公开(公告)号：US10827654B2

公开(公告)日：2020-11-03

申请号：US16016659

申请日：2018-06-25

Applicant: Honda Motor Co., Ltd.

Inventor： Hideo Kimura ,  Yoshinaka Hirata

IPC: B60K6/20 ,  H05K7/20 ,  B60K6/22 ,  H05K7/02 ,  B60R16/03 ,  B60K6/54

Abstract: A cooling device which can arrange a cooling water tank in parallel near an electric power control device, and can more effectively utilize a space inside the engine room, and by which the miniaturization of the engine room is realized, and temperature increase of the wiring can be suppressed. The cooling device is a cooling device for cooling a device of a vehicle including an electric power control device to control an input-output voltage of the vehicle and a wiring connected to the electric power control device, and includes cooling water for cooling the device of the vehicle and a cooling water tank for accommodating the cooling water; the cooling water tank has a dented side surface wall along an external shape of the wiring, and has a shape which covers at least a portion of the wiring by closely disposing the wiring along the dented side surface wall.

公开(公告)号：US10826207B2

公开(公告)日：2020-11-03

申请号：US16658277

申请日：2019-10-21

Applicant: Weidmüller Interface GmbH & Co. KG

Inventor： Stephan Wright ,  Jürgen Ude ,  Andreas Muhs ,  Volker Schröder ,  Sascha Nolte

IPC: H01R12/70 ,  H01R12/57 ,  H01R12/58 ,  H01R13/74 ,  H01R12/51 ,  H05K7/02 ,  H01R12/72 ,  H05K1/14 ,  H01R13/66

Abstract: An electrical connector includes a housing which can be electrically connected on a connection side to an electrical connection part. On a contact side, one or more contacts are provided to electrically contact one or more counter-contacts of a printed circuit board. At least one latching peg assembly including two functional elements passes through an opening of the printed circuit board and can be moved by an actuation element from a non-expanded released position into an expanded latched position in which its diameter on the side of the opening which faces away from the housing is greater than the diameter of the opening of the printed circuit board. One of the functional elements is arranged on the actuation device and another element is arranged on a component of the connector which is movable relative to the actuation device.

公开(公告)号：US10799042B2

公开(公告)日：2020-10-13

申请号：US16265196

申请日：2019-02-01

Applicant: Xerox Corporation

Inventor： Chad S. Smithson ,  Yujie Zhu ,  Kurt I. Halfyard

IPC: H05K5/00 ,  A47F10/02 ,  G09F27/00 ,  A47F5/11 ,  A47F11/10 ,  H05K1/18 ,  H05K1/02 ,  H05K7/02 ,  G09F5/00

Abstract: There is described a point-of-purchase display and method. The display includes one or more sheets. The one or more sheets when unfolded and assembled form the display. The display includes a back wall, a front wall, at least a side wall and a bottom wall. A printed electronic device is affixed to a surface of the one or more sheets. The printed electronic device is selected from the group consisting of: wires, insulators, resistors, capacitors, inductors, transformers, transistors, antennas, OLEDs and sensors. A microcontroller electrically is coupled to the printed electronic device. A connection device is coupled to the printed electronic device. A modular electronic component is coupled to the connection device.

公开(公告)号：US10791623B2

公开(公告)日：2020-09-29

申请号：US16221965

申请日：2018-12-17

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tomoharu Fujii

IPC: H05K1/02 ,  H05K1/14 ,  H04B1/44 ,  H05K7/02 ,  H05K1/11 ,  H04B1/525 ,  H04B1/12

Abstract: An electronic device includes a first wiring substrate having a first corner part, a first ground pattern formed on a lower surface of the first wiring substrate with avoiding the first corner part, a second ground pattern formed on an upper surface of the first wiring substrate with avoiding the first corner part, a second wiring substrate provided above the first wiring substrate and including a second corner part above the first corner part, a third ground pattern formed on a lower surface of the second wiring substrate with avoiding the second corner part, a fourth ground pattern formed on an upper surface of the second wiring substrate with avoiding the second corner part, a plurality of terminals electrically connected to each of the first, second, third and fourth ground patterns, and an antenna fixed to the upper surface of the second wiring substrate at the second corner part.

公开(公告)号：US10765042B1

公开(公告)日：2020-09-01

申请号：US16283626

申请日：2019-02-22

Applicant: FORD GLOBAL TECHNOLOGIES, LLC

Inventor： Fan Wang ,  Lihua Chen ,  Joseph Sherman Kimmel

IPC: H02B1/48 ,  H05K7/02 ,  H05K7/20 ,  F28D9/00 ,  H02G5/02 ,  H02M7/00

Abstract: An integrated capacitor and power module include a power module, an intermediate cold plate, and a capacitor module. The intermediate cold plate has a first side attached to the power module and a second side opposite the first side. The capacitor module is attached to a second side of the intermediate cold plate. The capacitor module includes a plurality of metalized film capacitor cells supported by a metal plate and a base cold plate with a layer of thermal interface material between the metal plate and the base cold plate. A fluid circulation system is operatively connected to the intermediate cold plate to circulate a fluid through the cold plate. The capacitor module includes a housing, a plurality of capacitor cells and first and second busbars. Alternating cell arrays have a P-end and an N-end that are inverted relative to each other.

公开(公告)号：US10764990B1

公开(公告)日：2020-09-01

申请号：US16391963

申请日：2019-04-23

Applicant: ADLINK TECHNOLOGY INC.

Inventor： Hua-Feng Chen

IPC: H05K7/02 ,  H05K7/10 ,  H05K7/20 ,  H01L23/34 ,  H01L23/40 ,  H01L23/367 ,  H01L23/467 ,  H05K1/02 ,  H05K7/14

Abstract: A heat-dissipating module having an elastic mounting structure includes a carrier circuit board, a main circuit board, a heat dissipating module, and a plurality of elastic mounting components configured to mount mounting holes of the carrier circuit board and mounting grooves of the heat dissipating module in series, so as to fix the carrier circuit board, the main circuit board and the heat dissipating module. As a result, the plurality of elastic mounting components can provide stress buffer and good bonding effect for the thermally conductive device of the heat dissipating module bonded on an upper surface of the heat source device.

公开(公告)号：US10757809B1

公开(公告)日：2020-08-25

申请号：US16203999

申请日：2018-11-29

Applicant: Telephonics Corporation

Inventor： George McPartland ,  Aleksander Vaysman

IPC: H05K1/02 ,  H05K7/02 ,  H05K1/14

Abstract: A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density tins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.

公开(公告)号：US20200251411A1

公开(公告)日：2020-08-06

申请号：US16855629

申请日：2020-04-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L21/56 ,  H05K7/02 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H05K1/18 ,  H01L21/48 ,  H01L23/31

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20200244313A1

公开(公告)日：2020-07-30

申请号：US16752060

申请日：2020-01-24

Applicant: Lozier Corporation

Inventor： Tony Visconti

IPC: H04B3/54 ,  H05K7/02 ,  H02J3/00 ,  H02J13/00 ,  A47F11/10 ,  A47B97/00

Abstract: A powerline data transmission system for smart shelves provides AC power and network data propagated over a single cable. In disclosed embodiments, a starter unit encodes an ethernet signal onto an alternating current power source with a driver unit decoding the ethernet signal from the power source to provide separate power and data at a location such as a shelving unit bay. The separated power and data signals are provided to a technology box which communicates power and data to sensors positioned on the shelves of the unit. A support structure for the smart shelf system provided mounting of the driver unit and technology box along the top of the shelving unit or in a lower tray of the unit.

公开(公告)号：US10709036B2

公开(公告)日：2020-07-07

申请号：US16260995

申请日：2019-01-29

Applicant: QUANTA COMPUTER INC.

Inventor： Yaw-Tzorng Tsorng ,  Shih-Hsuan Hu

IPC: H05K7/02 ,  H05K7/20 ,  H05K5/02 ,  H05K7/14

Abstract: A dedicated airflow tunnel can extend directly from a front side of the chassis to a power supply unit (PSU) located near the rear side of the chassis. The dedicated airflow tunnel is removable and replaceable with airflow tunnels of different size. The dedicated airflow tunnel can avoid recirculation of PSU cooling air.