isolation region; an electrode layer disposed on the at least one first through-via; and a capacitor dielectric layer disposed between the at least one first through-via and the electrode layer to separate the at least one first through-via from the electrode layer, wherein the at least one first through-via, the capacitor dielectric layer, and the electrode layer constitute a capacitor structure.
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公开(公告)号：US20230015634A1
公开(公告)日：2023-01-19
申请号：US17575654
申请日：2022-01-14
发明人： Wen-Shiang Liao
IPC分类号： H01L23/498 , H01L23/31 , H01L23/58 , H01Q1/22 , H01Q9/04
摘要： A package structure including a first radio frequency die, a second radio frequency die, an insulating encapsulant, a redistribution circuit structure, a first oscillation cavity and a second oscillation cavity is provided. A first frequency range of the first radio frequency die is different from a second frequency range of the second radio frequency die. The insulating encapsulant laterally encapsulates the first radio frequency die and the second radio frequency die. The redistribution circuit structure is disposed on the first radio frequency die, the second die and the insulating encapsulant. The first oscillation cavity is electrically connected to the first radio frequency die, and the second oscillation cavity is electrically connected to the second radio frequency die.
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公开(公告)号：US20220342155A1
公开(公告)日：2022-10-27
申请号：US17862382
申请日：2022-07-11
发明人： Feng-Wei Kuo , Wen-Shiang Liao
摘要： A semiconductor structure including a semiconductor substrate, a first patterned dielectric layer, a grating coupler and a waveguide is provided. The semiconductor substrate includes an optical reflective layer. The first patterned dielectric layer is disposed on the semiconductor substrate and covers a portion of the optical reflective layer. The grating coupler and the waveguide are disposed on the first patterned dielectric layer, wherein the grating coupler and the waveguide are located over the optical reflective layer.
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公开(公告)号：US11380632B2
公开(公告)日：2022-07-05
申请号：US15964881
申请日：2018-04-27
发明人： Wen-Shiang Liao , Huan-Neng Chen
IPC分类号： H01L23/64 , H01L25/065 , H01L23/498 , H01L21/48 , H01L25/00 , H01F27/28 , H01F27/24
摘要： A semiconductor device includes a semiconductor substrate and an interconnect structure over the semiconductor substrate. The interconnect structure includes a magnetic core and a conductive coil winding around the magnetic core and electrically insulated from the magnetic core. The conductive coil includes horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the conductive lines.
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公开(公告)号：US20220113473A1
公开(公告)日：2022-04-14
申请号：US17069879
申请日：2020-10-14
摘要： Disclosed are apparatuses for optical coupling and a system for communication. In one embodiment, an apparatus for optical coupling including a substrate and a grating coupler is disclosed. The grating coupler is disposed on the substrate and includes a plurality of coupling gratings arranged along a first direction, wherein effective refractive indices of the plurality of coupling gratings gradually decrease along the first direction.
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公开(公告)号：US10665554B2
公开(公告)日：2020-05-26
申请号：US15842661
申请日：2017-12-14
发明人： Wen-Shiang Liao , Huan-Neng Chen
IPC分类号： H01L23/00 , H01L23/522 , H01L23/66 , H01L23/31 , H01L23/528 , H01L23/552 , H01L23/64 , H01L23/532 , H01L41/12 , H01L25/18 , H01L23/498 , H01L23/538 , H01L23/367 , H01L23/42
摘要： A semiconductor device is disclosed. The semiconductor device includes a first die on a first substrate, a second die on a second substrate separate from the first substrate, a transmission line in a redistribution layer on a wafer, and a magnetic structure surrounds the transmission line. The first transmission line electrically connects the first die and the second die. The magnetic structure is configured to increase the characteristic impedance of the transmission line, which can save the current and power consumption of a current mirror and amplifier in a 3D IC chip-on-wafer-on-substrate (CoWoS) semiconductor package.
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