公开(公告)号：US20130095623A1

公开(公告)日：2013-04-18

申请号：US13611113

申请日：2012-09-12

申请人： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

发明人： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

IPC分类号： H01L21/336

CPC分类号： H01L29/78 ,  H01L21/823487 ,  H01L21/823885 ,  H01L29/4983 ,  H01L29/66666 ,  H01L29/7827

摘要： A transistor structure is formed to include a substrate and, overlying the substrate, a source; a drain; and a channel disposed vertically between the source and the drain. The channel is coupled to a gate conductor that surrounds the channel via a layer of gate dielectric material that surrounds the channel. The gate conductor is composed of a first electrically conductive material having a first work function that surrounds a first portion of a length of the channel and a second electrically conductive material having a second work function that surrounds a second portion of the length of the channel. A method to fabricate the transistor structure is also disclosed. The transistor structure can be characterized as being a vertical field effect transistor having an asymmetric gate.

公开(公告)号：US20130087759A1

公开(公告)日：2013-04-11

申请号：US13270362

申请日：2011-10-11

申请人： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

发明人： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

IPC分类号： H01L29/06 ,  H01L33/00 ,  B82Y99/00

CPC分类号： H01L33/0041 ,  H01L33/26 ,  H01L33/34 ,  H01L33/40 ,  H01L51/0048 ,  H01L51/5203 ,  H01L51/5296

摘要： Carbon-based light emitting diodes (LEDs) and techniques for the fabrication thereof are provided. In one aspect, a LED is provided. The LED includes a substrate; an insulator layer on the substrate; a first bottom gate and a second bottom gate embedded in the insulator layer; a gate dielectric on the first bottom gate and the second bottom gate; a carbon material on the gate dielectric over the first bottom gate and the second bottom gate, wherein the carbon material serves as a channel region of the LED; and metal source and drain contacts to the carbon material.

公开(公告)号：US20130056802A1

公开(公告)日：2013-03-07

申请号：US13595025

申请日：2012-08-27

申请人： Kangguo Cheng ,  Bruce B. Doris ,  Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Ghavam G. Shahidi

发明人： Kangguo Cheng ,  Bruce B. Doris ,  Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Ghavam G. Shahidi

IPC分类号： H01L29/78

CPC分类号： H01L29/66636 ,  H01L29/66772 ,  H01L29/78621 ,  H01L29/78654

摘要： A semiconductor device and a method of fabricating a semiconductor device are disclosed. In one embodiment, the method comprises providing a semiconductor substrate, epitaxially growing a Ge layer on the substrate, and epitaxially growing a semiconductor layer on the Ge layer, where the semiconductor layer has a thickness of 10 nm or less. This method further comprises removing at least a portion of the Ge layer to form a void beneath the Si layer, and filling the void at least partially with a dielectric material. In this way, the semiconductor layer becomes an extremely thin semiconductor-on-insulator layer. In one embodiment, after the void is filled with the dielectric material, in-situ doped source and drain regions are grown on the semiconductor layer. In one embodiment, the method further comprises annealing said source and drain regions to form doped extension regions in the semiconductor layer.

摘要翻译： 公开了半导体器件和制造半导体器件的方法。 在一个实施例中，该方法包括提供半导体衬底，在衬底上外延生长Ge层，并在Ge层上外延生长半导体层，其中半导体层的厚度为10nm或更小。 该方法还包括去除Ge层的至少一部分以在Si层下形成空隙，并且至少部分地用电介质材料填充空隙。 以这种方式，半导体层成为非常薄的绝缘体上半导体层。 在一个实施例中，在空隙填充有电介质材料之后，在半导体层上生长原位掺杂的源极和漏极区。 在一个实施例中，该方法还包括退火所述源区和漏区以在半导体层中形成掺杂的延伸区。

公开(公告)号：US08367508B2

公开(公告)日：2013-02-05

申请号：US12757201

申请日：2010-04-09

申请人： Dechao Guo ,  Wilfried E. Haensch ,  Xinhui Wang ,  Keith Kwong Hon Wong

发明人： Dechao Guo ,  Wilfried E. Haensch ,  Xinhui Wang ,  Keith Kwong Hon Wong

IPC分类号： H01L21/336

CPC分类号： H01L29/665 ,  H01L21/28088 ,  H01L21/28114 ,  H01L21/28525 ,  H01L21/76897 ,  H01L21/78 ,  H01L29/66545

摘要： A method for forming a field effect transistor includes forming a gate stack, a spacer adjacent to opposing sides of the gate stack, a silicide source region and a silicide drain region on opposing sides of the spacer, epitaxially growing silicon on the source region and the drain region; forming a liner layer on the gate stack and the spacer, removing a portion of the liner layer to expose a portion of the hardmask layer, removing the exposed portions of the hardmask layer to expose a silicon layer of the gate stack, removing exposed silicon to expose a portion of a metal layer of the gate stack, the source region, and the drain region; and depositing a conductive material on the metal layer of the gate stack, the silicide source region, and the silicide drain region.

摘要翻译： 一种用于形成场效应晶体管的方法，包括：形成栅极叠层，与栅叠层的相对侧相邻的间隔物，在间隔物的相对侧上的硅化物源区和硅化物漏极区，在源区上外延生长硅， 漏区; 在栅极堆叠和间隔物上形成衬垫层，去除衬里层的一部分以露出硬掩模层的一部分，去除硬掩模层的暴露部分以暴露栅堆叠的硅层，将暴露的硅去除 暴露栅叠层，源极区和漏区的金属层的一部分; 以及在栅叠层，硅化物源区和硅化物漏极区的金属层上沉积导电材料。

公开(公告)号：US08344428B2

公开(公告)日：2013-01-01

申请号：US12627747

申请日：2009-11-30

申请人： Satya N. Chakravarti ,  Dechao Guo ,  Huiming Bu ,  Keith Kwong Hon Wong

发明人： Satya N. Chakravarti ,  Dechao Guo ,  Huiming Bu ,  Keith Kwong Hon Wong

IPC分类号： H01L23/52

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： Techniques for incorporating nanotechnology into electronic fuse (e-fuse) designs are provided. In one aspect, an e-fuse structure is provided. The e-fuse structure includes a first electrode; a dielectric layer on the first electrode having a plurality of nanochannels therein; an array of metal silicide nanopillars that fill the nanochannels in the dielectric layer, each nanopillar in the array serving as an e-fuse element; and a second electrode in contact with the array of metal silicide nanopillars opposite the first electrode. Methods for fabricating the e-fuse structure are also provided as are semiconductor devices incorporating the e-fuse structure.

摘要翻译： 提供了将纳米技术纳入电子保险丝（e-fuse）设计的技术。 一方面，提供了一种电熔丝结构。 电熔丝结构包括第一电极; 第一电极上的介电层，其中具有多个纳米通道; 金属硅化物纳米柱阵列，其填充介电层中的纳米通道，阵列中的每个纳米柱用作电熔丝元件; 以及与第一电极相对的金属硅化物纳米柱阵列接触的第二电极。 还提供了用于制造电熔丝结构的方法，其中还包括结合电熔丝结构的半导体器件。

公开(公告)号：US08309418B2

公开(公告)日：2012-11-13

申请号：US12860977

申请日：2010-08-23

申请人： Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin

发明人： Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin

IPC分类号： H01L21/336

CPC分类号： H01L29/78 ,  H01L29/1037 ,  H01L29/1054 ,  H01L29/165 ,  H01L29/4236 ,  H01L29/66621

摘要： A field effect transistor device includes a substrate, a silicon germanium (SiGe) layer disposed on the substrate, gate dielectric layer lining a surface of a cavity defined by the substrate and the silicon germanium layer, a metallic gate material on the gate dielectric layer, the metallic gate material filling the cavity, a source region, and a drain region.

摘要翻译： 场效应晶体管器件包括衬底，设置在衬底上的硅锗（SiGe）层，衬在由衬底和硅锗层限定的空腔的表面上的栅介质层，栅极介电层上的金属栅极材料， 填充空腔的金属栅极材料，源极区域和漏极区域。

公开(公告)号：US20120256294A1

公开(公告)日：2012-10-11

申请号：US13530549

申请日：2012-06-22

申请人： Satya N. Chakravarti ,  Dechao Guo ,  Huiming Bu ,  Keith Kwong Hon Wong

发明人： Satya N. Chakravarti ,  Dechao Guo ,  Huiming Bu ,  Keith Kwong Hon Wong

IPC分类号： H01L29/02 ,  H01L21/02

CPC分类号： B82Y10/00 ,  H01L21/8221 ,  H01L23/5223 ,  H01L27/0688 ,  H01L28/92 ,  H01L2924/0002 ,  H01L2924/00

摘要： Techniques for incorporating nanotechnology into decoupling capacitor designs are provided. In one aspect, a decoupling capacitor is provided. The decoupling capacitor comprises a first electrode; an intermediate layer adjacent to the first electrode having a plurality of nanochannels therein; a conformal dielectric layer formed over the intermediate layer and lining the nanochannels; and a second electrode at least a portion of which is formed from an array of nanopillars that fill the nanochannels in the intermediate layer. Methods for fabricating the decoupling capacitor are also provided, as are semiconductor devices incorporating the decoupling capacitor design.

摘要翻译： 提供了将纳米技术纳入去耦电容器设计的技术。 在一个方面，提供去耦电容器。 去耦电容器包括第一电极; 与第一电极相邻的中间层，其中具有多个纳米通道; 在中间层上形成并衬在纳米通道上的保形介电层; 以及第二电极，其至少一部分由填充中间层中的纳米通道的纳米柱阵列形成。 还提供了用于制造去耦电容器的方法，以及包含去耦电容器设计的半导体器件。

公开(公告)号：US20120119266A1

公开(公告)日：2012-05-17

申请号：US12945026

申请日：2010-11-12

申请人： Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Alexander Reznicek ,  Keith Kwong Hon Wong

发明人： Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Alexander Reznicek ,  Keith Kwong Hon Wong

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/66545 ,  H01L29/1054 ,  H01L29/66477 ,  H01L29/66651 ,  H01L29/7843 ,  H01L29/7848

摘要： A field effect transistor device includes a gate stack portion disposed on a substrate, and a channel region in the substrate having a depth partially defined by the gate stack portion and a silicon region of the substrate, the silicon region having a sloped profile such that a distal regions of the channel region have greater depth than a medial region of the channel region.

摘要翻译： 场效应晶体管器件包括设置在衬底上的栅极堆叠部分和衬底中的沟道区域，其具有由栅极堆叠部分和衬底的硅区域部分地限定的深度，所述硅区域具有倾斜轮廓，使得 沟道区域的远侧区域具有比沟道区域的中间区域更深的深度。

公开(公告)号：US20120061772A1

公开(公告)日：2012-03-15

申请号：US12880085

申请日：2010-09-11

申请人： Dechao Guo ,  Keith Kwong Hon Wong

发明人： Dechao Guo ,  Keith Kwong Hon Wong

IPC分类号： H01L29/78 ,  H01L21/28

CPC分类号： H01L21/28079 ,  H01L21/28185 ,  H01L21/823842 ,  H01L21/823857 ,  H01L29/42372 ,  H01L29/517 ,  H01L29/66545

摘要： A transistor is fabricated by removing a polysilicon gate over a doped region of a substrate and forming a mask layer over the substrate such that the doped region is exposed through a hole within the mask layer. An interfacial layer is deposited on top and side surfaces of the mask layer and on a top surface of the doped region. A layer adapted to reduce a threshold voltage of the transistor and/or reduce a thickness of an inversion layer of the transistor is deposited on the interfacial layer. The layer includes metal, such as aluminum or lanthanum, which diffuses into the interfacial layer, and also includes oxide, such as hafnium oxide. A conductive plug, such as a metal plug, is formed within the hole of the mask layer. The interfacial layer, the layer on the interfacial layer, and the conductive plug are a replacement gate of the transistor.

摘要翻译： 通过在衬底的掺杂区域上去除多晶硅栅极并在衬底上形成掩模层来制造晶体管，使得掺杂区域通过掩模层内的孔露出。 界面层沉积在掩模层的顶表面和侧表面上以及在掺杂区的顶表面上。 适于降低晶体管的阈值电压和/或降低晶体管的反型层的厚度的层被沉积在界面层上。 该层包括扩散到界面层中的金属，例如铝或镧，并且还包括氧化物，例如氧化铪。 在掩模层的孔内形成导电塞，例如金属塞。 界面层，界面层上的层和导电插塞是晶体管的替代栅极。

公开(公告)号：US20110115022A1

公开(公告)日：2011-05-19

申请号：US12621299

申请日：2009-11-18

申请人： Kangguo Cheng ,  Bruce B. Doris ,  Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Ghavam G. Shahidi

发明人： Kangguo Cheng ,  Bruce B. Doris ,  Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Ghavam G. Shahidi

IPC分类号： H01L29/786 ,  H01L21/336

CPC分类号： H01L29/66636 ,  H01L29/66772 ,  H01L29/78621 ,  H01L29/78654

摘要： A semiconductor device and a method of fabricating a semiconductor device are disclosed. In one embodiment, the method comprises providing a semiconductor substrate, epitaxially growing a Ge layer on the substrate, and epitaxially growing a semiconductor layer on the Ge layer, where the semiconductor layer has a thickness of 10 nm or less. This method further comprises removing at least a portion of the Ge layer to form a void beneath the Si layer, and filling the void at least partially with a dielectric material. In this way, the semiconductor layer becomes an extremely thin semiconductor-on-insulator layer. In one embodiment, after the void is filled with the dielectric material, in-situ doped source and drain regions are grown on the semiconductor layer. In one embodiment, the method further comprises annealing said source and drain regions to form doped extension regions in the semiconductor layer. Epitaxially growing the extremely thin semiconductor layer on the Ge layer ensures good thickness control across the wafer. This process could be used for SOI or bulk wafers.

摘要翻译： 公开了半导体器件和制造半导体器件的方法。 在一个实施例中，该方法包括提供半导体衬底，在衬底上外延生长Ge层，并在Ge层上外延生长半导体层，其中半导体层的厚度为10nm或更小。 该方法还包括去除Ge层的至少一部分以在Si层下形成空隙，并且至少部分地用电介质材料填充空隙。 以这种方式，半导体层成为非常薄的绝缘体上半导体层。 在一个实施例中，在空隙填充有电介质材料之后，在半导体层上生长原位掺杂的源极和漏极区。 在一个实施例中，该方法还包括退火所述源区和漏区以在半导体层中形成掺杂的延伸区。 在Ge层上外延生长极薄的半导体层确保跨晶片的良好的厚度控制。 该工艺可用于SOI或体晶片。