摘要:
In a distance measurement device of an embodiment, a light source emits modulation light in a first charge transfer cycle, and emission of the modulation light of the light source is stopped in a second charge transfer cycle. In each of the first and second charge transfer cycles, the charges generated in a photosensitive region are distributed to a first accumulation region and a second accumulation region. A first value is obtained based on readout values corresponding to amounts of accumulated charges of the first accumulation region. A second value is obtained based on readout values corresponding to amounts of accumulated charges of the second accumulation region. A distance is calculated based on the first value and the second value.
摘要:
Two charge quantities (Q1,Q2) are output from respective pixels P (m,n) of the back-illuminated distance measuring sensor 1 as signals d′(m,n) having the distance information. Since the respective pixels P (m,n) output signals d′(m,n) responsive to the distance to an object H as micro distance measuring sensors, a distance image of the object can be obtained as an aggregate of distance information to respective points on the object H if reflection light from the object H is imaged on the pickup area 1B. If carriers generated at a deep portion in the semiconductor in response to incidence of near-infrared light for projection are led in a potential well provided in the vicinity of the carrier-generated position opposed to the light incident surface side, high-speed and accurate distance measurement is enabled.
摘要:
A range image sensor 1 is provided with a semiconductor substrate 1A having a light incident surface 1BK and a surface 1FT opposite to the light incident surface 1BK, a photogate electrode PG, first and second gate electrodes TX1, TX2, first and second semiconductor regions FD1, FD2, and a third semiconductor region SR1. The photogate electrode PG is provided on the surface 1FT. The first and second gate electrodes TX1, TX2 are provided next to the photogate electrode PG The first and second semiconductor regions FD1, FD2 accumulate respective charges flowing into regions immediately below the respective gate electrodes TX1, TX2. The third semiconductor region SR1 is located away from the first and second semiconductor regions FD1, FD2 and on the light incident surface 1BK side and has the conductivity type opposite to that of the first and second semiconductor regions FD1, FD2.
摘要:
A semiconductor light detecting element is provided with a silicon substrate having a semiconductor layer, and an epitaxial semiconductor layer grown on the semiconductor layer and having a lower impurity concentration than the semiconductor layer; and conductors provided on a surface of the epitaxial semiconductor layer. A photosensitive region is formed in the epitaxial semiconductor layer. Irregular asperity is formed at least in a surface opposed to the photosensitive region in the semiconductor layer. The irregular asperity is optically exposed.
摘要:
Two charge quantities (Q1,Q2) are output from respective pixels P (m,n) of the back-illuminated distance measuring sensor 1 as signals d′(m,n) having the distance information. Since the respective pixels P (m,n) output signals d′(m,n) responsive to the distance to an object H as micro distance measuring sensors, a distance image of the object can be obtained as an aggregate of distance information to respective points on the object H if reflection light from the object H is imaged on the pickup area 1B. If carriers generated at a deep portion in the semiconductor in response to incidence of near-infrared light for projection are led in a potential well provided in the vicinity of the carrier-generated position opposed to the light incident surface side, high-speed and accurate distance measurement is enabled.
摘要:
A photogate electrode PG has first and second sides opposed to each other. First and second semiconductor regions FD1, FD2 are arranged as spatially separated from each other on the side where the first side of the photogate electrode PG exists and along the first side. Third and fourth semiconductor regions FD3, FD4 are arranged as spatially separated from each other on the side where the second side of the photogate electrode PG exists and along the second side. First gate electrodes TX1 are provided between the photogate electrode PG and the first and third semiconductor regions FD1, FD3. Second gate electrodes TX2 are provided between the photogate electrode PG and the second and fourth semiconductor regions FD2, FD4. The first to fourth semiconductor regions FD1-FD4 are formed so as to overlap with respective p-type well regions W1-W4 and so as to be surrounded by the respective well regions W1-W4.
摘要:
Two charge quantities (Q1,Q2) are output from respective pixels P (m,n) of the back-illuminated distance measuring sensor 1 as signals d′(m,n) having the distance information. Since the respective pixels P (m,n) output signals d′(m,n) responsive to the distance to an object H as micro distance measuring sensors, a distance image of the object can be obtained as an aggregate of distance information to respective points on the object H if reflection light from the object H is imaged on the pickup area 1B. If carriers generated at a deep portion in the semiconductor in response to incidence of near-infrared light for projection are led in a potential well provided in the vicinity of the carrier-generated position opposed to the light incident surface side, high-speed and accurate distance measurement is enabled.
摘要:
A range image sensor capable of improving its aperture ratio and yielding a range image with a favorable S/N ratio is provided. A range image sensor RS has an imaging region constituted by a plurality of one-dimensionally arranged units on a semiconductor substrate 1 and yields a range image according to a charge amount issued from the units. One unit comprises a photoresponsive region; two pairs of third semiconductor regions 9a, 9b opposing each other while interposing a photogate electrode PG in the opposing direction of first and second longer sides L1, L2; first and second transfer electrodes TX1, TX2 disposed between the third semiconductor regions 9a, 9b and the photogate electrode PG; fourth semiconductor regions 11a, 11b arranged between the third semiconductor regions 9a, 9b such as to oppose each other while interposing the photogate electrode PG in the opposing direction of the first and second longer sides L1, L2; and third transfer electrodes TX3 disposed between the fourth semiconductor regions 11a, 11b and the photogate electrode PG.
摘要:
A range image sensor RS is provided with an imaging region consisting of a plurality of units arranged in a two-dimensional pattern, on a semiconductor substrate 1 and obtains a range image, based on charge quantities output from the units. One unit is provided with a photosensitive region, a plurality of third semiconductor regions 9a, 9b opposed to each other with a photogate electrode PG in between in a direction in which first and second long sides L1, L2 are opposed to each other, first and second transfer electrodes TX1, TX2 provided between the plurality of third semiconductor regions 9a, 9b and the photogate electrode PG, a plurality of fourth semiconductor regions 11a, 11b arranged with the third semiconductor regions 9a, 9b in between in the direction in which the first and second long sides L1, L2 are opposed to each other, and a plurality of third transfer electrodes TX3 provided respectively between the plurality of fourth semiconductor regions 11a, 11b and the photogate electrode PG.
摘要:
The range image sensor is a range image sensor which is provided on a semiconductor substrate with an imaging region composed of a plurality of two-dimensionally arranged units (pixel P), thereby obtaining a range image on the basis of charge quantities QL, QR output from the units. One of the units is provided with a charge generating region (region outside a transfer electrode 5) where charges are generated in response to incident light, at least two semiconductor regions 3 which are arranged spatially apart to collect charges from the charge generating region, and a transfer electrode 5 which is installed at each periphery of the semiconductor region 3, given a charge transfer signal different in phase, and surrounding the semiconductor region 3.