Abstract:
An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.
Abstract:
A process for making a crystalline latex suitable for use in a toner by phase inversion emulsification (PIE) where when resin of particular acid number is neutralized to a certain degree, smaller sized resin particles are obtained reproducibly.
Abstract:
The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.
Abstract:
A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.
Abstract:
A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.
Abstract:
A process for making a crystalline latex suitable for use in a toner by phase inversion emulsification (PIE) where the liquid reagents, such as, organic solvent(s), neutralizing agent and water, are reused from a prior PIE.
Abstract:
A toner includes a core including a homogenized mixture of a first polyester latex, a styrene/acrylate latex, and a compatibilizing agent latex that includes a graft polyester-styrene/acrylate copolymer and a shell that includes a polyester latex. A process includes (1) homogenizing a mixture to form a plurality of core particles, the mixture including a first polyester latex, a styrene/acrylate latex, and a compatibilizing agent latex comprising a graft polyester-styrene/acrylate copolymer and (2) adding a shell polyester latex to the plurality of core particles to form a plurality of core-shell structures.
Abstract:
Inkjet printheads containing a first plate, a second plate, and a cured adhesive composition disposed between and bonding the first plate and the second plate. The cured adhesive composition has a glass transition temperature of greater than about 115° C. and is stable when exposed to acrylate monomer. Also, inkjet printheads having a first plate, a second plate, and a cured thin film adhesive disposed between and bonding to both of the first plate and the second plate. The cured thin film adhesive contains a polyimide film disposed between a cured first adhesive layer and a cured second adhesive layer. Methods of preparing such inkjet printheads.
Abstract:
The present disclosure describes poly(styrene/acrylate)-polyester hybrid particles, wherein poly(styrene/acrylate) polymers are polymerized and entangled within a polyester seed particle in an interpenetrating polymer network.
Abstract:
An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.