Nonvolatile semiconductor memory device and method of manufacturing the same
    92.
    发明授权
    Nonvolatile semiconductor memory device and method of manufacturing the same 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08148769B2

    公开(公告)日:2012-04-03

    申请号:US12534576

    申请日:2009-08-03

    IPC分类号: H01L29/788

    摘要: A nonvolatile semiconductor memory device includes a plurality of memory strings, each of which has a plurality of electrically rewritable memory cells connected in series; and select transistors, one of which is connected to each of ends of each of the memory strings. Each of the memory strings is provided with a first semiconductor layer having a pair of columnar portions extending in a perpendicular direction with respect to a substrate, and a joining portion formed so as to join lower ends of the pair of columnar portions; a charge storage layer formed so as to surround a side surface of the columnar portions; and a first conductive layer formed so as to surround the side surface of the columnar portions and the charge storage layer, and configured to function as a control electrode of the memory cells. Each of the select transistors is provided with a second semiconductor layer extending upwardly from an upper surface of the columnar portions; and a second conductive layer formed so as to surround a side surface of the second semiconductor layer with a gap interposed, and configured to function as a control electrode of the select transistors.

    摘要翻译: 非易失性半导体存储器件包括多个存储串,每个存储串具有串联连接的多个电可重写存储单元; 并选择晶体管,其中一个连接到每个存储器串的每一端。 每个存储器串都具有第一半导体层,该第一半导体层具有相对于衬底在垂直方向上延伸的一对柱状部分,以及形成为连接该一对柱状部分的下端的接合部分; 形成为围绕所述柱状部的侧面的电荷存储层; 以及形成为围绕柱状部分的侧面和电荷存储层的第一导电层,并且被配置为用作存储单元的控制电极。 每个选择晶体管设置有从柱状部分的上表面向上延伸的第二半导体层; 以及第二导电层,其被形成为以间隔开的方式围绕所述第二半导体层的侧表面,并且被配置为用作所述选择晶体管的控制电极。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    93.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
    非易失性半导体存储器件

    公开(公告)号:US20110233644A1

    公开(公告)日:2011-09-29

    申请号:US12839895

    申请日:2010-07-20

    IPC分类号: H01L29/792

    摘要: According to one embodiment, a nonvolatile semiconductor memory device includes first and second stacked structural bodies, first and second semiconductor pillars, a memory unit connection portion, a selection unit stacked structural body, first and second selection unit semiconductor pillars, a selection unit connection portion, and first to fifth interconnections. The semiconductor pillars pierce the stacked structural bodies. The first and second interconnections are connected to the first and second semiconductor pillars, respectively. The memory unit connection portion connects the first and second semiconductor pillars. The selection unit semiconductor pillars pierce the selection unit stacked structural body. The third and fourth interconnections are connected to the first and second selection unit semiconductor pillars, respectively. The selection unit connection portion connects the first and second selection unit semiconductor pillars. The fifth interconnection is connected to the third interconnection on a side opposite to the selection unit stacked structural body.

    摘要翻译: 根据一个实施例,非易失性半导体存储器件包括第一和第二堆叠结构体,第一和第二半导体柱,存储单元连接部分,选择单元堆叠结构体,第一和第二选择单元半导体柱,选择单元连接部分 ,以及第一至第五互连。 半导体支柱刺穿堆叠的结构体。 第一和第二互连分别连接到第一和第二半导体柱。 存储单元连接部分连接第一和第二半导体柱。 选择单元半导体柱刺穿选择单元堆叠结构体。 第三和第四互连分别连接到第一和第二选择单元半导体柱。 选择单元连接部分连接第一和第二选择单元半导体柱。 第五互连在与选择单元堆叠结构体相反的一侧连接到第三互连。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    99.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20100109072A1

    公开(公告)日:2010-05-06

    申请号:US12563832

    申请日:2009-09-21

    IPC分类号: H01L27/115 H01L21/8246

    摘要: A nonvolatile semiconductor memory device includes a first stacked body on a silicon substrate, and a second stacked body is provided thereon. The first stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a first portion of a through-hole extending in a stacking direction is formed. The second stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a second portion of the through-hole is formed. A memory film is formed on an inner face of the through-hole, and a silicon pillar is buried in an interior of the through-hole. A central axis of the second portion of the through-hole is shifted from a central axis of the first portion, and a lower end of the second portion is positioned lower than an upper portion of the first portion.

    摘要翻译: 非易失性半导体存储器件包括在硅衬底上的第一层叠体,并且在其上设置第二层叠体。 第一堆叠体包括交替层叠有多个电极膜的多个绝缘膜,并且形成沿堆叠方向延伸的通孔的第一部分。 第二堆叠体包括交替层叠有多个电极膜的多个绝缘膜,并且形成通孔的第二部分。 在通孔的内表面上形成记忆膜,并且将硅柱埋在通孔的内部。 通孔的第二部分的中心轴线从第一部分的中心轴线偏移,并且第二部分的下端位于比第一部分的上部更低的位置。