公开(公告)号：US20250069579A1

公开(公告)日：2025-02-27

申请号：US18236221

申请日：2023-08-21

Applicant: Advanced Micro Devices, Inc. ,  XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Christopher JAGGERS ,  Hoa DO ,  Md Malekkul ISLAM ,  Paul Theodore ARTMAN ,  Sukesh SHENOY ,  Suresh RAMALINGAM ,  Muhammad Afiq Bin In BAHAROM

IPC: G10K11/178

Abstract: In one example, a micro device includes a housing; a chip package disposed in the housing; a noise producing component coupled to the housing. The micro device also includes a noise reduction system having a reference microphone for detecting a noise from the noise producing component and a controller configured to receive the noise from the reference microphone and generate a masking sound signal in response to the detected noise. A speaker is coupled to the housing for producing a masking sound corresponding to the masking sound signal, whereby the masking sound reduces the noise. In another example, the noise producing component comprises a fan.

公开(公告)号：US20230420335A1

公开(公告)日：2023-12-28

申请号：US17851937

申请日：2022-06-28

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM

IPC: H01L23/40 ,  H01L25/065 ,  H01L23/498 ,  H01L23/46

CPC classification number: H01L23/4006 ,  H01L25/0655 ,  H01L23/49833 ,  H01L23/46 ,  H01L21/4882

Abstract: Chip packages, electronic devices and method for making the same are described herein. The chip packages and electronic devices have a heat spreader disposed over a plurality of integrated circuit (IC) devices. The heat spreader has an opening through which a protrusion from an overlaying cover extends into contact with one or more of the IC devices to provide a direct heat transfer path to the cover. Another one or more other IC devices have a heat transfer path to the cover through the heat spreader. The separate heat transfer paths allow more effective thermal management of the IC devices of the chip package.

公开(公告)号：US20230253380A1

公开(公告)日：2023-08-10

申请号：US17669252

申请日：2022-02-10

Applicant: XILINX, INC.

Inventor： Li-Sheng WENG ,  Suresh RAMALINGAM ,  Hong SHI

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L24/24 ,  H01L2224/24265 ,  H01L2924/19103 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2224/244 ,  H01L2224/24226

Abstract: A chip package and method for fabricating the same are provided that includes a near-die integrated passive device. The near-die integrated passive device is disposed between a package substrate and an integrated circuit die of a chip package. Some non-exhaustive examples of an integrated passive device that may be disposed between the package substrate and the integrated circuit die include a resistor, a capacitor, an inductor, a coil, a balum, or an impedance matching element, among others.

公开(公告)号：US20210366873A1

公开(公告)日：2021-11-25

申请号：US16880811

申请日：2020-05-21

Applicant: XILINX, INC.

Inventor： Jaspreet Singh GANDHI ,  Suresh RAMALINGAM ,  William E. ALLAIRE ,  Hong SHI ,  Kerry M. PIERCE

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.

公开(公告)号：US20210134757A1

公开(公告)日：2021-05-06

申请号：US16672802

申请日：2019-11-04

Applicant: XILINX, INC.

Inventor： Jaspreet Singh GANDHI ,  Suresh RAMALINGAM

IPC: H01L25/065 ,  H01L23/00 ,  H01L21/56

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of posts in mold compound for improved resistance to delamination. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die, a substrate, a redistribution layer, a mold compound and a plurality of posts. The redistribution layer provides electrical connections between circuitry of the first IC die and circuitry of the substrate. The mold compound is disposed in contact with the first IC die and spaced from the substrate by the redistribution layer. The plurality of posts are disposed in the mold compound and are laterally spaced from the first IC die. The plurality of posts are not electrically connected to the circuitry of the first IC die.

公开(公告)号：US20230282547A1

公开(公告)日：2023-09-07

申请号：US17688803

申请日：2022-03-07

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Yohan FRANS ,  Suresh RAMALINGAM

IPC: H01L23/427 ,  H01L25/16 ,  H01L23/16 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/427 ,  H01L21/4882 ,  H01L23/16 ,  H01L23/562 ,  H01L25/167

Abstract: Chip packages and methods for fabricating the same are provided which utilize a first heat spreader interfaced with a first integrated circuit (IC) die and a second heat spreader separately interfaced with a second IC die. The separate heat spreaders allow the force applied to the first IC die to be controlled independent of the force applied to the second IC die.

公开(公告)号：US20210305127A1

公开(公告)日：2021-09-30

申请号：US16833034

申请日：2020-03-27

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM ,  Ken CHANG ,  Mayank RAJ ,  Chuan XIE ,  Yohan FRANS

IPC: H01L23/473 ,  H01L23/367 ,  H01L25/16

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

公开(公告)号：US20210249328A1

公开(公告)日：2021-08-12

申请号：US16786447

申请日：2020-02-10

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM ,  Jaspreet Singh GANDHI ,  Cheang-Whang CHANG

IPC: H01L23/367 ,  H01L25/065

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of electrically floating heat transfer structures for improved thermal management. In one example, a chip package assembly is provided. The chip package assembly includes a substrate, a first integrated circuit (IC) die and a plurality of electrically floating conductive heat transfer structures. The substrate has a first surface and an opposing second surface. The first IC die has a first surface, an opposing second surface, and four lateral sides. The second surface of the first IC die is mounted to the first surface of the substrate. The plurality of electrically floating conductive heat transfer structures extend in a first direction defined between the first and second surfaces of the first IC die. A first conductive heat transfer structure of the plurality of electrically floating conductive heat transfer structures are part of a first conductive heat transfer path having a length in the first direction at least as long as a distance between the first and second surfaces.

公开(公告)号：US20240055359A1

公开(公告)日：2024-02-15

申请号：US17888293

申请日：2022-08-15

Applicant: XILINX, INC.

Inventor： Li-Sheng WENG ,  Suresh RAMALINGAM

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/498 ,  H01L21/50

CPC classification number: H01L23/5389 ,  H01L23/5384 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5385 ,  H01L28/40 ,  H01L28/10 ,  H01L23/49816 ,  H01L21/50 ,  H01L2224/16227 ,  H01L24/16

Abstract: A chip package and methods for fabricating the same are provided that include integrated devices embedded and coupled in series between a lower surface of a package substrate and an integrated circuit die of the chip package. In some examples, the integrated devices are disposed side by side embedded in a common package substrate. In other examples, one of the series coupled integrated devices is embedded in a first package substrate while another of the series coupled integrated devices is embedded in a second package substrate that is stacked directly in contact with the first package substrate. The integrated devices may be passive and/or active integrated devices.

公开(公告)号：US20230207422A1

公开(公告)日：2023-06-29

申请号：US17564114

申请日：2021-12-28

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM

IPC: H01L23/427

CPC classification number: H01L23/427

Abstract: Disclosed herein is a heat spreader for use with an IC package, the heat spreader having features for enhanced temperature control of the IC package. A heat spreader for use with an IC package is disclosed. In one example, the heat spreader includes a metal body that has a sealed internal cavity. A thermally conductive material fills the sealed internal cavity. The thermally conductive material has an interstitial space sufficient to allow fluid to pass therethrough. A first phase change material fills at least a portion of the interstitial space of the thermally conductive material.