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公开(公告)号：US11276731B2
公开(公告)日：2022-03-15
申请号：US16534952
申请日：2019-08-07
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Anna Maria Conti
IPC: H01L27/24 , H01L27/11514 , H01L21/3213 , H01L21/768 , H01L23/528 , H01L45/00
Abstract: Methods, systems, and devices for access line formation for a memory array are described. The techniques described herein may be used to fabricate access lines for one or more decks of a memory array. In some examples, one or more access lines of a deck may be formed using an independent processing step. For example, different fabrication processes may be used to form a plurality of access lines in a deck and to form the pillars (e.g., the memory cells) that are coupled with the access lines. In some examples, an offset between the access lines and the pillars may exist due to the components being fabricated in different processing steps.
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公开(公告)号：US11222762B2
公开(公告)日：2022-01-11
申请号：US16375701
申请日：2019-04-04
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Giorgio Servalli
Abstract: Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.
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公开(公告)号：US11145342B2
公开(公告)日：2021-10-12
申请号：US16998346
申请日：2020-08-20
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli
Abstract: Methods, systems, and devices for a decoder are described. The memory device may include a substrate, an array of memory cells coupled with the substrate, and a decoder coupled with the substrate. The decoder may include a doped material that may extend between a first conductive line and an access line of the array of memory cells in a first direction (e.g., away from a surface of the substrate) and the doped material may be configured to selectively couple the first conductive line of the decoder with the access line of the array of memory cells. The access line may be coupled with two decoders, in some cases.
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公开(公告)号：US11120870B2
公开(公告)日：2021-09-14
申请号：US16998240
申请日：2020-08-20
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Innocenzo Tortorelli , Agostino Pirovano , Fabio Pellizzer
Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.
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公开(公告)号：US20210273015A1
公开(公告)日：2021-09-02
申请号：US17320785
申请日：2021-05-14
Applicant: Micron Technology, Inc.
Inventor： Anna Maria Conti , Andrea Redaelli , Agostino Pirovano
Abstract: An example three-dimensional (3-D) memory array includes a first plurality of conductive lines separated from one other by an insulation material, a second plurality of conductive lines, and a plurality of pairs of conductive pillars arranged to extend substantially perpendicular to the first plurality of conductive lines and the second plurality of conductive lines. The conductive pillars of each respective pair are coupled to a same conductive line of the second plurality of conductive lines. A storage element material is formed partially around the conductive pillars of each respective pair.
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Patent Agency Ranking
公开(公告)号：US20210264956A1
公开(公告)日：2021-08-26
申请号：US17193227
申请日：2021-03-05
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Fabio Pellizzer
Abstract: Methods, systems, and devices for a decoder are described. The memory device may include a substrate, an array of memory cells coupled with the substrate, and a decoder coupled with the substrate. The decoder may be configured to apply a voltage to an access line of the array of memory cells as part of an access operation. The decoder may include a first conductive line configured to carry the voltage applied to the access line of the array of memory cells. In some cases, the decoder may include a doped material extending between the first conductive line and the access line of the array of memory cells in a first direction (e.g., away from a surface of the substrate) and the doped material may be configured to selectively couple the first conductive line of the decoder with the access line of the array of memory cells.
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公开(公告)号：US11094377B2
公开(公告)日：2021-08-17
申请号：US16711361
申请日：2019-12-11
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Innocenzo Tortorelli , Agostino Pirovano , Fabio Pellizzer
Abstract: Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.
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公开(公告)号：US20210134885A1
公开(公告)日：2021-05-06
申请号：US17144669
申请日：2021-01-08
Applicant: Micron Technology, Inc.
Inventor： Fabio Pellizzer , Innocenzo Tortorelli , Agostino Pirovano , Andrea Redaelli
Abstract: The present disclosure includes three dimensional memory arrays, and methods of processing the same. A number of embodiments include a plurality of conductive lines separated from one other by an insulation material, a plurality of conductive extensions arranged to extend substantially perpendicular to the plurality of conductive lines, and a storage element material formed around each respective one of the plurality of conductive extensions and having two different contacts with each respective one of the plurality of conductive lines, wherein the two different contacts with each respective one of the plurality of conductive lines are at two different ends of that respective conductive line.
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公开(公告)号：US20200327940A1
公开(公告)日：2020-10-15
申请号：US16863175
申请日：2020-04-30
Applicant: Micron Technology, Inc.
Inventor： Innocenzo Tortorelli , Andrea Redaelli , Agostino Pirovano , Fabio Pellizzer , Mario Allegra , Paolo Fantini
Abstract: Methods, systems, and devices related to techniques to access a self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more time durations during which a fixed level of voltage or current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.
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公开(公告)号：US10803934B2
公开(公告)日：2020-10-13
申请号：US16185154
申请日：2018-11-09
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Innocenzo Tortorelli , Agostino Pirovano , Fabio Pellizzer
Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.
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