公开(公告)号：US20180027702A1

公开(公告)日：2018-01-25

申请号：US15547534

申请日：2015-02-17

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John P. Franz

IPC: H05K7/20

Abstract: An example fluid manifold is provided herein. The fluid manifold includes a first set of perimeter walls, a second set of perimeter walls, a first aperture, and a second aperture. The first set of perimeter walls to form a supply channel. The second set of perimeter walls to form a return channel. The second set of perimeter walls are adjacent to the first set of perimeter walls. The first aperture formed in the first set of perimeter walls is to transport fluid between a fluid component and the supply channel. The second aperture formed in the second set of perimeter walls is to transport fluid between the fluid component and the return channel. The first aperture and the second aperture are positioned adjacent to an electronic module.

公开(公告)号：US20180027698A1

公开(公告)日：2018-01-25

申请号：US15547554

申请日：2015-02-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20781 ,  H05K7/20836

Abstract: An example device comprises a coolant distribution unit configured to be contained within a housing configured to house a plurality of liquid cooled computing units, the coolant distribution unit configured to fluidly couple to a rear door heat exchanger of the housing and to fluidly couple to the plurality of liquid cooled computing units, the coolant distribution unit to: receive coolant from the rear door heat exchanger via a first fluid line; pump the coolant toward the liquid cooled computing units using at least one pump coupled to the first fluid line; and supply the coolant to the liquid cooled computing units via a second fluid line coupled to the plurality of liquid cooled computing units.

公开(公告)号：US20180018001A1

公开(公告)日：2018-01-18

申请号：US15546070

申请日：2015-01-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Thomas R. Bowden ,  Richard A. Bargerhuff ,  Sammy L. Zimmerman ,  Tahir Cader

IPC: G06F1/20 ,  H05K7/20

Abstract: In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a second side of the memory unit.

公开(公告)号：US20180017538A1

公开(公告)日：2018-01-18

申请号：US15546090

申请日：2015-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Anita Rogacs ,  Greg Scott Long ,  Tahir Cader ,  Keith Mathew McAuliffe ,  John Franz

IPC: G01N33/18 ,  F01P11/18 ,  G01N27/02 ,  H05K7/20 ,  G01N27/07 ,  G01N27/407

CPC classification number: G01N33/1886 ,  F01P11/14 ,  F01P11/18 ,  F01P2003/001 ,  F01P2025/80 ,  G01N27/026 ,  G01N27/07 ,  G01N27/4071 ,  H05K7/20672

Abstract: An example device in accordance with an aspect of the present disclosure includes a sensor, a controller, and an injector. The sensor is to provide sensor output regarding fluid chemistry of a fluid of a cooling system. The controller is to identify attributes of the fluid. The injector is to inject at least one additive into the fluid to bring at least one attribute into a threshold range.

公开(公告)号：US20170084514A1

公开(公告)日：2017-03-23

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H01L23/473 ,  H01L23/02

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.