公开(公告)号：US20170053848A1

公开(公告)日：2017-02-23

申请号：US15237287

申请日：2016-08-15

Applicant: XINTEC INC.

Inventor： Shu-Ming CHANG ,  Po-Chang HUANG ,  Tsang-Yu LIU ,  Yu-Lung HUANG ,  Chi-Chang LIAO

IPC: H01L23/31 ,  H01L23/08 ,  G06K9/00 ,  H01L21/56

CPC classification number: H01L23/3121 ,  G06K9/00013 ,  G06K9/0002 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/481 ,  H01L2224/11

Abstract: A sensing module is provided. The sensing module includes a sensing device. The sensing device includes a first substrate having a first surface and a second surface opposite thereto. The sensing device also includes a sensing region adjacent to the first surface and a conducting pad on the first surface. The sensing device further includes a redistribution layer on the second surface and electrically connected to the conducting pad. The sensing module also includes a second substrate and a cover plate bonded to the sensing device so that the sensing device is between the second substrate and the cover plate. The conducting pad is electrically connected to the second substrate through the redistribution layer. The sensing module further includes an encapsulating layer filled between the second substrate and the cover plate to surround the sensing device.

Abstract translation: 提供感测模块。 感测模块​​包括感测装置。 感测装置包括具有第一表面和与其相对的第二表面的第一基底。 感测装置还包括与第一表面相邻的感测区域和第一表面上的导电垫片。 感测装置还包括在第二表面上的再分配层，并且电连接到导电垫。 感测模块​​还包括结合到感测装置的第二基板和盖板，使得感测装置在第二基板和盖板之间。 导电焊盘通过再分布层与第二基板电连接。 感测模块​​还包括填充在第二基板和盖板之间以封装感测装置的封装层。

公开(公告)号：US20160190353A1

公开(公告)日：2016-06-30

申请号：US14860388

申请日：2015-09-21

Applicant: XINTEC INC.

Inventor： Chi-Chang LIAO ,  Po-Chang HUANG ,  Tsang-Yu LIU

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L27/1469 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/16225

Abstract: A method for forming a photosensitive module is provided. The method includes providing a substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A cover plate is provided on the first surface of the substrate. An opening is formed. The opening penetrates the substrate and exposes the conducting pad. A redistribution layer is formed in the first opening to electrically connect to the conducting pad. The cover plate is removed and a dicing process is performed to form a sensing device. The sensing device is bonded to a circuit board. An optical component is mounted on the circuit board and corresponds to the sensing device. A photosensitive module formed by the method is also provided.

Abstract translation: 提供一种形成光敏模块的方法。 该方法包括提供具有第一表面和与其相对的第二表面的基底。 导电垫位于第一表面上。 盖板设置在基板的第一表面上。 形成一个开口。 开口穿透衬底并暴露导电垫。 在第一开口中形成再分配层以电连接到导电垫。 去除盖板并执行切割处理以形成感测装置。 感测装置结合到电路板上。 光学部件安装在电路板上并对应于感测装置。 还提供了通过该方法形成的感光模块。