公开(公告)号：US20150228557A1

公开(公告)日：2015-08-13

申请号：US14619658

申请日：2015-02-11

申请人： XINTEC INC.

发明人： Chia-Ming CHENG ,  Tsang-Yu LIU ,  Chi-Chang LIAO ,  Yu-Lung HUANG

IPC分类号： H01L23/48 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/308

CPC分类号： H01L23/3185 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/94 ,  H01L29/0657 ,  H01L2224/0224 ,  H01L2224/02245 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/06165 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/94 ,  H01L2224/03

摘要： A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess. A method for forming the chip package is also provided.

摘要翻译： 提供了包括半导体衬底的芯片封装。 半导体衬底中具有凹部，其中半导体衬底具有从凹部的底部突出的至少一个间隔件。 导电层设置在半导体衬底上并延伸到凹槽中。 还提供了一种用于形成芯片封装的方法。

公开(公告)号：US20160351608A1

公开(公告)日：2016-12-01

申请号：US15163625

申请日：2016-05-24

申请人： XINTEC INC.

发明人： Yu-Lung HUANG ,  Chi-Chang LIAO ,  Tsang-Yu LIU

IPC分类号： H01L27/146

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L27/14698 ,  H01L2224/16 ,  H01L2924/16235

摘要： A chip package includes a substrate, a conductive layer and a plurality of thermal dissipation connections. The substrate includes a light-sensing region and has an upper surface and a lower surface opposite to each other. The conductive layer is disposed at the lower surface of the substrate and includes a light-shielding dummy conductive layer substantially aligned with the light-sensing region. The thermal dissipation connections are disposed beneath the lower surface of the substrate.

摘要翻译： 芯片封装包括衬底，导电层和多个散热连接。 基板包括感光区域，并且具有彼此相对的上表面和下表面。 导电层设置在基板的下表面，并且包括基本上与光感测区域对准的遮光虚拟导电层。 散热连接设置在基板的下表面之下。

公开(公告)号：US20170053848A1

公开(公告)日：2017-02-23

申请号：US15237287

申请日：2016-08-15

申请人： XINTEC INC.

发明人： Shu-Ming CHANG ,  Po-Chang HUANG ,  Tsang-Yu LIU ,  Yu-Lung HUANG ,  Chi-Chang LIAO

IPC分类号： H01L23/31 ,  H01L23/08 ,  G06K9/00 ,  H01L21/56

CPC分类号： H01L23/3121 ,  G06K9/00013 ,  G06K9/0002 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/481 ,  H01L2224/11

摘要： A sensing module is provided. The sensing module includes a sensing device. The sensing device includes a first substrate having a first surface and a second surface opposite thereto. The sensing device also includes a sensing region adjacent to the first surface and a conducting pad on the first surface. The sensing device further includes a redistribution layer on the second surface and electrically connected to the conducting pad. The sensing module also includes a second substrate and a cover plate bonded to the sensing device so that the sensing device is between the second substrate and the cover plate. The conducting pad is electrically connected to the second substrate through the redistribution layer. The sensing module further includes an encapsulating layer filled between the second substrate and the cover plate to surround the sensing device.

摘要翻译： 提供感测模块。 感测模块​​包括感测装置。 感测装置包括具有第一表面和与其相对的第二表面的第一基底。 感测装置还包括与第一表面相邻的感测区域和第一表面上的导电垫片。 感测装置还包括在第二表面上的再分配层，并且电连接到导电垫。 感测模块​​还包括结合到感测装置的第二基板和盖板，使得感测装置在第二基板和盖板之间。 导电焊盘通过再分布层与第二基板电连接。 感测模块​​还包括填充在第二基板和盖板之间以封装感测装置的封装层。

公开(公告)号：US20160218129A1

公开(公告)日：2016-07-28

申请号：US15005956

申请日：2016-01-25

申请人： XINTEC INC.

发明人： Tsang-Yu LIU ,  Chi-Chang LIAO

IPC分类号： H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/13

摘要： A method for forming a photosensitive module is provided. The method includes providing a sensing device. The sensing device includes a substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A first opening penetrates the substrate and exposes the conducting pad. A redistribution layer is in the first opening to electrically connect to the conducting pad. A cover plate is located on the first surface and covers the conducting pad. The method also includes bonding the sensing device to a circuit board. The cover plate is removed after bonding the sensing device to the circuit board. The method further includes mounting an optical component corresponding to the sensing device on the circuit board. A photosensitive module formed by the method is also provided.

摘要翻译： 提供一种形成光敏模块的方法。 该方法包括提供感测装置。 感测装置包括具有第一表面和与其相对的第二表面的基底。 导电垫位于第一表面上。 第一开口穿透衬底并暴露导电垫。 再分布层位于第一开口中，以电连接到导电垫。 盖板位于第一表面上并覆盖导电垫。 该方法还包括将感测装置接合到电路板。 在将感测装置接合到电路板之后，盖板被去除。 该方法还包括将对应于感测装置的光学部件安装在电路板上。 还提供了通过该方法形成的感光模块。

公开(公告)号：US20160190353A1

公开(公告)日：2016-06-30

申请号：US14860388

申请日：2015-09-21

申请人： XINTEC INC.

发明人： Chi-Chang LIAO ,  Po-Chang HUANG ,  Tsang-Yu LIU

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232

CPC分类号： H01L27/1469 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/16225

摘要： A method for forming a photosensitive module is provided. The method includes providing a substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A cover plate is provided on the first surface of the substrate. An opening is formed. The opening penetrates the substrate and exposes the conducting pad. A redistribution layer is formed in the first opening to electrically connect to the conducting pad. The cover plate is removed and a dicing process is performed to form a sensing device. The sensing device is bonded to a circuit board. An optical component is mounted on the circuit board and corresponds to the sensing device. A photosensitive module formed by the method is also provided.

摘要翻译： 提供一种形成光敏模块的方法。 该方法包括提供具有第一表面和与其相对的第二表面的基底。 导电垫位于第一表面上。 盖板设置在基板的第一表面上。 形成一个开口。 开口穿透衬底并暴露导电垫。 在第一开口中形成再分配层以电连接到导电垫。 去除盖板并执行切割处理以形成感测装置。 感测装置结合到电路板上。 光学部件安装在电路板上并对应于感测装置。 还提供了通过该方法形成的感光模块。

公开(公告)号：US20170213865A1

公开(公告)日：2017-07-27

申请号：US15410715

申请日：2017-01-19

申请人： XINTEC INC.

发明人： Ho-Yin YIU ,  Chi-Chang LIAO ,  Shih-Yi LEE ,  Yen-Kang RAW

IPC分类号： H01L27/146

CPC分类号： H01L27/14621 ,  H01L27/1462 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2224/11

摘要： This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, comprising: a sensing device adjacent to the first top surface; and a plurality of conductive pads adjacent to first top surface and the sensing device; a wiring layer formed on the first bottom surface and connected to each of the conductive pads; a dam having a supporter with a first opening and a spacer with a second opening formed on the first top surface, wherein the supporter is within the second opening and adjacent to the spacer, and the spacer is higher than the supporter by a predetermined distance d; a lens formed on the first top surface exposed by the first opening and above the sensing device; and an optical filter deposed on the supporter and above the lens.

公开(公告)号：US20160218133A1

公开(公告)日：2016-07-28

申请号：US15006052

申请日：2016-01-25

申请人： XINTEC INC.

发明人： Yen-Shih HO ,  Tsang-Yu LIU ,  Chi-Chang LIAO

IPC分类号： H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L2224/16

摘要： A method for forming a photosensitive module is provided. The method includes providing a sensing device. The sensing device includes a conducting pad located on a substrate. A first opening penetrates the substrate and exposes the conducting pad. A redistribution layer is in the first opening to electrically connect to the conducting pad. A cover plate is located on the substrate and covers the conducting pad. The method also includes removing the cover plate of the sensing device. The method further includes bonding the sensing device to a circuit board after the removal of the cover plate. The redistribution layer in the first opening is exposed and faces the circuit board. In addition, the method includes mounting an optical component corresponding to the sensing device on the circuit board. A photosensitive module formed by the method is also provided.

摘要翻译： 提供一种形成光敏模块的方法。 该方法包括提供感测装置。 感测装置包括位于基板上的导电垫。 第一开口穿透衬底并暴露导电垫。 再分布层位于第一开口中，以电连接到导电垫。 盖板位于基板上并覆盖导电垫。 该方法还包括移除感测装置的盖板。 该方法还包括在移除盖板之后将感测装置接合到电路板。 第一开口中的再分配层被暴露并面向电路板。 此外，该方法包括将对应于感测装置的光学部件安装在电路板上。 还提供了通过该方法形成的感光模块。

公开(公告)号：US20170117242A1

公开(公告)日：2017-04-27

申请号：US15297490

申请日：2016-10-19

申请人： XINTEC INC.

发明人： Yen-Shih HO ,  Tsang-Yu LIU ,  Po-Han LEE ,  Chi-Chang LIAO

IPC分类号： H01L23/00

CPC分类号： H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/06181 ,  H01L2224/08265 ,  H01L2224/1403 ,  H01L2224/14155 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/171 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/146

摘要： A chip package is provided. The chip package includes a substrate. The substrate includes a sensing region or device region. The chip package also includes a first conducting structure disposed on the substrate. The first conducting structure is electrically connected to the sensing region or device region. The chip package further includes a passive element vertically stacked on the substrate. The passive element and the first conducting structure are positioned side by side.

公开(公告)号：US20170116458A1

公开(公告)日：2017-04-27

申请号：US15297546

申请日：2016-10-19

申请人： XINTEC INC.

发明人： Tsang-Yu LIU ,  Ying-Nan WEN ,  Chi-Chang LIAO ,  Yu-Lung HUANG

IPC分类号： G06K9/00 ,  H01L21/768 ,  H01L23/00 ,  H01L23/08 ,  H01L21/78 ,  H01L23/31 ,  H01L23/04 ,  H01L21/683 ,  H01L21/56

CPC分类号： G06K9/00013 ,  G06K19/0716 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76895 ,  H01L21/78 ,  H01L23/04 ,  H01L23/08 ,  H01L23/15 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/02313 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/03002 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/0579 ,  H01L2224/058 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2924/351 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. A sensing region is adjacent to the first surface. A temporary cover plate is provided on the second surface to cover the sensing region. The method also includes forming a redistribution layer on the second surface and electrically connected to the sensing region. The method further includes removing the temporary cover plate after the formation of the redistribution layer. The first substrate is bonded to a second substrate and a cover plate after the removal of the temporary cover plate so that the first substrate is positioned between the second substrate and the cover plate. In addition, the method includes filling an encapsulating layer between the second substrate and the cover plate to surround the first substrate.

公开(公告)号：US20160351607A1

公开(公告)日：2016-12-01

申请号：US15166261

申请日：2016-05-27

申请人： XINTEC INC.

发明人： Tsang-Yu LIU ,  Chi-Chang LIAO

IPC分类号： H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14601 ,  H01L27/14687 ,  H04N5/2253

摘要： An image sensing device includes a printed circuit board, a chip package, and an adhesive layer. The printed circuit board has a concave portion. The chip package has a sensing surface and a bonding surface that is opposite to the sensing surface. The adhesive layer is disposed between the bonding surface of the chip package and the concave portion of the printed circuit board. The adhesive layer has an aggregation force. The chip package is bent through a surface of the concave portion and the aggregation force, such that the sensing surface of the chip package is an arc surface.

摘要翻译： 图像感测装置包括印刷电路板，芯片封装和粘合剂层。 印刷电路板具有凹部。 芯片封装具有感测表面和与感测表面相对的接合表面。 粘合剂层设置在芯片封装的接合表面和印刷电路板的凹部之间。 粘合剂层具有聚集力。 芯片封装通过凹部的表面和聚集力弯曲，使得芯片封装的感测表面是弧形表面。