公开(公告)号：US08922412B1

公开(公告)日：2014-12-30

申请号：US13874040

申请日：2013-04-30

Applicant: Xilinx, Inc.

Inventor： Christopher M. Gorman ,  April M. Graham ,  John K. Jennings

IPC: H03M1/66

CPC classification number: H03M1/0604 ,  H03M1/662 ,  H03M1/742

Abstract: An apparatus relating generally to digital-to-analog conversion is disclosed. In such an apparatus, a digital-to-analog converter (“DAC”) device includes a source DAC and a sink DAC selectively coupled to one another. The source DAC provides a first bias to the sink DAC in a sink mode, and the sink DAC provides a second bias to the source DAC in a source mode.

Abstract translation: 公开了一般涉及数模转换的装置。 在这种装置中，数模转换器（“DAC”）装置包括一个选择性地耦合到彼此的源DAC和信宿DAC。 源DAC在宿模式中向宿DAC提供第一偏置，并且宿DAC在源模式中向源DAC提供第二偏置。

公开(公告)号：US09093987B1

公开(公告)日：2015-07-28

申请号：US13630486

申请日：2012-09-28

Applicant: Xilinx, Inc.

Inventor： Christopher M. Gorman

IPC: H03L5/00 ,  H03K3/012

CPC classification number: H03K3/012 ,  H03K19/018521

Abstract: A differential level shifter includes: a first PMOS transistor, wherein a source/drain of the first PMOS transistor is coupled to a first CMOS signal, a gate of the first PMOS transistor is coupled to ground, and another source/drain of the first PMOS transistor is coupled to a first output node; a second PMOS transistor, wherein a source/drain of the second PMOS transistor is coupled to a second CMOS signal, a gate of the second PMOS transistor is coupled to ground, and another source/drain of the second PMOS transistor is coupled to a second output node; and a shift component coupled between the first output node and the second output node.

Abstract translation: 差分电平移位器包括：第一PMOS晶体管，其中第一PMOS晶体管的源极/漏极耦合到第一CMOS信号，第一PMOS晶体管的栅极耦合到地，并且第一PMOS的另一个源极/漏极 晶体管耦合到第一输出节点; 第二PMOS晶体管，其中第二PMOS晶体管的源极/漏极耦合到第二CMOS信号，第二PMOS晶体管的栅极耦合到地，并且第二PMOS晶体管的另一个源极/漏极耦合到第二PMOS晶体管的第二 输出节点; 以及耦合在所述第一输出节点和所述第二输出节点之间的移位分量。

公开(公告)号：US09343418B2

公开(公告)日：2016-05-17

申请号：US14071865

申请日：2013-11-05

Applicant: Xilinx, Inc.

Inventor： Donnacha Lowney ,  Marites De La Torre ,  Christopher M. Gorman

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/14 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/1416 ,  H01L2224/14163 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/17517 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06568 ,  H01L2924/1425 ,  H01L2924/3511 ,  H01L2924/014

Abstract: An integrated circuit (IC) can include an analog region of a die of the IC. The analog region includes analog circuitry. The IC further includes a plurality of solder bumps implemented on a surface of the die in an area in vertical alignment with the analog region of the die.

Abstract translation: 集成电路（IC）可以包括IC的管芯的模拟区域。 模拟区域包括模拟电路。 IC还包括在与模具的模拟区域垂直对准的区域中在模具的表面上实现的多个焊料凸块。

公开(公告)号：US20150123265A1

公开(公告)日：2015-05-07

申请号：US14071865

申请日：2013-11-05

Applicant: Xilinx, Inc.

Inventor： Donnacha Lowney ,  Marites De La Torre ,  Christopher M. Gorman

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/1416 ,  H01L2224/14163 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/17517 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06568 ,  H01L2924/1425 ,  H01L2924/3511 ,  H01L2924/014

Abstract: An integrated circuit (IC) can include an analog region of a die of the IC. The analog region includes analog circuitry. The IC further includes a plurality of solder bumps implemented on a surface of the die in an area in vertical alignment with the analog region of the die.

Abstract translation: 集成电路（IC）可以包括IC的管芯的模拟区域。 模拟区域包括模拟电路。 IC还包括在与模具的模拟区域垂直对准的区域中在模具的表面上实现的多个焊料凸块。