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    Capacitive sensor packaging
    111.
    发明授权
    Capacitive sensor packaging 有权

    公开(公告)号：US10007832B2

    公开(公告)日：2018-06-26

    申请号：US15393610

    申请日：2016-12-29

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Shawn Arnold ,  Barry J. Corlett ,  Terry L. Gilton ,  Syed Husaini ,  Steven Webster ,  Scott A. Myers ,  Matthew D. Hill ,  Benjamin B. Lyon

    IPC: G06F3/044 ,  G06K9/00

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    Electronic Device With Shared Near Field Communications and Sensor Structures
    115.
    发明申请
    Electronic Device With Shared Near Field Communications and Sensor Structures 审中-公开

    公开(公告)号：US20160321493A1

    公开(公告)日：2016-11-03

    申请号：US15210777

    申请日：2016-07-14

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Daniel W. Jarvis ,  Scott A. Myers ,  Nicholas G. L. Merz

    IPC: G06K9/00 ,  G06F3/041 ,  H04B5/00 ,  G06F3/044

    CPC classification number: G06K9/00013 ,  G06F3/0416 ,  G06F3/044 ,  G06K9/0002 ,  H04B5/0012 ,  H04B5/0075

    Abstract: An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.

    Liquid-based pressure sensitive adhesive for grounding applications
    120.
    发明授权
    Liquid-based pressure sensitive adhesive for grounding applications 有权
    液体粘合剂用于接地应用

    公开(公告)号：US09258906B2

    公开(公告)日：2016-02-09

    申请号：US13863264

    申请日：2013-04-15

    Applicant: Apple Inc.

    Inventor： James R. Krogdahl ,  Benjamin J. Pope ,  Dennis R. Pyper ,  Nicholas G. L. Merz ,  Scott A. Myers

    IPC: B29C65/52 ,  B32B37/12 ,  B32B37/26 ,  B32B38/10 ,  B32B43/00 ,  C09J5/02 ,  H05K3/38 ,  C09J5/00 ,  H05K3/32 ,  H05K3/36

    CPC classification number: H05K3/386 ,  C09J5/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  H05K3/323 ,  H05K3/361 ,  Y10T156/10 ,  Y10T428/13 ,  Y10T428/31678

    Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.

    Abstract translation: 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。

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