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公开(公告)号：US20170290207A1
公开(公告)日：2017-10-05
申请号：US15250066
申请日：2016-08-29
申请人： Apple Inc.
发明人： James B. Smith , Daniel W. Jarvis , David A. Pakula , Gregory N. Stephens , Nicholas G. L. Merz , Shayan Malek , Sina Bigdeli
IPC分类号： H05K9/00 , H01L23/552 , H05K1/18
CPC分类号： H05K9/003 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/16152 , H05K1/18 , H05K9/0024 , H05K9/0088
摘要： Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
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2.发明授权Engagement features and adjustment structures for electronic devices with integral antennas 有权具有集成天线的电子设备的接合特征和调整结构公开(公告)号：US09002422B2
公开(公告)日：2015-04-07
申请号：US14287747
申请日：2014-05-27
申请人： Apple Inc.
CPC分类号： H01Q1/243 , H01Q9/0421 , H01Q13/10 , H01Q13/103 , H04B1/38
摘要： Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness ma be adjusted to adjust antenna performance.
摘要翻译： 可以提供包含无线通信电路的电子设备。 无线通信电路可以包括由内部接地平面和外围导电壳体构件形成的天线结构。 内部接地平面和外围导电外壳构件可以间隔开。 内部接地平面可以由具有接合特征的金属板结构形成，例如以一定角度向上弯曲的凸片。 塑料结构可以在接合特征上嵌入成型。 当内部接地平面安装在电子设备中时，塑料结构可以桥接内部接地平面和外围导电壳体构件之间的间隙。 诸如具有可选择厚度的垫圈的可调结构可以安装到外围导电外壳构件上，跨越间隙与导电结构相对置。 调整厚度以调整天线性能。
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3.发明申请Engagement Features and Adjustment Structures for Electronic Devices with Integral Antennas 审中-公开具有整体天线的电子设备的参与特征和调整结构公开(公告)号：US20140266926A1
公开(公告)日：2014-09-18
申请号：US14287747
申请日：2014-05-27
申请人： Apple Inc.
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243 , H01Q9/0421 , H01Q13/10 , H01Q13/103 , H04B1/38
摘要： Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness ma be adjusted to adjust antenna performance.
摘要翻译： 可以提供包含无线通信电路的电子设备。 无线通信电路可以包括由内部接地平面和外围导电壳体构件形成的天线结构。 内部接地平面和外围导电外壳构件可以间隔开。 内部接地平面可以由具有接合特征的金属板结构形成，例如以一定角度向上弯曲的凸片。 塑料结构可以在接合特征上嵌入成型。 当内部接地平面安装在电子设备中时，塑料结构可以桥接内部接地平面和外围导电壳体构件之间的间隙。 诸如具有可选择厚度的垫圈的可调结构可以安装到外围导电外壳构件上，跨越间隙与导电结构相对置。 调整厚度以调整天线性能。
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公开(公告)号：US10225964B2
公开(公告)日：2019-03-05
申请号：US15250066
申请日：2016-08-29
申请人： Apple Inc.
发明人： James B. Smith , Daniel W. Jarvis , David A. Pakula , Gregory N. Stephens , Nicholas G. L. Merz , Shayan Malek , Sina Bigdeli
IPC分类号： H05K9/00 , H05K1/18 , H01L23/552
摘要： Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
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公开(公告)号：US20180363173A1
公开(公告)日：2018-12-20
申请号：US15941287
申请日：2018-03-30
申请人： Apple Inc.
发明人： Steven J. Keating , Daniel D. Sunshine , Kathryn P. Crews , Daniel A. Podhajny , Nicholas G. L. Merz
摘要： A fabric-based item may include fabric formed from intertwined strands of material such as intertwined strands of tubing. The strands of material may include electrophoretic ink formed from charged nanoparticles of different colors in fluid. The electrophoretic ink may be contained within strands of tubing or may be enclosed within encapsulation structures such as encapsulation spheres. Encapsulation spheres or other encapsulation structures may be embedded in clear polymer binder within tubing or other strands. Electroluminescent particles may be included in the clear polymer binder. Electric fields can be applied to the electrophoretic ink in a given area of the fabric using conductive strands that overlap the area, using conductive electrodes such as transparent conductive electrodes on strands of tubing, using coaxial electrodes, or using other electrode structures.
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6.发明授权Structures for forming conductive paths in antennas and other electronic device structures 有权用于在天线和其他电子设备结构中形成导电路径的结构公开(公告)号：US09431699B2
公开(公告)日：2016-08-30
申请号：US14300704
申请日：2014-06-10
申请人： Apple Inc.
摘要： Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.
摘要翻译： 可以提供包含导电路径的电子设备。 导电路径可以由延伸穿过天线中的电介质间隙的细长金属构件形成。 天线可以由形成天线接地的导电结构和作为电子设备中的外围导电外壳构件的一部分的导电结构形成。 间隙可以将外围导电壳体构件与导电结构分离。 也可以使用一个或多个弹簧形成导电路径。 弹簧可以焊接到导电构件上，并且当弹簧被压缩时可以具有压靠附加的导电构件的插脚。 尖头可能具有变窄的尖端，弯曲形状和毛刺，这有助于在弹簧插脚和附加导电构件之间形成令人满意的电接触。
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7.发明申请Structures for Forming Conductive Paths in Antennas and Other Electronic Device Structures 审中-公开在天线和其他电子设备结构中形成导电路径的结构公开(公告)号：US20140285386A1
公开(公告)日：2014-09-25
申请号：US14300704
申请日：2014-06-10
申请人： Apple Inc.
摘要： Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.
摘要翻译： 可以提供包含导电路径的电子设备。 导电路径可以由延伸穿过天线中的电介质间隙的细长金属构件形成。 天线可以由形成天线接地的导电结构和作为电子设备中的外围导电外壳构件的一部分的导电结构形成。 间隙可以将外围导电壳体构件与导电结构分离。 也可以使用一个或多个弹簧形成导电路径。 弹簧可以焊接到导电构件上，并且当弹簧被压缩时可以具有压靠附加的导电构件的插脚。 尖头可能具有变窄的尖端，弯曲形状和毛刺，这有助于在弹簧插脚和附加导电构件之间形成令人满意的电接触。
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公开(公告)号：US11180871B2
公开(公告)日：2021-11-23
申请号：US15941287
申请日：2018-03-30
申请人： Apple Inc.
发明人： Steven J. Keating , Daniel D. Sunshine , Kathryn P. Crews , Daniel A. Podhajny , Nicholas G. L. Merz
IPC分类号： D03D15/44 , G02F1/167 , D03D1/00 , G02F1/16757 , G02F1/1685 , D03D15/54 , D03D15/60 , D04B1/14
摘要： A fabric-based item may include fabric formed from intertwined strands of material such as intertwined strands of tubing. The strands of material may include electrophoretic ink formed from charged nanoparticles of different colors in fluid. The electrophoretic ink may be contained within strands of tubing or may be enclosed within encapsulation structures such as encapsulation spheres. Encapsulation spheres or other encapsulation structures may be embedded in clear polymer binder within tubing or other strands. Electroluminescent particles may be included in the clear polymer binder. Electric fields can be applied to the electrophoretic ink in a given area of the fabric using conductive strands that overlap the area, using conductive electrodes such as transparent conductive electrodes on strands of tubing, using coaxial electrodes, or using other electrode structures.
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公开(公告)号：US20160321493A1
公开(公告)日：2016-11-03
申请号：US15210777
申请日：2016-07-14
申请人： Apple Inc.
CPC分类号： G06K9/00013 , G06F3/0416 , G06F3/044 , G06K9/0002 , H04B5/0012 , H04B5/0075
摘要： An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.
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公开(公告)号：US09258906B2
公开(公告)日：2016-02-09
申请号：US13863264
申请日：2013-04-15
申请人： Apple Inc.
IPC分类号： B29C65/52 , B32B37/12 , B32B37/26 , B32B38/10 , B32B43/00 , C09J5/02 , H05K3/38 , C09J5/00 , H05K3/32 , H05K3/36
CPC分类号： H05K3/386 , C09J5/00 , C09J2201/606 , C09J2203/326 , C09J2205/31 , H05K3/323 , H05K3/361 , Y10T156/10 , Y10T428/13 , Y10T428/31678
摘要： An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.
摘要翻译： 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。
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