公开(公告)号：US20190290921A1

公开(公告)日：2019-09-26

申请号：US16362043

申请日：2019-03-22

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Brian P. Hohl ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/35 ,  H01G4/12 ,  H01G4/008 ,  H01G4/236

Abstract: A filter feedthrough for an AIMD includes ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A first conductive pathway is hermetically sealed to and disposed through the insulator. A feedthrough capacitor is disposed on the device side and includes at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate within a capacitor dielectric. A capacitor active metallization is electrically connected to the active electrode plate and is in non-electrically conductive relation with the ground electrode plate. A capacitor ground metallization is electrically connected to the ground electrode plate and is in non-electrically conductive relation with the active electrode plate. An anisotropic conductive layer is disposed on the device side. The anisotropic conductive layer electrically connects the capacitor active metallization to the first conductive pathway.

公开(公告)号：US10272253B2

公开(公告)日：2019-04-30

申请号：US15797278

申请日：2017-10-30

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  H01B17/30 ,  A61N1/05

Abstract: A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.

公开(公告)号：US20180361164A1

公开(公告)日：2018-12-20

申请号：US16101639

申请日：2018-08-13

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  H02G3/22 ,  H01R43/00 ,  A61N1/05 ,  A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G2/10 ,  C22C29/12 ,  B23K35/30 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B22F3/02 ,  B22F3/04 ,  B22F3/15 ,  B22F2007/042 ,  B22F2999/00 ,  B23K35/3013 ,  B32B18/00 ,  C04B35/00 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/403 ,  C04B2237/72 ,  C22C1/0466 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

公开(公告)号：US10092749B2

公开(公告)日：2018-10-09

申请号：US15704657

申请日：2017-09-14

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/37 ,  H01G4/30 ,  H01G4/32 ,  A61N1/375 ,  H01G4/005 ,  H03H1/00 ,  H01G4/12 ,  H01G4/35

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

公开(公告)号：US09889306B2

公开(公告)日：2018-02-13

申请号：US14797123

申请日：2015-07-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: B01J20/34 ,  A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01G4/35 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  B22F2998/10 ,  C22C29/12 ,  H01G2/103 ,  H01G4/35 ,  H01R43/00 ,  Y10T156/1052 ,  B22F1/0059 ,  B22F3/10

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

公开(公告)号：US09692173B2

公开(公告)日：2017-06-27

申请号：US14747582

申请日：2015-06-23

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Michael F. Scalise

IPC: H01R13/52 ,  H01G4/35 ,  A61N1/375 ,  H01R13/426 ,  H01R13/719

CPC classification number: A61N1/3754 ,  H01G4/35 ,  H01R13/426 ,  H01R13/521 ,  H01R13/5224 ,  H01R13/719 ,  Y10T29/49204

Abstract: A feedthrough filter capacitor assembly comprising a terminal pin connector is described. The terminal pin connector is designed to facilitate an electrical connection between the terminal pin comprising a multitude of compositions to a circuit board of an implantable medical device. The terminal pin connector comprises a clip portion positioned within a connector housing. The connector clip mechanically attaches to the terminal pin of the feedthrough with at least one prong and an exterior surface of the connector housing electrically contacts the circuit board, creating an electrical connection therebetween. The connector housing comprises a material that is conducive to a weld or solder attachment process to the circuit board. The feedthrough filter capacitor assembly is particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

公开(公告)号：US20160151635A1

公开(公告)日：2016-06-02

申请号：US14556239

申请日：2014-12-01

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Thomas Marzano ,  Xiaohong Tang ,  William C. Thiebolt ,  Keith W. Seitz

IPC: A61N1/39 ,  A61N1/08 ,  A61N1/362

CPC classification number: A61N1/3968 ,  A61N1/086 ,  A61N1/362 ,  A61N1/3718 ,  A61N1/3754 ,  H03H1/00 ,  H03H7/0107 ,  H03H7/1758 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/005 ,  H03H2001/0085 ,  H03H2007/013

Abstract: A hermetic terminal assembly for an AIMD includes a shielded three-terminal flat-through EMI energy dissipating filter and a hermetically sealed feedthrough configured to be attachable to the ferrule or AIMD housing. The flat-through filter includes a first shield plate, an active electrode plate, and a second shield plate where the shield plates are electrically coupled to a metallization which in turn is coupled either to the ferrule or AIMD housing. The feedthrough includes an alumina substrate comprised of at least 96% alumina and a via hole with a substantially closed pore and substantially pure platinum fill. The platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill, wherein the platinum fill is electrically coupled to at least one active electrode plate in non-conductive relationship to the at least one first and second shield plates.

Abstract translation: 用于AIMD的密封端子组件包括屏蔽的三端子平通EMI消散滤波器和被配置为可附接到套圈或AIMD壳体的密封馈通。 平通过滤器包括第一屏蔽板，有源电极板和第二屏蔽板，其中屏蔽板电耦合到金属化，金属化层又连接到套圈或AIMD壳体。 馈通包括由至少96％的氧化铝组成的氧化铝衬底和具有基本上闭孔的通孔和基本上纯的铂填充物。 铂填充物在氧化铝基底和铂填充物之间形成曲折且相互共形的编织物或界面，其中铂填充物与非至少一个第一和第二屏蔽板的非导电关系电耦合到至少一个有源电极板 。

公开(公告)号：US09233253B2

公开(公告)日：2016-01-12

申请号：US13743276

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: H01G4/35 ,  A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

公开(公告)号：US20140036409A1

公开(公告)日：2014-02-06

申请号：US13743276

申请日：2013-01-16

Applicant: GREATBATCH LTD.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。