DISPLAY SUBSTRATE, DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20220328578A1

    公开(公告)日:2022-10-13

    申请号:US17417299

    申请日:2020-09-24

    Abstract: A display substrate, a display panel and a manufacturing method thereof, and a display device are disclosed. The display substrate includes: a first substrate; a pixel defining layer on the first substrate and having pixel openings; and light emitting devices in one-to-one correspondence with the pixel openings. The light emitting device includes a first electrode and a light emitting function layer, the first electrode is between the pixel defining layer and the first substrate, and includes a main body portion exposed by the pixel opening; the light emitting function layer is in the pixel opening and on a side of the main body portion away from the first substrate, at least a part of the light emitting function layer directly faces the main body portion, and the part of the light emitting function layer directly facing the main body portion is a curved film layer protruding towards the first substrate.

    DISPLAY APPARATUS AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20220278174A1

    公开(公告)日:2022-09-01

    申请号:US17628516

    申请日:2021-03-09

    Abstract: Provided are a display apparatus and a manufacturing method therefor, the display apparatus comprising: a plurality of mutually independent subpixel regions; a light source (101), light emitted from the light source (101) illuminating the subpixel regions; and a light control layer (102), which is located on a light exiting side of the light source (101), the light control layer (102) comprising: color conversion structures (1021) located at the subpixel regions, the color conversion structures (1021) each comprising a nanoporous material and at least a color conversion material distributed among the nanoporous material, the color conversion material being used to convert light emitted from the light source (101) into light of a color corresponding to the subpixel region where the light is located.

    Display Substrate and Preparation Method Thereof, and Display Apparatus

    公开(公告)号:US20220223674A1

    公开(公告)日:2022-07-14

    申请号:US17359675

    申请日:2021-06-28

    Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a substrate, an active structure layer disposed on the substrate, a first source-drain structure layer disposed on a side of the active structure layer away from the substrate, and a second source-drain structure layer disposed on a side of the first source-drain structure layer away from the substrate. The active structure layer includes a first active layer and a second active layer. The first source-drain structure layer includes a first active via and a first source-drain electrode, and the first source-drain electrode is connected to the first active layer through the first active via; and the second source-drain structure layer includes a second active via and a second source-drain electrode, and the second source-drain electrode is connected to the second active layer through the second active via.

    LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE

    公开(公告)号:US20220115562A1

    公开(公告)日:2022-04-14

    申请号:US17332852

    申请日:2021-05-27

    Abstract: An embodiment of the present disclosure provides a light emitting diode chip, including: a light emitting functional layer including a first semiconductor layer, a light emitting layer and a second semiconductor layer which are sequentially stacked, and a second semiconductor layer including a plurality of second semiconductor patterns which are arranged at intervals; a first electrode layer including a first electrode pattern electrically coupled to the first semiconductor layer; a second electrode layer disposed on a side, away from the light emitting layer, of the second semiconductor layer and including a plurality of second electrode patterns in one-to-one correspondence with the second semiconductor patterns, and the second electrode patterns are electrically coupled to the second semiconductor patterns correspondingly. Embodiments of the present disclosure further provide a method for manufacturing a light emitting diode chip and a display device.

    FINGERPRINT IDENTIFICATION MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

    公开(公告)号:US20210200985A1

    公开(公告)日:2021-07-01

    申请号:US16966394

    申请日:2020-01-17

    Abstract: A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. The fingerprint identification module includes a substrate, a piezoelectric material layer, an auxiliary structure and a plurality of first driving electrodes; the piezoelectric material layer is on the substrate, the auxiliary structure is at least partially located on the substrate, and the plurality of first driving electrodes are on a side, away from the substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer. The fingerprint identification module can avoid the problems of wire disconnection and conductive material residue in the process of forming the plurality of first driving electrodes on the piezoelectric material layer, thereby improving the yield of products.

    DRIVING BACKPLANE, DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210110761A1

    公开(公告)日:2021-04-15

    申请号:US17070338

    申请日:2020-10-14

    Abstract: A driving backplane includes a base, and a pixel driving circuit, a first electrode and a first piezoelectric block that are disposed in the sub-pixel region. The pixel driving circuit is disposed on the base. The first electrode is disposed at a side of the pixel driving circuit away from the base. The first electrode includes a first sub-electrode pattern and a second sub-electrode pattern that are in a same layer and are spaced apart to be insulated from each other, and the first sub-electrode pattern is electrically connected to the pixel driving circuit. The first piezoelectric block is disposed between the pixel driving circuit and the first electrode, and the first sub-electrode pattern and the second sub-electrode pattern are in contact with the first piezoelectric block.

    TOUCH DISPLAY PANEL, METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE

    公开(公告)号:US20210026471A1

    公开(公告)日:2021-01-28

    申请号:US16837399

    申请日:2020-04-01

    Abstract: The invention provides a touch display panel, a method for preparing the same, and a display device. The touch display panel includes a display module and a touch module that are arranged in a stack, the display module including two conductive layers and an intermediate insulation layer arranged between the two conductive layers, and the touch module including at least two touch electrodes and a touch insulation layer between the at least two touch electrodes, in which at least one of the intermediate insulation layer and the touch insulation layer is made of an organic material.

    BACKBOARD, DISPLAY DEVICE, AND METHOD FOR FABRICATING BACKBOARD

    公开(公告)号:US20200235160A1

    公开(公告)日:2020-07-23

    申请号:US16534362

    申请日:2019-08-07

    Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.

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