公开(公告)号：US20230417797A1

公开(公告)日：2023-12-28

申请号：US18459132

申请日：2023-08-31

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Natsumi HAYASHI ,  Hideki MORII ,  Tetsuo YOSHIDA ,  Toshiyuki KIMURA

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06711 ,  G01R1/07314

Abstract: The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.

公开(公告)号：US20170322236A1

公开(公告)日：2017-11-09

申请号：US15524925

申请日：2014-11-26

Applicant: TOKYO SEIMITSU CO., LTD

Inventor： Yuichi OZAWA ,  Yasuhito IGUCHI ,  Tetsuo YOSHIDA ,  Junzo KOSHIO

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07378 ,  G01R31/2889

Abstract: A wafer inspection method whereby inspection accuracy and operation efficiency is improved. A method for performing electrical inspection by bringing, at one time, a plurality of probes into contact with a plurality of pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads of the chips; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads for the purpose of recognizing the positional shifts of the pads due to thermal expansion when the wafer chuck is heated; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.

公开(公告)号：US20240094254A1

公开(公告)日：2024-03-21

申请号：US18527013

申请日：2023-12-01

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Tetsuo YOSHIDA ,  Shunsuke OTAKE ,  Tatsuya MATSUOKA

IPC: G01R1/073 ,  G01R1/067 ,  H01L21/67 ,  H01L21/687

CPC classification number: G01R1/07307 ,  G01R1/0675 ,  H01L21/67248 ,  H01L21/68707

Abstract: A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.