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公开(公告)号：US08178936B2
公开(公告)日：2012-05-15
申请号：US12927122
申请日：2010-11-08
Applicant: Wang Zhe , Chong Ser Choong
Inventor： Wang Zhe , Chong Ser Choong
CPC classification number: B81C1/00309 , B81B2201/0257 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81C1/00301 , H01L23/055 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/1134 , H01L2224/11901 , H01L2224/1308 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4824 , H01L2224/48599 , H01L2224/73207 , H01L2224/73265 , H01L2224/85444 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/07811 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/00 , H01L2224/05599
Abstract: The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate.
Abstract translation: MEMS封装具有其上安装有一个或多个换能器芯片的安装基板，其中安装基板具有开口。 顶盖通过间隔件附接到安装基板并与安装基板分离，间隔件形成由顶盖，间隔件和安装基板包围并由开口接近的壳体。 在一个或多个换能器芯片和安装基板之间和/或在一个或多个换能器芯片和顶盖之间形成电连接。 底盖可以安装在安装基板的底表面上，其中在安装基板和底盖之间形成中空室，其中底盖中的第二开口不与第一开口对准。 顶盖和底盖的外表面上的垫可以用于进一步连接到印刷电路板。 顶盖和底盖可以是折叠在安装基板下方的柔性印刷电路板。
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公开(公告)号：US20090218668A1
公开(公告)日：2009-09-03
申请号：US12072890
申请日：2008-02-28
Applicant: Wang Zhe , Chong Ser Choong
Inventor： Wang Zhe , Chong Ser Choong
CPC classification number: B81C1/00309 , B81B2201/0257 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81C1/00301 , H01L23/055 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/1134 , H01L2224/11901 , H01L2224/1308 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4824 , H01L2224/48599 , H01L2224/73207 , H01L2224/73265 , H01L2224/85444 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/07811 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/00 , H01L2224/05599
Abstract: The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate.
Abstract translation: MEMS封装具有其上安装有一个或多个换能器芯片的安装基板，其中安装基板具有开口。 顶盖通过间隔件附接到安装基板并与安装基板分离，间隔件形成由顶盖，间隔件和安装基板包围并由开口接近的壳体。 在一个或多个换能器芯片和安装基板之间和/或在一个或多个换能器芯片和顶盖之间形成电连接。 底盖可以安装在安装基板的底表面上，其中在安装基板和底盖之间形成中空室，其中底盖中的第二开口不与第一开口对准。 顶盖和底盖的外表面上的垫可以用于进一步连接到印刷电路板。 顶盖和底盖可以是折叠在安装基板下方的柔性印刷电路板。
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公开(公告)号：US08045734B2
公开(公告)日：2011-10-25
申请号：US12011519
申请日：2008-01-28
IPC: H04R25/00
CPC classification number: H04R31/003 , H04R19/005 , H04R19/04 , H04R25/00
Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with adjoining perforated plates on the front side of a conductive substrate. The diaphragm is aligned above a back hole in the substrate wherein the front opening of the back hole is smaller than the diaphragm. The diaphragm is supported by mechanical springs each having one end attached to the diaphragm and another end connected to a rigid pad anchored on a dielectric spacer. The diaphragm, perforated plates, and mechanical springs are preferably made of the same film and are suspended above an air gap that overlies the substrate. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. Different embodiments are shown that reduce parasitic capacitance.
Abstract translation: 公开了一种基于硅的麦克风传感元件及其制造方法。 麦克风感测元件具有在导电基板的正面上具有相邻多孔板的隔膜。 隔膜在衬底中的后孔上方对准，其中后孔的前开口小于隔膜。 隔膜由机械弹簧支撑，每个机械弹簧的一端连接到隔膜，另一端连接到锚定在介电隔离件上的刚性垫。 隔膜，多孔板和机械弹簧优选由相同的膜制成并且悬挂在覆盖在基底上的气隙之上。 第一电极形成在一个或多个刚性焊盘上，并且第二电极形成在衬底上的一个或多个位置处以建立可变电容器电路。 示出了减少寄生电容的不同实施例。
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公开(公告)号：US07346178B2
公开(公告)日：2008-03-18
申请号：US10977692
申请日：2004-10-29
IPC: H04R25/00
CPC classification number: H04R31/003 , H04R19/005 , H04R19/04 , H04R25/00
Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with a perforated plate adjoining each side or corner. The diaphragm is aligned above one or more back holes created in a conductive substrate wherein the back hole has a width less than that of the diaphragm. Perforated plates are suspended above an air gap that overlies the substrate. The diaphragm is supported by mechanical springs with two ends that are attached to the diaphragm at a corner, side, or center and terminate in a rigid pad anchored on a dielectric spacer layer. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. The microphone sensing element can be embodied in different approaches to reduce parasitic capacitance.
Abstract translation: 公开了一种基于硅的麦克风感测元件及其制造方法。 麦克风感测元件具有隔膜，其上具有邻接每个侧面或拐角的多孔板。 隔膜在导电基板中形成的一个或多个后孔上方对准，其中后孔的宽度小于隔膜的宽度。 穿孔板悬挂在衬底上方的气隙上方。 隔膜由机械弹簧支撑，其两端在角部，侧面或中心附接到隔膜，并终止于固定在介电隔离层上的刚性垫中。 第一电极形成在一个或多个刚性焊盘上，并且第二电极形成在衬底上的一个或多个位置处以建立可变电容器电路。 麦克风感测元件可以以不同的方式实现以减少寄生电容。
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公开(公告)号：US07329933B2
公开(公告)日：2008-02-12
申请号：US10977693
申请日：2004-10-29
IPC: H01L29/84
CPC classification number: H04R31/003 , H04R7/10 , H04R19/005 , H04R19/04 , H04R25/00
Abstract: A microphone sensing element and a method for making the same are disclosed. The sensing element has a diaphragm and an attached electrical lead-out arm preferably made of polysilicon that are separated by an air gap from an underlying backplate region created on a conductive silicon substrate. The backplate region has acoustic holes created by removing an oxide filling in a continuous trench that surrounds hole edges and by removing oxide to form the air gap. The diaphragm is softly constrained along its edge by an elastic element that connects to a surrounding rigid polysilicon layer. The elastic element is typically a polymer such as parylene having a Young's modulus substantially less than that of the diaphragm. First and second electrodes are connected to the diaphragm through the lead-out arm and to the substrate through polysilicon via fillings, respectively, and thereby establish a variable capacitor circuit for acoustic sensing.
Abstract translation: 公开了麦克风传感元件及其制造方法。 感测元件具有隔膜和优选由多晶硅制成的附接电引出臂，其由与在导电硅衬底上形成的下面的背板区域的气隙分开。 背板区域具有通过去除填充在围绕孔边缘的连续沟槽中的氧化物并通过去除氧化物以形成气隙而产生的声孔。 隔膜通过连接到周围的刚性多晶硅层的弹性元件沿其边缘被轻柔地约束。 弹性元件通常是聚合物，例如聚对二甲苯，其杨氏模量显着小于隔膜的杨氏模量。 第一和第二电极分别通过引出臂通过多晶硅通过引出臂连接到膜片，从而建立用于声学感测的可变电容器电路。
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Patent Agency Ranking
公开(公告)号：US08467559B2
公开(公告)日：2013-06-18
申请号：US12070575
申请日：2008-02-20
Applicant: Wang Zhe
Inventor： Wang Zhe
IPC: H04R9/08
CPC classification number: H04R19/005 , H01L2224/48091 , H04R7/04 , H04R7/20 , H04R19/04 , H04R31/00 , H04R2307/201 , H04R2307/207 , H01L2924/00014
Abstract: Various embodiments of a silicon microphone sensing element without dedicated backplate are disclosed. The microphone sensing element has a circular or polygonal diaphragm with a plurality of perforated springs suspended above the front side of a conductive substrate. The diaphragm is aligned above one or more back holes in the substrate having a front opening smaller than the diaphragm. In one embodiment, a continuous perforated spring surrounds the diaphragm and has a shape that conforms to the diaphragm. A plurality of perforated beams connects the spring to rigid pads that anchor the movable diaphragm and spring. In another embodiment, there is a plurality of perforated springs having double or triple folding configurations and a plurality of perforated beams connecting the diaphragm to rigid pads. Also disclosed is a scheme to integrate the silicon microphone sensing element with CMOS devices on a single chip.
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公开(公告)号：US20100090295A1
公开(公告)日：2010-04-15
申请号：US12287466
申请日：2008-10-09
Applicant: Wang Zhe , Chong Ser Choong
Inventor： Wang Zhe , Chong Ser Choong
CPC classification number: B81B7/007 , B81B2207/097 , H01L2224/48091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
Abstract: The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least one MEMS device is attached to one of the substrates. The first pre-molded lead-frame substrate is folded over and joined to the second pre-molded lead-frame substrate to house the at least one MEMS device. In one embodiment, the first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of the cavities. The extended metal leads are folded over the top of the second pre-molded lead-frame substrate to form surface mounting pads. In some embodiments, extended metal leads are folded along the sidewalls and connected to ground for electromagnetic interference (EMI) shielding.
Abstract translation: MEMS封装包括第一和第二预成型引线框架基板，其中至少一个具有由其周边的塑料侧壁形成的空腔。 第一和第二预成型引线框架基板与金属引线相互连接。 至少一个MEMS器件附接到其中一个衬底。 第一预成型引线框架基板被折叠并连接到第二预成型引线框架基板以容纳至少一个MEMS器件。 在一个实施例中，第一预成型引线框架基板具有延伸到空腔侧壁外侧的金属引线。 延伸的金属引线折叠在第二预成型引线框架基板的顶部上以形成表面安装垫。 在一些实施例中，延伸的金属引线沿着侧壁折叠并连接到地面用于电磁干扰（EMI）屏蔽。
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公开(公告)号：US20090208037A1
公开(公告)日：2009-08-20
申请号：US12070575
申请日：2008-02-20
Applicant: Wang Zhe
Inventor： Wang Zhe
IPC: H04R25/00
CPC classification number: H04R19/005 , H01L2224/48091 , H04R7/04 , H04R7/20 , H04R19/04 , H04R31/00 , H04R2307/201 , H04R2307/207 , H01L2924/00014
Abstract: Various embodiments of a silicon microphone sensing element without dedicated backplate are disclosed. The microphone sensing element has a circular or polygonal diaphragm with a plurality of perforated springs suspended above the front side of a conductive substrate. The diaphragm is aligned above one or more back holes in the substrate having a front opening smaller than the diaphragm. In one embodiment, a continuous perforated spring surrounds the diaphragm and has a shape that conforms to the diaphragm. A plurality of perforated beams connects the spring to rigid pads that anchor the movable diaphragm and spring. In another embodiment, there is a plurality of perforated springs having double or triple folding configurations and a plurality of perforated beams connecting the diaphragm to rigid pads. Also disclosed is a scheme to integrate the silicon microphone sensing element with CMOS devices on a single chip.
Abstract translation: 公开了没有专用背板的硅麦克风感测元件的各种实施例。 麦克风感测元件具有圆形或多边形的隔膜，其中多个穿孔弹簧悬挂在导电基底的正面之上。 隔膜在基板中的一个或多个后孔上方对准，前孔开口小于隔膜。 在一个实施例中，连续的穿孔弹簧围绕隔膜并且具有与隔膜相符的形状。 多个穿孔梁将弹簧连接到固定可移动隔膜和弹簧的刚性垫。 在另一个实施例中，存在多个具有双重或三重折叠构造的穿孔弹簧以及将隔膜连接到刚性垫的多个穿孔梁。 还公开了将硅麦克风感测元件与CMOS器件集成在单个芯片上的方案。
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9.发明申请公开(公告)号：US20090092273A1
公开(公告)日：2009-04-09
申请号：US11973075
申请日：2007-10-05
Applicant: Wang Zhe , Chong Ser Choong
Inventor： Wang Zhe , Chong Ser Choong
IPC: H04R9/08
CPC classification number: H04R19/04
Abstract: A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.
Abstract translation: 公开了一种无刷硅传声器和用于提高耐冲击性的线保护方法。 圆形隔膜由具有多个槽和穿孔的圆形弹簧围绕，以便于减少空气阻尼，释放面内应力，并提高平面外的柔性。 固定在基板上的圆形弹簧将硅麦克风保持悬挂在基板的背面孔上，但允许隔膜垂直于基板振动。 在多孔弹簧和基板之间形成麦克风可变电容器。 槽口尺寸被最小化以防止颗粒进入下面的气隙。 在圆形弹簧的外边缘附近的多个“n”键合焊盘通过用作止动器的“n / 2”接合线连接，以限制隔膜的向上运动。 接合线可以彼此交叉以实现较低的回路高度，以更有效地抵抗冲击。
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公开(公告)号：US20060093170A1
公开(公告)日：2006-05-04
申请号：US10977692
申请日：2004-10-29
CPC classification number: H04R31/003 , H04R19/005 , H04R19/04 , H04R25/00
Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with a perforated plate adjoining each side or corner. The diaphragm is aligned above one or more back holes created in a conductive substrate wherein the back hole has a width less than that of the diaphragm. Perforated plates are suspended above an air gap that overlies the substrate. The diaphragm is supported by mechanical springs with two ends that are attached to the diaphragm at a corner, side, or center and terminate in a rigid pad anchored on a dielectric spacer layer. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. The microphone sensing element can be embodied in different approaches to reduce parasitic capacitance.
Abstract translation: 公开了一种基于硅的麦克风传感元件及其制造方法。 麦克风感测元件具有隔膜，其上具有邻接每个侧面或拐角的多孔板。 隔膜在导电基板中形成的一个或多个后孔上方对准，其中后孔的宽度小于隔膜的宽度。 穿孔板悬挂在衬底上方的气隙上方。 隔膜由机械弹簧支撑，其两端在角部，侧面或中心附接到隔膜，并终止于固定在介电隔离层上的刚性垫中。 第一电极形成在一个或多个刚性焊盘上，并且第二电极形成在衬底上的一个或多个位置处以建立可变电容器电路。 麦克风感测元件可以以不同的方式实现以减少寄生电容。
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