-
公开(公告)号：US20120161147A1
公开(公告)日：2012-06-28
申请号：US13307513
申请日：2011-11-30
申请人： Viorel Georgel DUMITRU , Mihai Brezeanu , Stefan Dan Costea , Ion Georgescu , Viorel Avramescu , Bogdan-Catalin Serban
发明人： Viorel Georgel DUMITRU , Mihai Brezeanu , Stefan Dan Costea , Ion Georgescu , Viorel Avramescu , Bogdan-Catalin Serban
CPC分类号： G01L1/18 , G01L1/005 , G01L9/0051 , G01L9/0098
摘要： An example sensor that includes a first Schottky diode, a second Schottky diode and an integrated circuit. The sensor further includes a voltage generator that generates a first voltage across the first Schottky diode and a second voltage across the second Schottky diode. When the first Schottky diode and the second Schottky diode are subjected to different strain, the integrated circuit measures the values of the currents flowing through the first Schottky diode and the second Schottky diode to determine the strain on an element where the first Schottky diode and the second Schottky diode are attached.
摘要翻译： 包括第一肖特基二极管，第二肖特基二极管和集成电路的示例传感器。 传感器还包括产生第一肖特基二极管两端的第一电压和跨越第二肖特基二极管的第二电压的电压发生器。 当第一肖特基二极管和第二肖特基二极管受到不同的应变时，集成电路测量流过第一肖特基二极管和第二肖特基二极管的电流的值，以确定第一肖特基二极管和第二肖特基二极管的元件上的应变 连接第二肖特基二极管。
-
公开(公告)号：US08546817B2
公开(公告)日：2013-10-01
申请号：US13307513
申请日：2011-11-30
申请人： Viorel Georgel Dumitru , Mihai Brezeanu , Stefan Dan Costea , Ion Georgescu , Viorel Avramescu , Bogdan Catalin Serban
发明人： Viorel Georgel Dumitru , Mihai Brezeanu , Stefan Dan Costea , Ion Georgescu , Viorel Avramescu , Bogdan Catalin Serban
CPC分类号： G01L1/18 , G01L1/005 , G01L9/0051 , G01L9/0098
摘要： An example sensor that includes a first Schottky diode, a second Schottky diode and an integrated circuit. The sensor further includes a voltage generator that generates a first voltage across the first Schottky diode and a second voltage across the second Schottky diode. When the first Schottky diode and the second Schottky diode are subjected to different strain, the integrated circuit measures the values of the currents flowing through the first Schottky diode and the second Schottky diode to determine the strain on an element where the first Schottky diode and the second Schottky diode are attached.
摘要翻译： 包括第一肖特基二极管，第二肖特基二极管和集成电路的示例传感器。 传感器还包括产生第一肖特基二极管两端的第一电压和跨越第二肖特基二极管的第二电压的电压发生器。 当第一肖特基二极管和第二肖特基二极管受到不同的应变时，集成电路测量流过第一肖特基二极管和第二肖特基二极管的电流的值，以确定第一肖特基二极管和第二肖特基二极管的元件上的应变 连接第二肖特基二极管。
-
公开(公告)号：US20150022491A1
公开(公告)日：2015-01-22
申请号：US14333193
申请日：2014-07-16
申请人： Viorel Georgel Dumitru , Stefan Dan Costea , Ion Georgescu , Mihai Brezeanu , Bogdan-Catalin Serban
发明人： Viorel Georgel Dumitru , Stefan Dan Costea , Ion Georgescu , Mihai Brezeanu , Bogdan-Catalin Serban
IPC分类号： G06F3/041
CPC分类号： G06F3/0412 , G06F3/03545 , G06F3/0414 , G06F3/044 , G06F2203/04106
摘要： The present disclosure relates to a touch sensor and touch sensitive display having a plurality of first and second conductive lines arranged substantially orthogonally with a sensing material to sense a change in capacitance between them. The first and second conductive lines and the sensing material defining an array of sensitive transistors.
摘要翻译： 本公开涉及一种触摸传感器和触敏显示器，其具有基本上与感测材料正交布置的多个第一和第二导线，以感测它们之间的电容变化。 第一和第二导线和感测材料限定敏感晶体管阵列。
-
公开(公告)号：US20090193903A1
公开(公告)日：2009-08-06
申请号：US12362741
申请日：2009-01-30
CPC分类号： G01L9/0025 , B60C23/0408 , C03C27/00 , H01L41/1132 , H01L41/331 , Y10T29/42
摘要： A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.
摘要翻译： 一种方法包括在第一晶片中形成多个沟槽，在第二晶片的第一表面上形成传感器结构，以及结合第一晶片和第二晶片。 该方法还包括蚀刻第二晶片的第二表面以在第二晶片中形成传感器膜片。 该方法还包括通过在与沟槽相关联的第一晶片的多个区域中切割第一晶片来去除第一晶片的一部分。 传感器包括在基板的第一表面上的基板和表面声波（SAW）谐振器。 传感器还包括电耦合到SAW谐振器的接合焊盘和形成在衬底的第二表面中的凹口。 传感器还包括通过间隔件与衬底的第一表面分离的盖。 SAW谐振器位于盖和基板之间。
-
公开(公告)号：US07891252B2
公开(公告)日：2011-02-22
申请号：US12362741
申请日：2009-01-30
IPC分类号： G01L7/00
CPC分类号： G01L9/0025 , B60C23/0408 , C03C27/00 , H01L41/1132 , H01L41/331 , Y10T29/42
摘要： A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.
摘要翻译： 一种方法包括在第一晶片中形成多个沟槽，在第二晶片的第一表面上形成传感器结构，以及结合第一晶片和第二晶片。 该方法还包括蚀刻第二晶片的第二表面以在第二晶片中形成传感器膜片。 该方法还包括通过在与沟槽相关联的第一晶片的多个区域中切割第一晶片来去除第一晶片的一部分。 传感器包括在基板的第一表面上的基板和表面声波（SAW）谐振器。 传感器还包括电耦合到SAW谐振器的接合焊盘和形成在衬底的第二表面中的凹口。 传感器还包括通过间隔件与衬底的第一表面分离的盖。 SAW谐振器位于盖和基板之间。
-
公开(公告)号：US20090267761A1
公开(公告)日：2009-10-29
申请号：US12110948
申请日：2008-04-28
IPC分类号： G08B21/00
CPC分类号： G06K19/0672 , B65D2203/10 , G01N29/043 , G01N29/2481 , G01N2291/0258 , G06K19/0675 , G06K19/0723 , G06K19/07798 , H03H9/6406
摘要： An intelligent packaging system utilizing acoustic wave devices includes an electronic module, a SAW ID, various passive SAW sensors and a printed antenna. The passive SAW sensors include a SAW pressure sensor, a SAW temperature sensor and one or more SAW chemical sensors for monitoring physical parameters of a package content. The electronic module generally includes a printed large area distributed electrical circuit, an impedance transformer and a SAW transponder for realizing passive wireless monitoring of the structural integrity of the package. A separate power harvesting antenna and/or a separate dual band antenna can generate radio frequency (RF) power for biasing components associated with the electronic module.
摘要翻译： 使用声波器件的智能封装系统包括电子模块，SAW ID，各种被动SAW传感器和印刷天线。 无源SAW传感器包括SAW压力传感器，SAW温度传感器和用于监测封装内容物理参数的一个或多个SAW化学传感器。 电子模块通常包括印刷的大面积分布式电路，阻抗变换器和SAW应答器，用于实现对封装的结构完整性的被动无线监测。 单独的功率收集天线和/或单独的双频带天线可以产生用于偏置与电子模块相关联的组件的射频（RF）功率。
-
公开(公告)号：US20080001741A1
公开(公告)日：2008-01-03
申请号：US11477257
申请日：2006-06-29
CPC分类号： G08B13/128 , B60R25/1004 , G08B13/1454
摘要： A wireless monitoring system and method. A distributed electrical circuit can be printed on a dielectric film for wrapping pallets or containers in a logistic chain, wherein the distributed electrical circuit (e.g., a Wheatstone Bridge) detects a rupture of the film through an electrical resistance change of one or more elements of the distributed electrical circuit. The electrical resistance change is indicative of a potential tampering event. An electronic module can be provided that conditions and processes a signal transmitted from the distributed electrical circuit and thereafter transmits the signal wirelessly via an antenna to a monitoring station. Additionally, a monitoring station can be implemented, which communicates with a network and the electronic module, and permits a user in real time to receive data concerning the potential tampering event.
摘要翻译： 一种无线监控系统及方法。 分布式电路可以印刷在用于将托盘或容器包裹在逻辑链中的电介质膜上，其中分布式电路（例如，惠斯通电桥）通过一个或多个元件的电阻变化来检测膜的破裂 分布式电路。 电阻变化表示潜在的篡改事件。 可以提供一种电子模块，其对从分布式电路发送的信号进行调节和处理，然后经由天线将信号无线发送到监控站。 此外，可以实现与网络和电子模块进行通信并且允许用户实时地接收关于潜在篡改事件的数据的监控站。
-
公开(公告)号：US07927906B2
公开(公告)日：2011-04-19
申请号：US12025517
申请日：2008-02-04
IPC分类号： H01L21/00
CPC分类号： G01L9/0098 , B81C1/00333 , B81C1/00873 , B81C2203/0118 , G01K1/08 , G01P1/023 , G01P15/0802 , G01P15/0891 , G01P15/124 , H01L23/10 , H01L29/513 , H01L29/515 , H01L29/78 , H01L2924/0002 , H01L2924/01079 , H01L2924/13091 , H01L2924/00
摘要： Apparatus, methods, and systems for bonding a cover wafer to a MEMS threshold sensors located on a silicon disc. The cover wafer is trenched to form a region when bonded to the silicon wafer that produces a gap over the contact bond pads of the MEMS threshold sensor. The method includes a series of cuts that remove part of the cover wafer over the trenches to permit additional cuts that may avoid the contact bond pads of the MEMS threshold sensor. In addition the glass frit provides for isolation of the sensor with a hermetic seal. The cavity between the MEMS threshold sensor and the cover wafer may be injected with a gas such as nitrogen to influence the properties of the MEMS threshold sensor. The MEMS threshold sensor may be utilized to sense a threshold for pressure, temperature or acceleration.
摘要翻译： 用于将覆盖晶片接合到位于硅盘上的MEMS阈值传感器的装置，方法和系统。 覆盖晶片被沟槽化以在与硅晶片接合时形成区域，该区域在MEMS阈值传感器的接触焊盘上产生间隙。 该方法包括一系列切口，其移除沟槽上的覆盖晶片的一部分以允许可避免MEMS阈值传感器的接触焊盘的额外切口。 此外，玻璃料提供具有气密密封的传感器的隔离。 MEMS阈值传感器和盖晶片之间的空腔可以注入诸如氮气的气体以影响MEMS阈值传感器的性质。 可以使用MEMS阈值传感器来感测压力，温度或加速度的阈值。
-
公开(公告)号：US07755489B2
公开(公告)日：2010-07-13
申请号：US12110948
申请日：2008-04-28
IPC分类号： G08B13/14
CPC分类号： G06K19/0672 , B65D2203/10 , G01N29/043 , G01N29/2481 , G01N2291/0258 , G06K19/0675 , G06K19/0723 , G06K19/07798 , H03H9/6406
摘要： An intelligent packaging system utilizing acoustic wave devices includes an electronic module, a SAW ID, various passive SAW sensors and a printed antenna. The passive SAW sensors include a SAW pressure sensor, a SAW temperature sensor and one or more SAW chemical sensors for monitoring physical parameters of a package content. The electronic module generally includes a printed large area distributed electrical circuit, an impedance transformer and a SAW transponder for realizing passive wireless monitoring of the structural integrity of the package. A separate power harvesting antenna and/or a separate dual band antenna can generate radio frequency (RF) power for biasing components associated with the electronic module.
摘要翻译： 使用声波器件的智能封装系统包括电子模块，SAW ID，各种被动SAW传感器和印刷天线。 无源SAW传感器包括SAW压力传感器，SAW温度传感器和用于监测封装内容物理参数的一个或多个SAW化学传感器。 电子模块通常包括印刷的大面积分布式电路，阻抗变换器和SAW应答器，用于实现对封装的结构完整性的被动无线监测。 单独的功率收集天线和/或单独的双频带天线可以产生用于偏置与电子模块相关联的组件的射频（RF）功率。
-
公开(公告)号：US07723961B2
公开(公告)日：2010-05-25
申请号：US11890570
申请日：2007-08-07
CPC分类号： H02J7/0031 , H02J2007/0037
摘要： A battery protection and monitoring system includes a plurality of MAFET (Mechanically Actuated Field Effect Transistor) switches, wherein each MAFET switch among the MAFET switches is capable of switching from an open switch condition to a closed switch condition or vice versa, such that the plurality of MAFET switches are connectable to a battery. Such a system further includes one or more transistors associated with and which communicate electrically with at least one MAFET switch among the MAFET switches. A PPTC (Polymeric Positive Temperature Coefficient) device is also associated with the transistors and the MAFET switches, such that the PPTC device, the MAFET switches and the transistors operate in association with one another and the open switch condition or the closed switch condition of the plurality of MAFET switches to identify, monitor and thus prevent at least one dangerous condition associated with the battery.
摘要翻译： 电池保护和监测系统包括多个MAFET（机械致动场效应晶体管）开关，其中MAFET开关中的每个MAFET开关能够从开路开关状态切换到闭合开关状态，反之亦然，使得多个 的MAFET开关可连接到电池。 这样的系统还包括与MAFET开关中的至少一个MAFET开关相关联并与其通信的一个或多个晶体管。 PPTC（聚合正温度系数）器件还与晶体管和MAFET开关相关联，使得PPTC器件，MAFET开关和晶体管彼此相关联地操作，并且开路开关条件或闭合开关条件 多个MAFET开关来识别，监控并因此防止与电池相关联的至少一个危险状况。
-
-
-
-
-
-
-
-
-
搜索结果
33 条记录 (耗时 0.026 秒)
