Abstract:
The present invention is directed to methods of forming contact openings. In one illustrative embodiment, the method includes forming a feature above a semiconducting substrate, forming a layer stack comprised of a plurality of layers of material above the feature, the layer stack having an original height, reducing the original height of the layer stack to thereby define a reduced height layer stack above the feature, forming an opening in the reduced height layer stack for a conductive member that will be electrically coupled to the feature and forming the conductive member in the opening in the reduced height layer stack.
Abstract:
An update mechanism and approach are provided for configuring a communications receiver. According to the approach, a time domain equalizer and a frequency domain equalizer in a communications receiver are dynamically updated based upon performance data that indicates the performance of a communications channel from which the communications receiver receives data. This approach accounts for changes in the communications channel attributable to changes in the transmission medium or changes in interference sources.
Abstract:
A method of manufacturing a semiconductor device includes forming a silicon germanium layer and a N-channel transistor and a P-channel transistor over the silicon germanium layer. A beta ratio of the N-channel transistor to the P-channel transistor is about 1.8 to about 2.2. A semiconductor device is also disclosed.
Abstract:
Methods of fabricating halo regions are provided. In one aspect, a method is provided of fabricating a first halo region and a second halo region for a circuit device of a first conductivity type and having a gate structure with first and second sidewalls. The first halo region of a second conductivity type is formed by implanting the substrate with impurities in a first direction toward the first sidewall of the gate structure. The second halo region of the second conductivity type is formed by implanting the substrate with impurities in a second direction toward the second sidewall of the gate structure. The first and second halo regions are formed without implanting impurities in a direction substantially perpendicular to the first and second directions.
Abstract:
A wire feeder driving mechanism capable of driving a wire feeder of a spring manufacturing machine to perform a three-dimensional movement. The spring manufacturing machine includes a machine base and a work table. The work table has an opening and a plurality of tool seats. The opening provides the feeding chuck of the wire feeder a moving space. The tool seat is provided to install a tool set to move back and forth on the work table. The wire feeder is assembled with a plurality of axial driving devices. The axial driving device is able to receive power and to move perpendicular to each other. The metal wire led through the wire feeder is thereby able to approach the tool seat in a three-dimensional manner. The spring manufacturing machine is therefore able to produce various complicated springs.
Abstract:
Various circuit devices incorporating junction-traversing dislocation regions and methods of making the same are provided. In one aspect, a method of processing is provided that includes forming an impurity region in a device region of a semiconductor-on-insulator substrate. The impurity region defines a junction. A dislocation region is formed in the device region that traverses the junction. The dislocation region provides a pathway to neutralize charge lingering in a floating body of a device.
Abstract:
The methods provided use external fields such as light and electricity as a means of directing the crystallization of concentrated colloidal systems. Not only can nucleation be directed, crystal melting can be carefully controlled and light-induced crystal diffraction used as a means of directing light propagation. A number of factors play a significant role on the crystallization rate and location, including the intensity of the light field, the magnitude of the electric field, the colloid concentration, the colloid size, and the colloid composition. In varying these parameters, kinetics in these processes are extremely fast when compared to traditional colloidal crystallization approaches.