公开(公告)号：US07879720B2

公开(公告)日：2011-02-01

申请号：US12241744

申请日：2008-09-30

申请人： Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

发明人： Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

IPC分类号： H01L23/52 ,  H01L21/768

CPC分类号： H01L21/76804 ,  H01L21/76805 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76844 ,  H01L21/76847 ,  H01L21/76849 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods of forming electrical interconnects include forming a copper pattern on a semiconductor substrate and then forming an electrically insulating capping layer on the copper pattern and an interlayer insulating layer on the electrically insulating capping layer. A contact hole is then formed, which extends through the interlayer insulating layer and the electrically insulating capping layer and exposes an upper surface of the copper pattern. An electroless plating step is then performed to form a copper pattern extension onto the exposed upper surface of the copper pattern. The copper pattern extension may have a thickness that is less than a thickness of the electrically insulating capping layer, which may be formed as a SiCN layer.

摘要翻译： 形成电互连的方法包括在半导体衬底上形成铜图案，然后在铜图案上形成电绝缘覆盖层，以及在电绝缘覆盖层上形成层间绝缘层。 然后形成接触孔，其延伸穿过层间绝缘层和电绝缘覆盖层并暴露铜图案的上表面。 然后执行化学镀步骤以在铜图案的暴露的上表面上形成铜图案延伸。 铜图案延伸部的厚度可以小于可以形成为SiCN层的电绝缘覆盖层的厚度。

公开(公告)号：US20100099250A1

公开(公告)日：2010-04-22

申请号：US12255329

申请日：2008-10-21

申请人： Woo Jin Jang ,  Sung Dong Cho ,  Bum Ki Moon

发明人： Woo Jin Jang ,  Sung Dong Cho ,  Bum Ki Moon

IPC分类号： H01L21/44

CPC分类号： H01L21/76849 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03462 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05011 ,  H01L2224/05147 ,  H01L2224/05541 ,  H01L2224/05558 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01014 ,  H01L2224/05552

摘要： Methods of forming a contact pad include forming a copper pattern on a semiconductor substrate and forming a passivation layer on the copper pattern. The passivation layer is defined to have an opening therein that exposes at least a portion of an upper surface of the copper pattern. A diffusion barrier layer is formed in the opening by electroless plating the diffusion barrier layer onto the exposed portion of the upper surface of the copper pattern. This diffusion barrier layer operates as a barrier to copper out-diffusion from the copper pattern. These methods further include conformally depositing an underbump metallization layer onto at least a sidewall of the opening in the passivation layer and onto an upper surface of the diffusion barrier layer. A step is then performed to plate a contact bump (e.g., solder bump) onto a portion of the underbump metallization layer extending opposite the diffusion barrier layer.

摘要翻译： 形成接触焊盘的方法包括在半导体衬底上形成铜图案并在铜图案上形成钝化层。 钝化层被限定为在其中具有暴露铜图案的上表面的至少一部分的开口。 通过将扩散阻挡层化学镀在铜图案的上表面的暴露部分上，在开口中形成扩散阻挡层。 该扩散阻挡层作为从铜图案向铜扩散的屏障起作用。 这些方法进一步包括在钝化层中的开口的至少一个侧壁上并在扩散阻挡层的上表面上共形沉积下凸块金属化层。 然后执行步骤以将接触凸起（例如，焊料凸块）平铺到与扩散阻挡层相对延伸的下凸块金属化层的一部分上。

公开(公告)号：US20100081272A1

公开(公告)日：2010-04-01

申请号：US12241744

申请日：2008-09-30

申请人： Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

发明人： Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

IPC分类号： H01L21/768

CPC分类号： H01L21/76804 ,  H01L21/76805 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76844 ,  H01L21/76847 ,  H01L21/76849 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods of forming electrical interconnects include forming a copper pattern on a semiconductor substrate and then forming an electrically insulating capping layer on the copper pattern and an interlayer insulating layer on the electrically insulating capping layer. A contact hole is then formed, which extends through the interlayer insulating layer and the electrically insulating capping layer and exposes an upper surface of the copper pattern. An electroless plating step is then performed to form a copper pattern extension onto the exposed upper surface of the copper pattern. The copper pattern extension may have a thickness that is less than a thickness of the electrically insulating capping layer, which may be formed as a SiCN layer.

摘要翻译： 形成电互连的方法包括在半导体衬底上形成铜图案，然后在铜图案上形成电绝缘覆盖层，以及在电绝缘覆盖层上形成层间绝缘层。 然后形成接触孔，其延伸穿过层间绝缘层和电绝缘覆盖层并暴露铜图案的上表面。 然后执行化学镀步骤以在铜图案的暴露的上表面上形成铜图案延伸。 铜图案延伸部的厚度可以小于可以形成为SiCN层的电绝缘覆盖层的厚度。

公开(公告)号：US07869489B2

公开(公告)日：2011-01-11

申请号：US11694243

申请日：2007-03-30

申请人： Woo Jin Jang

发明人： Woo Jin Jang

IPC分类号： H04B1/00

CPC分类号： H04L27/2656 ,  H04B1/70752 ,  H04B1/70775 ,  H04B2201/70707 ,  H04L7/043 ,  H04L27/2675

摘要： A preamble acquisition apparatus includes a first PN code generation unit for generating a first PN code having a bit string, a first correlation calculation unit for correlating a received frequency domain preamble signal with the first PN code within a first correlation range to generate a first correlation value, a first correlation value comparison unit for comparing the first correlation value with a first threshold value, a second PN code generation unit for generating a second PN code, a second correlation calculation unit for correlating the received frequency domain preamble signal with the second PN code within a second correlation range to generate a second correlation value, and a preamble acquisition determination unit for comparing the second correlation value with a second threshold value to determine whether to acquire the preamble. The bit values of the first PN code are located in the second PN code.

摘要翻译： 前导码获取装置包括：第一PN码产生单元，用于产生具有比特串的第一PN码;第一相关计算单元，用于将接收到的频域前导信号与第一相关范围内的第一PN码相关，以产生第一相关 第一相关值比较单元，用于将第一相关值与第一阈值进行比较;第二PN码产生单元，用于产生第二PN码;第二相关计算单元，用于将接收到的频域前导信号与第二PN 代码在第二相关范围内产生第二相关值，以及前导码获取确定单元，用于将第二相关值与第二阈值进行比较，以确定是否获取前导码。 第一PN码的位值位于第二PN码中。

公开(公告)号：US07577115B2

公开(公告)日：2009-08-18

申请号：US11285943

申请日：2005-11-23

申请人： Woo Jin Jang

发明人： Woo Jin Jang

IPC分类号： H04B7/216

CPC分类号： H04B1/70735 ,  H04B1/70752 ,  H04B1/7083 ,  H04B2201/70707

摘要： Provided are an apparatus and a method for acquiring a code group that is used for a mobile communication terminal to acquire a scrambling code for identification of a base station. The present invention compares a part of slot values in code groups of the secondary synchronization channel transmitted to a mobile communication terminal from a base station with a part of code groups already known and, when there is a code group having a value higher than a predetermined value, reads code groups having the same pattern as that of the code group having a value higher than the predetermined value, which are previously stored in a predetermined storage. Then, the present invention excludes the read code groups from operations to reduce the quantity of unnecessary operations.

摘要翻译： 提供了一种用于获取用于移动通信终端获取用于识别基站的扰码的代码组的装置和方法。 本发明将从基站发送到移动通信终端的辅同步信道的码组中的时隙值的一部分与已知的一部分码组进行比较，并且当存在具有高于预定的值的码组时 值，读取具有与预先存储在预定存储器中的具有高于预定值的值的代码组相同模式的代码组。 然后，本发明将读取的代码组从操作中排除以减少不必要的操作的数量。

公开(公告)号：US08272703B2

公开(公告)日：2012-09-25

申请号：US12061541

申请日：2008-04-02

申请人： Woo Jin Jang

发明人： Woo Jin Jang

IPC分类号： A47B97/00

CPC分类号： F25D23/02 ,  F25D2323/023 ,  Y10T29/49

摘要： Provided is a home-bar door and a method of manufacturing the home-bar door. The home-bar door includes a first case, an insulating plate, and a second case. The first case forms a portion of an exterior of the home-bar door, and the insulating plate is disposed in the first case as a separate component. The second case is configured to be coupled to the first case to cover the insulating plate and form the exterior of the home-bar door. Therefore, since the first and second cases can be coupled to each other after disposing the insulating plate between the first and second cases, the home-bar door can be efficiently manufactured and have good quality.

摘要翻译： 提供家庭酒吧门和制造家庭酒吧门的方法。 家庭门包括第一壳体，绝缘板和第二壳体。 第一种情况形成家庭门的外部的一部分，并且绝缘板作为单独的部件设置在第一壳体中。 第二壳体被配置为联接到第一壳体以覆盖绝缘板并形成家庭门的外部。 因此，由于第一壳体和第二壳体可以在将绝缘板设置在第一壳体和第二壳体之间而彼此耦合，所以可以有效地制造家用门门并且具有良好的质量。

公开(公告)号：US20080298292A1

公开(公告)日：2008-12-04

申请号：US12159029

申请日：2006-12-29

申请人： Woo Jin Jang

发明人： Woo Jin Jang

IPC分类号： G08C17/00

CPC分类号： H04W24/00 ,  H04W52/0216 ,  H04W80/00 ,  Y02D70/1242 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/23 ,  Y02D70/24

摘要： A wireless broadband Internet (WiBro) terminal and a method of determining a sleep mode of a WiBro terminal, which can measure a strength of a preamble signal and determine an effective sleep interval are provided. A WiBro terminal, which can measure a strength of a preamble signal in the listening mode during an L frame after operating in a sleep mode during an N1 frame, and operate in a sleep mode during either an N1 or 2*N1 frames, or perform a normal operation when MOB_TRF_IND is positive, resulting from the comparing the strength with a threshold value, is provided.

摘要翻译： 提供了一种无线宽带因特网（WiBro）终端和确定WiBro终端的睡眠模式的方法，其可以测量前导码信号的强度并确定有效睡眠间隔。 WiBro终端，其可以在N1帧期间以睡眠模式操作之后在L帧期间在聆听模式下测量前导信号的强度，并且在N1或2 * N1帧期间以睡眠模式操作，或执行 提供了通过将强度与阈值进行比较而导致的MOB_TRF_IND为正的正常操作。