摘要:
A system and method for controlling game play at a pay-for-play entertainment system. The entertainment system may include an entertainment unit, a remote activation unit, and at least one game play light source. The remote activation unit may be configured to have the game play light source be in an on condition during purchased game play and in an off condition when purchased game play time or credits have expired. The present invention may also include a game play detection apparatus that may detect game play activity. The detection of game play may be communicated to the remote activation unit to determine if the detected game play activity is associated with purchased game play. If the detected game play activity is unauthorized, i.e. the game play has not been purchased, the remote activation unit may communicate an “on” signal to an auxiliary light and/or speaker.
摘要:
A method for play of a parlor entertainment unit including a remote activation assembly and an activation-sensing unit. The activation-sensing unit, which may be battery operated and housed in the entertainment unit, may be in an energy-conserving sleep mode until the activation-sensing unit receives a wake-up signal. In one embodiment, the wake-up signal may be generated by the engagement of an activation mechanism, such as a coin slide. After being awoken, the activation-sensing unit may transmit an inquiry to the remote activation assembly as to whether the associated entertainment unit has been selected for play and/or whether there is a sufficient number of credits available for play. If that entertainment unit has not been selected for play, the activation-sensing unit may return to a sleep mode. However, if sufficient play credits are available for the entertainment unit, play may commence.
摘要:
Aluminum or aluminum alloy on each of a pair of semiconductor wafers is thermocompression bonded. Aluminum-based seal rings or electrical interconnects between layers may be thus formed. On a MEMS device, the aluminum-based seal ring surrounds an area occupied by a movably attached microelectromechanical structure. According to a manufacturing method, wafers have an aluminum or aluminum alloy deposited thereon are etched to form an array of aluminum-based rings. The wafers are placed so as to bring the arrays of aluminum-based rings into alignment. Heat and compression bonds the rings. The wafers are singulated to separate out the individual semiconductor devices each with a bonded aluminum-based ring.
摘要:
A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
摘要:
A method and a system for measuring the velocity of a projectile. The method and system employ sensors that uses magnetoresistive sensing elements to measure the velocity of a projectile. Two magnetoresistive based sensors may be used to sense a time at which a projectile crosses a sense path associated with each of the sensors. Because the sensors employ magnetoresistive sensing elements, high quality voltage signals are produced, allowing accurate time measurements to be calculated. Accordingly, the velocity of the projectile can be determined by using these time measurements along with a measured spacing distance between the sensors.
摘要:
A capacitive sensor including a housing having a hermetically sealed cavity, a plate in the cavity, a diaphragm forming a part of the cavity and spaced from the plate, a conductive layer on the first diaphragm, and a second conductive layer on the plate, the first and second conductive layers being the electrodes of a capacitor whose capacitance varies with the position of the diaphragm relative to the plate.
摘要:
This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.
摘要:
An optically transparent conductive material is used for static dissipation of a cover material for an optical switching device. The optically transparent conductive material is deposited directly or indirectly on the cover material. The optically transparent conductive material forms an electrically continuous film. The optically transparent conductive material can also be used for anti-reflection.
摘要:
A computer jukebox capable of receiving and storing advertisement data representing a plurality of advertisement from a remote central management system by way of a transmission link between the computer jukebox and the central management system, comprising a communication interface, a programmable computer memory and a processor. The computer jukebox downloads advertisement data. The communication interface receives advertisement data from the remote central management system by way of the transmission link. The advertisement data represents an identity of each of the plurality of advertisements, and data representing times for each of the advertisements to be run. The programmable computer memory stores the advertisement data. The processor runs the plurality of advertisements according to the advertisement data.
摘要:
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.