Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
    1.
    发明授权
    Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part 有权
    感光树脂组合物,用于制造图案化硬化膜的方法和电子部件

    公开(公告)号:US08298747B2

    公开(公告)日:2012-10-30

    申请号:US12531055

    申请日:2008-03-06

    摘要: To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

    摘要翻译: 为了提供一种感光树脂组合物,其中由感光性树脂组合物获得的硬化膜具有与在高温下硬化的膜相当的性能,使用该感光性树脂组合物制造图案化硬化膜的方法和电子部件。 感光性树脂组合物包含(a)具有由通式(I)表示的重复单元的聚苯并恶唑前体:其中U和V表示二价有机基团,U和V中的至少一个是含有脂族链结构的基团 具有1至30个碳原子; (b)光敏剂; (c)溶剂; 和(d)能够通过加热引起交联或聚合的交联剂。

    PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART
    2.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART 有权
    光敏树脂组合物,其使用方法和电子部件生产图案硬化膜的工艺

    公开(公告)号:US20100092879A1

    公开(公告)日:2010-04-15

    申请号:US12531055

    申请日:2008-03-06

    IPC分类号: G03F7/004 G03F7/20

    摘要: To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

    摘要翻译: 为了提供一种感光树脂组合物,其中由感光性树脂组合物获得的硬化膜具有与在高温下硬化的膜相当的性能,使用该感光性树脂组合物制造图案化硬化膜的方法和电子部件。 感光性树脂组合物包含(a)具有由通式(I)表示的重复单元的聚苯并恶唑前体:其中U和V表示二价有机基团,U和V中的至少一个是含有脂族链结构的基团 具有1至30个碳原子; (b)光敏剂; (c)溶剂; 和(d)能够通过加热引起交联或聚合的交联剂。