公开(公告)号：US20240222085A1

公开(公告)日：2024-07-04

申请号：US18605902

申请日：2024-03-15

Applicant: Tokyo Electron Limited

Inventor： Koichiro NAKAMURA ,  Norihisa KIYOFUJI

IPC: H01J37/32

CPC classification number: H01J37/32311 ,  H01J37/32201 ,  H01J37/3222 ,  H01J37/32449 ,  H01J37/32715 ,  H01J37/32174 ,  H01J37/32238 ,  H01J2237/327 ,  H01J2237/335

Abstract: A plasma processing method is implementable with a plasma processing apparatus. The plasma processing method includes applying a voltage to a lower electrode in a substrate support with a gas being supplied into a chamber in the plasma processing apparatus. The substrate support is located in the chamber. The plasma processing method further includes generating plasma by providing a radio-frequency wave after application of the voltage to the lower electrode is started. In the method, the applying of the voltage and the generating of the plasma are performed without an object on a substrate support surface of the substrate support.

公开(公告)号：US20170229332A1

公开(公告)日：2017-08-10

申请号：US15501235

申请日：2015-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryo MIYAMA ,  Naoto WATANABE ,  Koichiro NAKAMURA

IPC: H01L21/67 ,  H05H1/46 ,  H05H1/00 ,  H01L21/66 ,  H01L21/3065

CPC classification number: H01J37/32972 ,  H01J37/32935

Abstract: A method and apparatus for determining a stability of plasma in a plasma processing apparatus for performing a plasma processing by converting into plasma a processing gas supplied into a processing container. The method includes: detecting a light emission intensity of the plasma in the processing container while the plasma is generated in the processing container; generating a first function representing a relationship between time and the light emission intensity from a detection result of the light emission intensity; differentiating the first function with time to calculate a differential value, and generating a second function from a relationship between an absolute value of the differential value and time; and integrating the second function with time to calculate an integral value, and determining a stability of the plasma based on the calculated integral value. A related apparatus is also provided.

公开(公告)号：US20230315047A1

公开(公告)日：2023-10-05

申请号：US17710362

申请日：2022-03-31

Applicant: Tokyo Electron Limited

Inventor： Jun SHINAGAWA ,  Brian PFEIFER ,  John SOLIS ,  Brian GESSLER ,  Koichiro NAKAMURA ,  Yutaka HIROOKA

IPC: G05B19/4099

CPC classification number: G05B19/4099 ,  G05B2219/45031

Abstract: A method for detecting an endpoint of a seasoning process for a plasma tool includes (a) operating the plasma tool to run a seasoning recipe on at least one seasoning wafer before running a monitoring recipe on at least one monitoring wafer; (b) collecting, while running the monitoring recipe on the monitoring wafer, monitoring data associated with the running the monitoring recipe; and (c) generating an estimated product parameter using a virtual metrology (VM) model that is configured to estimate a product parameter using the monitoring data. The VM model is based on production data associated with running a production recipe on production wafers and product parameters of the production wafers measured after the running the production recipe. The endpoint of the seasoning process is obtained by repeating (a), (b) and (c), and the endpoint is obtained when the estimated product parameter stabilizes.