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    ELECTRONIC COMPONENT
    101.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20130062995A1

    公开(公告)日：2013-03-14

    申请号：US13556897

    申请日：2012-07-24

    Applicant: Takashi MATSUDA ,  Kazunori INOUE

    Inventor： Takashi MATSUDA ,  Kazunori INOUE

    IPC: H01L41/053 ,  H01L41/04 ,  H05K7/02

    CPC classification number: H03H9/1071 ,  H03H9/6483

    Abstract: An electronic component includes: a substrate; a functional element located on the substrate; a wiring located on the substrate and electrically connected to the functional element; a metal ceiling located above the functional element so that a space is formed between the metal ceiling and the functional element; and a sealing portion located on the metal ceiling, wherein the metal ceiling is electrically connected to a signal wiring that is included in the wiring and transmits a high-frequency signal.

    Abstract translation: 电子部件包括：基板; 位于所述基板上的功能元件; 布线，位于所述基板上并电连接到所述功能元件; 位于所述功能元件上方的金属天花板，使得在所述金属天花板和所述功能元件之间形成空间; 以及位于所述金属天花板上的密封部，其中所述金属顶板电连接到包括在所述布线中的信号布线，并且发送高频信号。

    DUPLEXER, SUBSTRATE FOR DUPLEXER, AND ELECTRONIC APPARATUS
    104.
    发明申请
    DUPLEXER, SUBSTRATE FOR DUPLEXER, AND ELECTRONIC APPARATUS 有权
    双工器，双工器基板和电子设备

    公开(公告)号：US20100244979A1

    公开(公告)日：2010-09-30

    申请号：US12564648

    申请日：2009-09-22

    Applicant: Takashi MATSUDA ,  Kazunori Inoue ,  Shogo Inoue

    Inventor： Takashi MATSUDA ,  Kazunori Inoue ,  Shogo Inoue

    IPC: H01P5/12

    CPC classification number: H03H9/706 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/725

    Abstract: A duplexer includes a transmit filter connected between a common terminal and a transmission terminal, a receive filter connected between the common terminal and a reception terminal, a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal, and a package. The package includes an insulating layer, foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer, and interconnections formed on another surface opposite to the one surface of the insulating layer. The capacitor is composed of two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one food pad respectively.

    Abstract translation: 双工器包括连接在公共端子和发送端子之间的发送滤波器，连接在公共端子和接收端子之间的接收滤波器，与发射滤波器和接收滤波器之一并联连接的电容器， 公共终端，发送终端和接收终端，以及包。 封装包括绝缘层，包括公共端子，发送端子和接收端子并且形成在绝缘层的一个表面上的脚垫以及形成在与绝缘层的一个表面相对的另一表面上的互连。 电容器由两个电容器形成单元组成，两个电容器形成单元彼此并联连接并且形成有足垫的至少一个脚垫和分别与至少一个食物垫的两个相对侧重叠的两个互连。

    ACOUSTIC WAVE ELEMENT, DUPLEXER, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS
    105.
    发明申请
    ACOUSTIC WAVE ELEMENT, DUPLEXER, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS 有权
    声波元件，双工器，通信模块和通信设备

    公开(公告)号：US20100148890A1

    公开(公告)日：2010-06-17

    申请号：US12712144

    申请日：2010-02-24

    Applicant: Kazunori Inoue ,  Takashi Matsuda ,  Michio Miura ,  Suguru Warashina

    Inventor： Kazunori Inoue ,  Takashi Matsuda ,  Michio Miura ,  Suguru Warashina

    IPC: H01P5/12 ,  H01P7/08 ,  H04R31/00

    CPC classification number: H03H9/0222 ,  H03H9/02897 ,  H03H9/02929 ,  H03H9/02937 ,  H03H9/02984 ,  H03H9/02992 ,  Y10T29/49005

    Abstract: An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle θ with respect to the surface 4a of the piezoelectric substrate 4.

    Abstract translation: 声波元件包括：各自包括用于激发声波的电极的谐振器2; 设置为电连接谐振器2的电源配线部3; 形成有谐振器2和电源配线部3的压电基板4; 形成在压电基板4上以覆盖谐振器2的第二介质5; 以及形成在压电基板4上以至少覆盖第二介质5和电源配线部3的第三介质6.电源配线部3的与表面接触的侧面34 压电基板4形成钝角的第一角度＆amp; 相对于压电基板4的表面4a。

    VECTOR GENERATION DEVICE, VECTOR GENERATING METHOD, AND INTEGRATED CIRCUIT
    107.
    发明申请
    VECTOR GENERATION DEVICE, VECTOR GENERATING METHOD, AND INTEGRATED CIRCUIT 审中-公开
    矢量生成装置，矢量生成方法和集成电路

    公开(公告)号：US20090165085A1

    公开(公告)日：2009-06-25

    申请号：US11568318

    申请日：2006-02-21

    Applicant: Ken Naka ,  Kazunori Inoue ,  Mikio Morioka

    Inventor： Ken Naka ,  Kazunori Inoue ,  Mikio Morioka

    IPC: H04L9/32 ,  G06F17/15 ,  G06F17/16

    CPC classification number: G06K9/00885 ,  G06F21/32 ,  G07C9/00158

    Abstract: An object of the invention is to provide a vector generation apparatus, a vector generation method, and an integrated circuit for generating data (vector) as a basis for authentication processing such as biometric authentication while protecting information that can be authenticated at high speed using the resources of a server and should be handled as secrete information typified by a biometric template against secondary use.A terminal 100 includes a reception section 101 for receiving a feature extraction vector as a first vector from the outside; a storage section 102 for storing a biometric template vector as a second vector; a vector computation section 103 for calculating a correlation efficient between the first vector and the second vector and generating a third vector different from the second vector, with the correlation coefficient matching the correlation efficient; and a transmission section 104 for transmitting the third vector to a server 10.

    Abstract translation: 本发明的目的是提供一种矢量生成装置，矢量生成方法和用于生成数据（矢量）的集成电路，作为用于诸如生物认证的认证处理的基础，同时保护可以高速认证的信息，使用 服务器的资源，应以生物识别模板为代表的隔离信息进行处理，防止二次使用。 终端100包括：接收部分101，用于从外部接收特征提取矢量作为第一矢量; 存储部102，用于存储作为第二矢量的生物体模板矢量; 矢量计算部分103，用于计算第一矢量和第二矢量之间的相关效率，并产生与第二矢量不同的第三矢量，相关系数与相关效率相匹配; 以及用于将第三矢量发送到服务器10的发送部分104。

    Material for manufacturing display panel substrate assembly and process for manufacturing display panel substrate assembly
    108.
    发明授权
    Material for manufacturing display panel substrate assembly and process for manufacturing display panel substrate assembly 失效
    用于制造显示面板基板组件的材料和用于制造显示面板基板组件的工艺

    公开(公告)号：US07455562B2

    公开(公告)日：2008-11-25

    申请号：US10968274

    申请日：2004-10-20

    Applicant: Osamu Toyoda ,  Kazunori Inoue

    Inventor： Osamu Toyoda ,  Kazunori Inoue

    IPC: H01J9/00

    CPC classification number: C03C17/34 ,  C03C2217/445 ,  C03C2217/475 ,  C03C2217/479 ,  H01J9/02 ,  H01J9/242 ,  H01J11/12 ,  H01J2211/225

    Abstract: A material for manufacturing a display panel substrate assembly having at least an electrode and a dielectric layer covering the electrode on a glass substrate, the material including an electrode material containing an electrically conductive particle and a binder resin having a thermal degradation temperature T1, and a dielectric material containing a binder resin having a thermal degradation temperature T2 and a low melting point glass having a glass softening point Tb, wherein the thermal degradation temperatures T1 and T2, and the glass softening point Tb have a relationship of T2

    Abstract translation: 一种用于制造显示面板基板组件的材料，所述显示面板基板组件至少具有覆盖玻璃基板上的电极的电极和电介质层，所述材料包括含有导电颗粒的电极材料和具有热降解温度T 1的粘合剂树脂，以及 含有热降解温度T 2的粘合剂树脂和玻璃软化点Tb的低熔点玻璃的介电材料，其中，热分解温度T 1和T 2以及玻璃软化点Tb的关系为T 2

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