公开(公告)号：US08014150B2

公开(公告)日：2011-09-06

申请号：US12491281

申请日：2009-06-25

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/34

CPC分类号： H05K7/20809 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K7/203 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2224/0401

摘要： Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins.

摘要翻译： 冷却的电子模块和制造方法设置有电子装置的泵增强的介电流体浸没冷却。 冷却的电子模块包括支撑要冷却的电子设备的基板。 冷却装置耦合到基板，并且包括构造成至少部分围绕电子装置围绕并形成密封隔室的壳体。 此外，冷却装置包括介电流体和设置在密封室内的一个或多个泵。 电介质流体与电子设备直接接触，泵是一种冲击冷却浸入式泵，其设置成主动地将密封隔室内的介电流体泵向电子设备。 多个冷凝器翅片从壳体延伸到密封隔室的上部的密封隔室中，并且液冷冷板或风冷散热器联接到壳体的顶部以冷却冷凝器翅片。

公开(公告)号：US07967062B2

公开(公告)日：2011-06-28

申请号：US11424642

申请日：2006-06-16

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith E. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith E. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/3677 ,  H01L2224/78301 ,  Y10T29/49128 ,  Y10T29/4935 ,  H01L2924/00014

摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

摘要翻译： 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并部分地延伸在较低热通量的第二区域上，其中第一和第二区域是待冷却表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

公开(公告)号：US07916483B2

公开(公告)日：2011-03-29

申请号：US12256605

申请日：2008-10-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20236

摘要： A method and associated assembly is provided for cooling of a computing embodiment having electronic components. The heat generating components are disposed in the vicinity of at least one cold plate providing direct liquid cooling. Coolant is provided to the cold plate which will eventually exit it through one or more ports or orifices placed on the sides or both side and bottom of the cold plate. The placement, size and number of port(s) or orifice(s) can be selectively adjusted to control amount of coolant flow. Effluent flow from the cold plate flows over the remaining immersion cooled components and then exits the liquid tight enclosure which houses the electronic components.

摘要翻译： 提供了一种用于冷却具有电子部件的计算实施例的方法和相关组件。 发热部件设置在提供直接液体冷却的至少一个冷板的附近。 将冷却剂提供给冷板，冷板最终将通过设置在冷板的侧面或两侧和底部的一个或多个端口或孔排出。 可以选择性地调节端口或孔口的布置，尺寸和数量以控制冷却剂流量。 来自冷板的流出物流过剩余的浸没冷却部件，然后离开容纳电子部件的液体密封外壳。

公开(公告)号：US07885070B2

公开(公告)日：2011-02-08

申请号：US12256631

申请日：2008-10-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20809

摘要： Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof.

摘要翻译： 提供了用于促进具有多种不同类型的电子部件的电子系统的抽吸，浸没冷却的装置和方法。 该装置包括容纳尺寸以容纳电子系统的容器，冷却剂入口和冷却剂出口，用于促进冷却剂通过容器的入口和出口，以及与容器相关联的歧管结构。 歧管结构包括具有与冷却剂入口端口流体连通的入口开口的冷却剂喷射增压室和与冷却剂喷射气室流体连通的一个或多个喷射孔。 喷射孔定位成当电子系统可操作地定位在容器内以进行浸入冷却时，通过喷射冲击其上的冷却剂来促进对多种不同类型电子部件的至少一个电子部件的冷却。

公开(公告)号：US20100313590A1

公开(公告)日：2010-12-16

申请号：US12481824

申请日：2009-06-10

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. Simons

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. Simons

IPC分类号： F25D23/00 ,  F28F9/007 ,  F28D15/00 ,  B23P15/26

CPC分类号： H05K7/20809 ,  H05K7/20781 ,  Y10T29/49359

摘要： Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.

摘要翻译： 提供液冷电子机架和制造方法，其中基于液体的冷却装置便于当对接在电子机架内时电子子系统的冷却。 冷却装置包括安装在机架前部的液冷式冷却结构和多个传热元件。 冷却结构是导热材料，其具有用于促进冷却剂流过结构的冷却剂输送通道。 每个传热元件连接到相应电子子系统的一个或多个发热部件，当该电子子系统对接在机架内时，物理地接触冷却结构，并且提供从电子子系统的发热部件的热传输路径 到液冷的冷却结构。 有利地，电子子系统可以对准在电子机架内或从电子机架排出，而不会影响冷却剂通过液冷式冷却结构的流动。

公开(公告)号：US07787248B2

公开(公告)日：2010-08-31

申请号：US11426423

申请日：2006-06-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01B9/06 ,  F25D23/12 ,  B05B7/06

CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2924/00

摘要： A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

摘要翻译： 提供多流体冷却系统及其制造方法，用于从一个或多个电子设备去除热量。 冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上 以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。 当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

公开(公告)号：US07660121B2

公开(公告)日：2010-02-09

申请号：US12274459

申请日：2008-11-20

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

摘要翻译： 提供冷却系统和方法来冷却离开数据中心的一个或多个电子机架的空气。 冷却系统包括与数据中心的至少一个相应的电子机架分离和独立的至少一个冷却站，并且被配置为用于设置与其相邻的电子机柜的空气出口侧，用于冷却从电子机架排出空气。 冷却站包括从相应的电子机架分离和独立的框架结构，以及由框架结构支撑的空气对液体热交换组件。 热交换组件包括入口和出口，其构造成分别耦合到冷却剂供应源和冷却剂返回管线，以便于冷却剂通过其中。 空气 - 液体热交换组件的尺寸设定为在排出到数据中心之前冷却从相应的电子机架的空气出口侧排出的空气。

公开(公告)号：US07642914B2

公开(公告)日：2010-01-05

申请号：US11855185

申请日：2007-09-14

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： G08B13/14

CPC分类号： G01S13/876

摘要： Automated locating of electronics racks within a data center room is provided. The automated approach employs n wireless identification units associated with respective electronics racks of the data center, and first and second transceiver units positioned within the data center along a common plane at known X,Y locations. A monitor unit is in communication with the transceiver units, and automatically determines X,Y location within the data center room of each respective electronics rack employing, in part, first time differentials between transmission of a first broadcast signal by the first transceiver unit and receipt of response signals from the wireless identification units, second time differentials between transmission of a second broadcast signal from the second transceiver unit and receipt of response signals thereto from the wireless identification units, and the known X,Y locations within the data center of the transceiver units.

摘要翻译： 提供数据中心室内电子机架的自动定位。 自动化方法采用与数据中心的相应电子机架相关联的n个无线识别单元，以及沿着已知X，Y位置处的公共平面定位在数据中心内的第一和第二收发器单元。 监视器单元与收发器单元通信，并且自动地确定每个相应电子机架的数据中心室内的X，Y位置，其部分地采用第一收发器单元发送第一广播信号和接收之间的第一时差 来自无线识别单元的响应信号，来自第二收发器单元的第二广播信号的传输和从无线识别单元接收的响应信号之间的第二时间差以及收发器的数据中心内的已知X，Y位置 单位。

公开(公告)号：US07639499B1

公开(公告)日：2009-12-29

申请号：US12168259

申请日：2008-07-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。

公开(公告)号：US07511957B2

公开(公告)日：2009-03-31

申请号：US11420241

申请日：2006-05-25

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： F28C3/08 ,  F28F7/00 ,  H01L23/4735 ,  H01L2224/73253 ,  Y10S165/908

摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

摘要翻译： 使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。 冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。 由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。 返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面 其中基面被密封到待冷却的表面。