Abstract:
A memory is provided that practices global read line sharing by including: a global read line, the memory being adapted to be pre-charge the global read line prior to a read operation; an I/O circuit to receive the global read line; and a plurality of sense amplifiers, each sense amplifier being multiplexed with respect to the global read line such that only a selected one of the sense amplifiers in the plurality is activated during a read operation to determine a bit decision, the memory being adapted to discharge the pre-charged global read line if the bit decision from the activated sense amplifier equals one, the pre-charged global read line thereby staying pre-charged if the bit decision from the activated sense amplifier equals zero.
Abstract:
In one embodiment, a leakage reduction circuit is provided that includes: a virtual power supply node; a first PMOS transistor coupled between the virtual power supply node and a power supply node; a second PMOS transistor having a source coupled to the power supply node; and a native NMOS transistor coupled between a drain of the second PMOS transistor and the virtual power supply node, the native NMOS transistor having a gate driven by the power supply node.
Abstract:
The present invention relates to a system and method for providing redundancy in a hierarchically memory, by replacing small blocks in such memory. The present invention provides such redundancy (i.e., replaces such small blocks) by either shifting predecoded lines or using a modified shifting predecoder circuit in the local predecoder block. In one embodiment, the hierarchal memory structure includes at least one active predecoder adapted to be shifted out of use; and at least one redundant predecoder adapted to be shifted in to use.
Abstract:
In one embodiment, a decoder for decoding an address having a plurality of bits ranging from a first address bit a1 to a last address bit aN, each address bit being either true or false is provided that includes: a pre-charge circuit adapted to pre-charge a dynamic NOR node and a dynamic OR node and then allow the pre-charged dynamic NOR node and pre-charged dynamic OR node to float; a plurality of switches coupled between the dynamic NOR node and ground, each switch corresponding uniquely to the address bits such that the switches range from a first switch corresponding to a1 to an nth switch corresponding to aN, wherein any switch corresponding to a true address bit is configured to turn on only if its corresponding address bit is false, and wherein any switch corresponding to a false address bit is configured to turn on only if its corresponding address bit is true; a (n+1)th switch coupling the dynamic OR node to ground, the (n+1)th switch being controlled such that it turns on if the dynamic OR node is charged, whereby the pre-charged dynamic OR node discharges if the dynamic OR node remains charged; an odd plurality of inverters coupled in series with the dynamic OR node; and a word line driven by the odd plurality of inverters.
Abstract:
In one embodiment, a random access memory (RAM) is provided that includes: an array of memory cells arranged in rows corresponding to word lines, the memory cells also being arranged in columns corresponding to bit lines; a local clock source that asserts a local clock in response to an assertion of an external clock; a plurality of x-decoders, each x-decoder adapted to assert a corresponding one of the word lines in response to a decoding of an appropriate address, wherein the assertion of a word line couples a corresponding row of the memory cells to their bit lines such that the bit lines are developed with corresponding voltages; and a plurality of sense amplifiers adapted to sense the voltage developments of the bit lines so as to determine a binary content of the memory cells, wherein the local clock source is triggered to de-assert the local clock independently of whether the external clock has been de-asserted.
Abstract:
Aspects of the invention for testing and debugging an embedded device under test may include the step of loading an instruction into a parameterized shift register of a BIST module coupled to each one of a plurality of embedded memory modules comprising the embedded device under test. An identity of the loaded instruction may be determined subsequent to loading the instruction into the parameterized shift register. A plurality of test signals may be generated which correspond to the determined identity of the loaded instruction. In this regard, each of the generated plurality of test signals may control the execution of the testing and debugging of a corresponding one of each of the plurality of embedded memory modules that make up the embedded device under test.
Abstract:
A non-volatile memory cell is provided that includes: a substrate including diffusion regions for a read-out transistor; a capacitor formed in a poly-silicon layer adjacent the substrate, the capacitor including a floating gate for the read-out transistor and a control gate, the floating gate and the control gate each having finger extensions, the finger extensions from the floating gate interdigitating with the finger extensions from the control gate; and a programming line coupled to the control gate.
Abstract:
In a memory module having a designated group of memory cells assigned to represent a logical portion of the memory structure, a memory redundancy circuit having a redundant group of memory cells; and a redundancy controller coupled with the designated group and the redundant group. The redundancy controller, which can include a redundancy decoder, assigns the redundant group to the logical portion of the memory structure in response to a preselected memory group condition, e.g., a “FAILED” memory group condition. The redundancy controller also can include selectable switches, for example, fuses, which can encode the preselected memory group condition. The designated group of memory cells and the redundant group of memory cells can be a memory row, a memory column, a preselected portion of a memory module, a selectable portion of a memory module, a memory module, or a combination thereof.
Abstract:
In one embodiment, a memory is provided that includes: a plurality of memory cells arranged in columns, each column coupled to a corresponding bit line; a sense amplifier adapted to sense the voltage on a pair of the bit lines to determine a binary state of an accessed memory cell coupled to a first one of the bit lines in the pair; and a first trim capacitor having a first terminal directly coupled to one of the bit lines in the pair, the first trim capacitor having an opposing second terminal coupled to a first trim capacitor signal, the memory being adapted to change a voltage of the first trim capacitor signal while the sense amplifier senses the voltage to determine the binary state of the accessed memory cell.
Abstract:
An imaging device includes a plurality of photo-diodes arranged in a plurality of columns on a single Complementary Metal Oxide Semiconductor (CMOS) substrate. A plurality of analog-to-digital converters (ADCs) corresponding to the plurality of columns of photo-diodes are arranged on the substrate, with each ADC having an input coupled to outputs of the photo-diodes in the corresponding column. Parallel processing of the data streams produced by the multiple ADCs improves the bandwidth of the imaging device. The ADCs have one or more capacitors based on a reference capacitor that are configured so that the corresponding capacitors for different ADCs are substantially equal across the CMOS substrate. As such, image variation and streaking across the columns of photo-diodes is minimized or eliminated. The reference capacitors of the ADCs are above a minimum capacitance value, determined by a maximum variation of the reference capacitors across the substrate.