公开(公告)号：US20160307779A1

公开(公告)日：2016-10-20

申请号：US15098278

申请日：2016-04-13

Applicant: XINTEC INC.

Inventor： Yu-Tung CHEN ,  Quan-Qun SU ,  Chuan-Jin SHIU ,  Chien-Hui CHEN ,  Hsiao-Lan YEH ,  Yen-Shih HO

IPC: H01L21/56 ,  H01L21/67 ,  B05B1/24 ,  H01L21/78 ,  H01L23/29 ,  H01L23/00 ,  H01L21/687 ,  H01L21/768

CPC classification number: H01L21/561 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/6715 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/11 ,  H01L24/94 ,  H01L2224/02313 ,  H01L2224/0346 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014

Abstract: A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.

Abstract translation: 晶片涂布系统包括晶片卡盘，流动绝缘材料喷雾器和晶片倾斜提升销。 晶片卡盘具有托架部和旋转部，托架部安装在旋转部上以承载晶片，旋转部构造成以预定轴旋转。 流动的绝缘材料喷雾器位于晶片卡盘之上，并配置成将流动的绝缘材料喷射到晶片上，并且晶片倾斜提升销构造成在晶片和重心之间形成第一锐角。