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    PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART
    3.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART 有权
    光敏树脂组合物，其使用方法和电子部件生产图案硬化膜的工艺

    公开(公告)号：US20100092879A1

    公开(公告)日：2010-04-15

    申请号：US12531055

    申请日：2008-03-06

    申请人： Tomonori Minegishi ,  Rika Nogita ,  Kenichi Iwashita

    发明人： Tomonori Minegishi ,  Rika Nogita ,  Kenichi Iwashita

    IPC分类号： G03F7/004 ,  G03F7/20

    CPC分类号： H01L21/02118 ,  C08G69/26 ,  C08G69/28 ,  C08G73/22 ,  C08L77/06 ,  C08L79/04 ,  G03F7/0233 ,  H01L21/02282 ,  H01L21/312

    摘要： To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

    摘要翻译： 为了提供一种感光树脂组合物，其中由感光性树脂组合物获得的硬化膜具有与在高温下硬化的膜相当的性能，使用该感光性树脂组合物制造图案化硬化膜的方法和电子部件。 感光性树脂组合物包含（a）具有由通式（I）表示的重复单元的聚苯并恶唑前体：其中U和V表示二价有机基团，U和V中的至少一个是含有脂族链结构的基团 具有1至30个碳原子; （b）光敏剂; （c）溶剂; 和（d）能够通过加热引起交联或聚合的交联剂。

    Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
    4.
    发明授权
    Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part 有权
    感光树脂组合物，用于制造图案化硬化膜的方法和电子部件

    公开(公告)号：US08298747B2

    公开(公告)日：2012-10-30

    申请号：US12531055

    申请日：2008-03-06

    申请人： Tomonori Minegishi ,  Rika Nogita ,  Kenichi Iwashita

    发明人： Tomonori Minegishi ,  Rika Nogita ,  Kenichi Iwashita

    IPC分类号： G03F7/00 ,  G03F7/004 ,  G03F7/027 ,  G03F7/028 ,  G03F7/40

    CPC分类号： H01L21/02118 ,  C08G69/26 ,  C08G69/28 ,  C08G73/22 ,  C08L77/06 ,  C08L79/04 ,  G03F7/0233 ,  H01L21/02282 ,  H01L21/312

    摘要： To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

    摘要翻译： 为了提供一种感光树脂组合物，其中由感光性树脂组合物获得的硬化膜具有与在高温下硬化的膜相当的性能，使用该感光性树脂组合物制造图案化硬化膜的方法和电子部件。 感光性树脂组合物包含（a）具有由通式（I）表示的重复单元的聚苯并恶唑前体：其中U和V表示二价有机基团，U和V中的至少一个是含有脂族链结构的基团 具有1至30个碳原子; （b）光敏剂; （c）溶剂; 和（d）能够通过加热引起交联或聚合的交联剂。

    Positive photosensitive resin composition, method for forming pattern, electronic component
    7.
    发明授权
    Positive photosensitive resin composition, method for forming pattern, electronic component 有权
    正型感光性树脂组合物，形成图案的方法，电子部件

    公开(公告)号：US08420291B2

    公开(公告)日：2013-04-16

    申请号：US12739127

    申请日：2008-10-29

    申请人： Tomonori Minegishi ,  Tomoko Kawamura ,  Masayuki Ohe ,  Yuki Nakamura

    发明人： Tomonori Minegishi ,  Tomoko Kawamura ,  Masayuki Ohe ,  Yuki Nakamura

    IPC分类号： H05K1/00 ,  G03F7/20

    CPC分类号： H01L21/0274 ,  C08G73/22 ,  C08L79/04 ,  G03F7/0233 ,  G03F7/0757 ,  G03F7/40

    摘要： Provided are a positive photosensitive resin composition that is developable in an alkaline aqueous solution and gives a good shaped pattern that is excellent in heat resistance and mechanical property, a method for producing the pattern and an electronic component. The positive photosensitive resin composition contains (a) polybenzoxazole or a polybenzoxazole precursor polymer having a structural unit represented by either a general formula (1) or (2) and satisfying conditions (i) and/or (ii), (b) a compound that generates an acid by being irradiated with active light ray and (c) a compound having a structure represented by a general formula (3) crosslinkable or polymerizable with said component (a).

    摘要翻译： 提供一种可在碱性水溶液中显影的正型感光性树脂组合物，并且具有耐热性和机械性能优异的良好成型图案，该图案的制造方法和电子部件。 正型感光性树脂组合物含有（a）聚苯并恶唑或具有由通式（1）或（2）表示的结构单元并满足条件（i）和/或（ii），（b）的化合物的聚苯并恶唑前体聚合物， 其通过用活性光线照射产生酸，和（c）具有与所述组分（a）可交联或可聚合的由通式（3）表示的结构的化合物。

    NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS
    8.
    发明申请
    NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS 审中-公开
    负型型感光树脂组合物，形成图案的方法和电子部件

    公开(公告)号：US20100159217A1

    公开(公告)日：2010-06-24

    申请号：US12305668

    申请日：2006-06-20

    申请人： Tomonori Minegishi

    发明人： Tomonori Minegishi

    IPC分类号： B32B3/10 ,  G03F7/004 ,  G03F7/20

    CPC分类号： G03F7/0382 ,  C08L79/08 ,  G03F7/40 ,  H01L21/3122 ,  H01L21/3127 ,  Y10T428/24802 ,  Y10T428/24851

    摘要： A heat resistant negative-type photosensitive resin composition which is good in sensitivity and resolution, a method for producing a pattern capable of obtaining the pattern which is excellent in sensitivity, resolution and heat resistance and has a good shape, and a highly reliable electronic part having the pattern having a good shape and property are provided. A crosslinking agent capable of crosslinking or polymerizing by an action of an acid includes a compound having at least one methylol group or alkoxyalkyl group in a molecule, in the negative-type photosensitive resin composition.

    摘要翻译： 具有良好的灵敏度和分辨率的耐热性负型感光性树脂组合物，能够获得灵敏度，分辨率和耐热性优异且形状良好的图案的图案的制造方法以及高可靠性的电子部件 提供具有良好形状和特性的图案。 在负型感光性树脂组合物中，能够通过酸的作用而交联或聚合的交联剂包括分子中具有至少一个羟甲基或烷氧基烷基的化合物。