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    Method, device and article to test digital circuits
    105.
    发明授权
    Method, device and article to test digital circuits 有权

    公开(公告)号：US10578672B2

    公开(公告)日：2020-03-03

    申请号：US14986053

    申请日：2015-12-31

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： David Jacquet ,  Didier Fuin

    IPC: G01R31/317 ,  G01R31/3177 ,  G01R31/3185

    Abstract: A digital circuit includes a scan chain which loads data into and unloads data from the digital circuit. Checking circuitry is coupled to the scan chain and generates a first digital signature based on data indicative of a pre-testing status of the digital circuit as the data is unloaded from the digital circuit via the scan chain. When testing is completed, the data is restored to the digital circuit via the scan chain. The checking circuitry generates a second digital signature as the data is loaded into the digital circuit. The first digital signature is compared to the second digital signature to verify an integrity of the process. A specific data pattern may be loaded into the scan chain as the data is unloaded. An output of the scan chain may be monitored to detect the pattern and an error signal may be generated based on when the pattern is detected.

    Electronic package and fabrication method
    109.
    发明授权
    Electronic package and fabrication method 有权

    公开(公告)号：US10483181B2

    公开(公告)日：2019-11-19

    申请号：US16035083

    申请日：2018-07-13

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Karine Saxod ,  Nicolas Mastromauro

    IPC: H01L23/12 ,  H01L23/31 ,  H01L23/32 ,  H01L23/04 ,  H01L23/10

    Abstract: An integrated circuit chip is mounted to a front face of a support plate. An encapsulation cap in then mounted to the support plate. The encapsulation cap includes a front wall and a peripheral wall having an end edge at least partly facing a peripheral zone of the support plate. The support plate and the encapsulation cap delimit a chamber in which the integrated circuit chip is situated. To mount the encapsulation cap, a bead of glue is inserted between the peripheral zone and the end edge of the peripheral wall of the encapsulation cap. A peripheral outer face of the encapsulation cap includes a recess extending from the end edge which locally uncovers a part of the bead of glue. A local hardening of the glue at the recess is performed as a first attachment step. Further hardening of the remainder of the glue is then performed.

    METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC UNITS
    110.
    发明申请
    METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC UNITS 审中-公开

    公开(公告)号：US20190267349A1

    公开(公告)日：2019-08-29

    申请号：US16282594

    申请日：2019-02-22

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Marie-Astrid PIN ,  Karine SAXOD ,  Jean-Michel RIVIERE

    IPC: H01L23/00 ,  H01L31/0203 ,  H01L33/48 ,  H01L21/78

    Abstract: Individual electronic units are formed by cutting a collective assembly. A collective support plate is provided which includes electronic chips. A collective cover plate is provided which includes ribs defining recesses. The collective assembly is formed by mounting the collective cover plate to the collective support plate in a manner where the electronic chips are located in the recesses and the ribs are located between electronic chips. A bead of glue is interposed between ends of the ribs and the surface of the collective support plate. After the glue is hardened, a cutting operation is performed on the collective assembly by cutting through the ribs and the collective support plate to produce the individual electronic units.

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