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106 条记录 (耗时 0.027 秒)

    Cooling jacket
    91.
    发明授权
    Cooling jacket 失效
    冷却套

    公开(公告)号：US07516777B2

    公开(公告)日：2009-04-14

    申请号：US11393783

    申请日：2006-03-31

    申请人： Shuichi Terakado ,  Atsuo Nishihara ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa

    发明人： Shuichi Terakado ,  Atsuo Nishihara ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  F28F3/12 ,  F28F13/06 ,  G06F2200/201

    摘要： In an electronic apparatus having a heat-generating element therein, a cooling jacket 100 for transmitting heat generated from the heat-generating element 200 into to a liquid coolant flowing therein, comprises: a cover 130 building up a heat transfer surface to be in contact with a surface of the heat-generating element; a passage 110 for the liquid coolant, which is formed neighboring with the heat transfer surface and wound round in a “S”-like manner within an inside of a main body 120 of the cooling jacket; and an inlet 111 and an outlet 112 attached at both ends of the flow passage of the liquid coolant, and further a dispersion member 150 is disposed in the flow passage, being built up by gathering a plural number of members, each of which has a “U”-like cross-section of an aspect ratio from 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element thereto with high efficiency, and thereby enabling to cool down the heat-generating element, fully, even with a relatively small amount or volume of the liquid coolant.

    摘要翻译： 在其中具有发热元件的电子设备中，用于将从发热元件200产生的热量传递到其中流动的液体冷却剂的冷却套100包括：盖130，其构成接触的传热表面 具有发热元件的表面; 用于液体冷却剂的通道110，其与传热表面相邻形成并以“S”形的方式在冷却套的主体120的内部内缠绕; 以及安装在液体冷却剂的流路的两端的入口111和出口112，并且在流路中设置分散构件150，该分散构件150通过聚集多个构件而构成，每个构件具有 “U”型横截面的纵横比为10至20，从而使液体冷却剂在其中扩散，从而高效率地将来自发热元件的热​​量转移到其中，从而能够冷却热源， 甚至具有相对少量或体积的液体冷却剂。

    Cooling jacket
    93.
    发明申请
    Cooling jacket 失效

    公开(公告)号：US20060219388A1

    公开(公告)日：2006-10-05

    申请号：US11393783

    申请日：2006-03-31

    申请人： Shuichi Terakado ,  Atsuo Nishihara ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa

    发明人： Shuichi Terakado ,  Atsuo Nishihara ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa

    IPC分类号： F28F7/00

    CPC分类号： G06F1/203 ,  F28F3/12 ,  F28F13/06 ,  G06F2200/201

    摘要： In an electronic apparatus having a heat-generating element therein, a cooling jacket 100 for transmitting heat generated from the heat-generating element 200 into to a liquid coolant flowing therein, comprises: a cover 130 building up a heat transfer surface to be in contact with a surface of the heat-generating element; a passage 110 for the liquid coolant, which is formed neighboring with the heat transfer surface and wound round in a “S”-like manner within an inside of a main body 120 of the cooling jacket; and an inlet 111 and an outlet 112 attached at both ends of the flow passage of the liquid coolant, and further a dispersion member 150 is disposed in the flow passage, being built up by gathering a plural number of members, each of which has a “U”-like cross-section of an aspect ratio from 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element thereto with high efficiency, and thereby enabling to cool down the heat-generating element, fully, even with a relatively small amount or volume of the liquid coolant.

    Electronic apparatus having liquid cooling system therein
    94.
    发明申请
    Electronic apparatus having liquid cooling system therein 审中-公开
    具有液体冷却系统的电子设备

    公开(公告)号：US20050180107A1

    公开(公告)日：2005-08-18

    申请号：US10933327

    申请日：2004-09-03

    申请人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Atsuo Nishihara

    发明人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Atsuo Nishihara

    IPC分类号： F25D9/00 ,  G06F1/20 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H05K7/20009 ,  F28D2021/0031 ,  G06F1/203 ,  G06F2200/203 ,  H01L23/4332 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： For providing an electronic apparatus, having a cooling system therein, for enabling cooling operation of a CPU 200, which is mounted within a housing 100 of the apparatus and needs cooling thereof, the cooling system for cooling the CPU has a cooling jacket 50, a radiator 60, and a circulation pump 70, wherein conduits for conducting the liquid coolant into the cooling jacket are made from a metal-made tube, and the tubes are formed into spiral-like in the configuration, or bellows are formed on the way thereof, to be freely disposable within the housing, thereby causing no obstacle in the operations when assembling the apparatus and/or making maintenance thereon.

    摘要翻译： 为了提供一种在其中具有冷却系统的电子设备，用于使得CPU 200的冷却操作能够安装在设备的壳体100中并且需要冷却，用于冷却CPU的冷却系统具有冷却套50， 散热器60和循环泵70，其中用于将液体冷却剂导入冷却套管的导管由金属制成的管制成，并且管形成螺旋状的构造，或者波纹管在其路上形成 能够在壳体内自由地一次性，从而在组装设备时不会产生障碍物和/或对其进行维护。

    Liquid cooling system and electronic apparatus having the same therein
    95.
    发明申请
    Liquid cooling system and electronic apparatus having the same therein 审中-公开
    液体冷却系统及其中具有相同的电子设备

    公开(公告)号：US20050180106A1

    公开(公告)日：2005-08-18

    申请号：US10933221

    申请日：2004-09-03

    申请人： Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Atsuo Nishihara

    发明人： Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Atsuo Nishihara

    IPC分类号： F25D9/00 ,  F28F1/22 ,  F28F13/02 ,  F28F13/06 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

    CPC分类号： F28F3/12 ,  F28D2021/0029 ,  F28F1/22 ,  F28F13/02 ,  F28F13/06 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： For providing an electronic apparatus, having a cooling system therein, for enabling cooling operation of a CPU 200, which is mounted within a housing 100 of the apparatus and needs cooling thereof, the cooling system for cooling the CPU has a cooling jacket 50, a radiator 60, and a circulation pump 70, wherein the cooling jacket comprises a base-plate portion 51, being made of a material superior in heat transfer, such as, copper or the like, and formed with a flow inlet 54 and a flow outlet 55 for the liquid coolant, as well as, a flow passage formed in “U” or “I” shape within an inside thereof, and a cover portion 52, and in a portion of the flow passage of the “U” or “I” shape is disposed a coolant division portion 56 or/and 57, being made up by combining a plural number of pieces of fine tubes in a bundle, each of which is also made of a material superior in the heat transfer, such as copper or the like, through brazing.

    摘要翻译： 为了提供一种在其中具有冷却系统的电子设备，用于使得CPU 200的冷却操作能够安装在设备的壳体100中并且需要冷却，用于冷却CPU的冷却系统具有冷却套50， 散热器60和循环泵70，其中冷却套包括基板部分51，该基板部分51由诸如铜等的传热性优异的材料制成，并且形成有流入口54和流出口 55表示液体冷却剂，以及在其内部形成为“U”或“I”形的流路以及盖部分52，并且在“U”或“I”的流动通道的一部分 “形状设置有冷却剂分配部分56或/和57，其通过组合多束细束的细管而组成，每个细管也由传热优良的材料制成，例如铜或 类似，通过钎焊。

    Liquid cooling system and an electronic apparatus having the same therein
    96.
    发明申请
    Liquid cooling system and an electronic apparatus having the same therein 有权
    液体冷却系统及其电子设备

    公开(公告)号：US20050178533A1

    公开(公告)日：2005-08-18

    申请号：US11023431

    申请日：2004-12-29

    申请人： Rintaro Minamitani ,  Shigeo Ohashi ,  Takashi Naganawa ,  Shinji Matsushita ,  Hironori Oikawa

    发明人： Rintaro Minamitani ,  Shigeo Ohashi ,  Takashi Naganawa ,  Shinji Matsushita ,  Hironori Oikawa

    IPC分类号： F25D1/00 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  F28D15/00

    CPC分类号： H01L23/473 ,  G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a liquid cooling system, comprising: a heat-receiving jacket for receiving heat from a heat-generation body therein; a heat-radiator for radiating the heat therefrom, which is received within the heat-receiving jacket; and a tank for accumulating refrigerant therein, which is connected with the heat-receiving jacket and the heat-radiator through flow passages, thereby enclosing a refrigerant within the heat-receiving jacket, the heat-radiator and the tank, including the flow passages provided therebetween, and further comprising: a liquid transfer means for generating a circulation flow of the refrigerant enclosed therein, wherein the tank 14 is built up on one side surface of a substrate 15 having superior heat-conductivity and heat-resistance, defined between a flexible film or sheet 16 or 23 having superior heat-conductivity and heat-resistance, and the heat-radiator having a heat-radiation flow passage 9 on the other side surface thereof, defined between the flexible film or sheet 16 or 23 having superior heat-conductivity and heat-resistance.

    摘要翻译： 在液体冷却系统中，包括：用于从其中的发热体接收热量的受热夹套; 用于从其中散热的散热器，其被容纳在受热套中; 以及用于在其中积聚制冷剂的罐，其通过流动通道与受热套和散热器连接，从而将包含流动通道的受热套，散热器和箱内的制冷剂包围， 并且还包括：液体转移装置，用于产生封闭在其中的制冷剂的循环流动，其中罐14构建在具有优异的导热性和耐热性的基材15的一个侧表面上，该基材15具有柔性 具有优异的导热性和耐热性的薄膜或薄片16或23，并且散热器在其另一个侧表面上具有限定在具有优异的耐热性的柔性薄膜或薄片16或23之间的散热流道9， 导电性和耐热性。

    Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof
    97.
    发明申请
    Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof 审中-公开
    具有冷却系统的电子设备，其散热器及其制造方法

    公开(公告)号：US20050178528A1

    公开(公告)日：2005-08-18

    申请号：US10792689

    申请日：2004-03-05

    申请人： Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Atsuo Nishihara

    发明人： Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Atsuo Nishihara

    IPC分类号： F25D9/00 ,  F25B21/02 ,  F28D1/053 ,  F28F9/18 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

    CPC分类号： F28F9/182 ,  F28D1/05333 ,  F28D2021/0029 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20009

    摘要： In an electronic apparatus having a liquid cooling system, and enabling to obtain the optical cooling characteristic or capacitor with an aid of a radiator, which can be disposed or located fitting to a narrow space within a housing thereof, wherein a CPU 200 in deed of cooling thereof is installed within the housing 100, and the liquid cooling system for cooling the CPU comprises a cooling jacket 50 and a radiator therein, and wherein the radiator has a pair of headers 62 and 62, being constructed with disposing a large number of metal thin tubes 61, 61 . . . therebetween, aligning in parallel to each other, and can be change in an outer configuration thereof, easily and freely, and therefore it can be positioned even in the narrow space. Further, a cooling fan 64 or 66 for cooling the radiator 60 compulsively may be disposed therein, and in that case; it is also possible to maintain a position for setting up a motor 65 or 67 for rotationally driving the fan, including therein.

    摘要翻译： 在具有液体冷却系统的电子设备中，借助散热器能够获得光学冷却特性或电容器，该散热器可被布置或定位成与壳体内的狭窄空间配合，其中，CPU 200 其冷却安装在壳体100内，并且用于冷却CPU的液体冷却系统包括冷却套管50和散热器，并且其中散热器具有一对集管62和62，其构造为设置大量金属 细管61,61。 。 。 在它们之间，彼此平行对准，并且可以容易且自由地改变其外部构造，因此它也可以被定位在狭窄的空间中。 此外，可以强制地冷却散热器60的冷却风扇64或66，在这种情况下， 还可以保持用于设置用于旋转地驱动风扇的马达65或67的位置，包括其中。

    Electronic equipment
    100.
    发明授权
    Electronic equipment 失效
    电子设备

    公开(公告)号：US06449149B1

    公开(公告)日：2002-09-10

    申请号：US09057339

    申请日：1998-04-09

    申请人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

    发明人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

    IPC分类号： G06F116

    CPC分类号： G06F1/203 ,  G06F2200/203

    摘要： An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

    摘要翻译： 电子设备包括：第一壳体，其上安装有键盘和布线板;第二壳体，其通过铰链可旋转地安装在第一壳体上。 电子设备的冷却结构包括作为第一壳体内的冷却对象的一个​​或多个元件，与该元件和第一壳体热连接的第一加热排放构件，第二加热排出构件，其布置在 第二壳体的内部和用于热连接第一散热元件和第二散热元件的连接装置。