公开(公告)号：US20140141696A1

公开(公告)日：2014-05-22

申请号：US13791733

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D Ambra ,  Jagan Rangarajan

IPC: B24B37/013

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/345

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US20130344625A1

公开(公告)日：2013-12-26

申请号：US14010193

申请日：2013-08-26

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.