公开(公告)号：US11708262B2

公开(公告)日：2023-07-25

申请号：US17687230

申请日：2022-03-04

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Yi-Hsien Chang ,  Chun-Ren Cheng ,  Wei-Cheng Shen ,  Wen-Chien Chen

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81B3/0013 ,  B81C1/00476 ,  B81C1/00666 ,  B81C1/00968 ,  B81C1/00984 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C2201/0105 ,  B81C2201/017 ,  B81C2201/0109 ,  B81C2201/0128 ,  B81C2201/0147 ,  B81C2201/0163 ,  B81C2201/053 ,  B81C2203/0792 ,  H04R2201/003

Abstract: A method of manufacturing a semiconductor structure includes following operations. A first substrate is provided. A plate is formed over the first substrate. The plate includes a first tensile member, a second tensile member, a semiconductive member between the first tensile member and the second tensile member, and a plurality of apertures penetrating the first tensile member, the semiconductive member and the second tensile member. A membrane is formed over and separated from the plate. The membrane include a plurality of holes. A plurality of conductive plugs passing through the plate or membrane are formed. A plurality of semiconductive pads are formed over the plurality of conductive plugs. The plate is bonded to a second substrate. The second substrate includes a plurality of bond pads, and the semiconductive pads are in contact with the bond pads.

公开(公告)号：US20230303387A1

公开(公告)日：2023-09-28

申请号：US18122872

申请日：2023-03-17

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Siarhei Dmitrievich Barsukou

IPC: B81B3/00 ,  H04R17/02 ,  H10N30/30 ,  B81C1/00

CPC classification number: B81B3/0021 ,  H04R17/02 ,  H10N30/308 ,  B81C1/00158 ,  H04R2201/003 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C2201/0174 ,  B81C2201/0163

Abstract: There is provided a piezoelectric microelectromechanical systems microphone comprising a sensor including at least one piezoelectric layer, at least one constraint in contact with the sensor at a position, such that the sensor is supported by the at least one constraint, and such that the sensor that the sensor has a membrane region to one side of the at least one constraint and a cantilevered region to the other side of the at least one constraint and a cavity defined at least partially by the at least one constraint. There is also provided a method of manufacturing the microphone.