公开(公告)号：US20120096344A1

公开(公告)日：2012-04-19

申请号：US12907661

申请日：2010-10-19

申请人： Ronald Ho ,  Andrew A. Grieve

发明人： Ronald Ho ,  Andrew A. Grieve

IPC分类号： G06F17/00

CPC分类号： G06T11/60 ,  G06F16/9577 ,  G06F17/211

摘要： Various embodiments are disclosed. According to one example embodiment, an apparatus may include at least one processor; at least one memory including computer program code, the at least one memory and the computer program code configured to, with the at least one processor cause the apparatus to at least: receive, by a computing device having a display with a first dimension that is less than a threshold size, a document including text and at least one image; reformat the document for display on the computing device, including: decreasing a size for at least one of tabs or indents; and moving a location of the at least one image to the left on the display of the computing device.

摘要翻译： 公开了各种实施例。 根据一个示例性实施例，设备可以包括至少一个处理器; 包括计算机程序代码的至少一个存储器，所述至少一个存储器和所述计算机程序代码被配置为与所述至少一个处理器一起使得所述设备至少由具有第一维度的显示器的计算设备接收，所述第一维度是 小于阈值大小，包括文本和至少一个图像的文档; 重新格式化文档以在计算设备上显示，包括：减小选项卡或缩进中的至少一个的大小; 以及将所述至少一个图像的位置移动到所述计算设备的显示器上的左侧。

公开(公告)号：US07865084B2

公开(公告)日：2011-01-04

申请号：US11853316

申请日：2007-09-11

申请人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

发明人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

IPC分类号： H04B10/00

CPC分类号： H01L25/0657 ,  G02B6/43 ,  H01L25/0652 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.

摘要翻译： 描述了包括单芯片模块（CM）阵列的系统的实施例。 该阵列包括第一CM，耦合到第一CM的第二CM和耦合到第二CM的第三CM。 可以是第一CM，第二CM或第三CM的给定CM包括被配置为通过电磁耦合的邻近通信与其他CM通信数据信号的半导体管芯。 这些接近连接器靠近半导体管芯的表面。 此外，第一CM和第三CM被配置为经由第二CM经由光信号路径彼此光学地传送光信号。

公开(公告)号：US07675312B2

公开(公告)日：2010-03-09

申请号：US11859463

申请日：2007-09-21

申请人： Ronald Ho ,  Thomas G. O'Neill ,  Robert D. Hopkins ,  Frankie Y. Liu

发明人： Ronald Ho ,  Thomas G. O'Neill ,  Robert D. Hopkins ,  Frankie Y. Liu

IPC分类号： G01R31/26

CPC分类号： G01R31/3004

摘要： A method and apparatus for performing on-chip voltage sampling of a weakly-driven node of a semiconductor device are disclosed. In some embodiments, the node is a floating node or is capacitively-driven. In some embodiments, it is involved in proximity-based communication. Sampling the node may include isolating the signal to be sampled using a source-follower amplifier before passing it to the sampling circuit. Sampling the node may include biasing the node to a desired voltage using a leaky transistor or other biasing circuit. In some embodiments, the biasing circuit may also be used to calibrate the sampler by coupling one or more calibration voltages to the node in place of a biasing voltage and measuring the sampler output. The sampler may be suitable for sub-sampling high frequency signals to produce a time-expanded, lower frequency version of the signals. The output of the sampler may be a current communicated off-chip for testing.

摘要翻译： 公开了一种用于对半导体器件的弱驱动节点执行片上电压采样的方法和装置。 在一些实施例中，节点是浮动节点或者是电容驱动的。 在一些实施例中，其涉及基于邻近的通信。 对节点进行采样可以包括在将其传送到采样电路之前使用源跟随放大器来隔离要采样的信号。 采样节点可以包括使用泄漏晶体管或其它偏置电路将节点偏置到期望的电压。 在一些实施例中，偏置电路还可以用于通过将一个或多个校准电压耦合到节点来代替偏置电压并测量采样器输出来校准采样器。 采样器可能适用于对高频信号进行子采样，以产生时间扩展的低频版本的信号。 采样器的输出可以是用于测试的芯片外的当前通信。

公开(公告)号：US07659619B1

公开(公告)日：2010-02-09

申请号：US11249821

申请日：2005-10-12

申请人： Arthur R. Zingher ,  Robert J. Moffat ,  Ronald Ho

发明人： Arthur R. Zingher ,  Robert J. Moffat ,  Ronald Ho

IPC分类号： H01L29/41

CPC分类号： H01L23/48 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00

摘要： A device includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to the first surface. The first semiconductor die is configured to have a flexibility compliance greater than a first pre-determined value in a direction substantially perpendicular to a plane including the plurality of proximity connectors in order to reduce misalignment in the direction between the plurality of proximity connectors and additional proximity connectors on another device.

摘要翻译： 一种器件包括具有第一表面和第二表面的第一半导体管芯。 第一半导体管芯被配置为通过电容耦合使用靠近第一表面的多个邻近连接器中的一个或多个连接。 第一半导体管芯被配置为在基本上垂直于包括多个接近连接器的平面的方向上具有大于第一预定值的柔性顺应性，以便减少多个接近连接器之间的方向上的不对准和附加接近 连接器在另一个设备上。

公开(公告)号：US20090067851A1

公开(公告)日：2009-03-12

申请号：US11853316

申请日：2007-09-11

申请人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

发明人： Ashok V. Krishnamoorthy ,  Ronald Ho ,  Brian W. O'Krafka ,  Ilya A. Sharapov ,  John E. Cunningham

IPC分类号： H04B10/00

CPC分类号： H01L25/0657 ,  G02B6/43 ,  H01L25/0652 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.

摘要翻译： 描述了包括单芯片模块（CM）阵列的系统的实施例。 该阵列包括第一CM，耦合到第一CM的第二CM和耦合到第二CM的第三CM。 可以是第一CM，第二CM或第三CM的给定CM包括被配置为通过电磁耦合的邻近通信与其他CM通信数据信号的半导体管芯。 这些接近连接器靠近半导体管芯的表面。 此外，第一CM和第三CM被配置为经由第二CM经由光信号路径彼此光学地传送光信号。

公开(公告)号：US20060095639A1

公开(公告)日：2006-05-04

申请号：US11264956

申请日：2005-11-01

申请人： Bruce Guenin ,  Arthur Zingher ,  Ronald Ho ,  Nyles Nettleton ,  Ashok Krishnamoorthy ,  John Cunningham

发明人： Bruce Guenin ,  Arthur Zingher ,  Ronald Ho ,  Nyles Nettleton ,  Ashok Krishnamoorthy ,  John Cunningham

IPC分类号： G06F13/36

CPC分类号： H01L23/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： One embodiment of the present invention provides a system that facilitates proximity communication using a bridge chip. This system includes a base chip with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The bridge chip is mounted to the base chip using a mounting, interconnection, and communication structure. The bridge chip is positioned so that a free end is proximate to a neighboring chip, thereby supporting proximity communication between the base chip and the neighboring chip.

摘要翻译： 本发明的一个实施例提供一种促进使用桥接芯片的邻近通信的系统。 该系统包括具有主动面的基本芯片，有源电路和信号垫位于该基板上，以及与主动面相对的背面。 桥芯片使用安装，互连和通信结构安装到基座芯片。 桥接芯片被定位成使得自由端靠近相邻的芯片，从而支持基本芯片和相邻芯片之间的邻近通信。

公开(公告)号：US20050285683A1

公开(公告)日：2005-12-29

申请号：US10879606

申请日：2004-06-28

申请人： Robert Drost ,  Ronald Ho ,  Ivan Sutherland

发明人： Robert Drost ,  Ronald Ho ,  Ivan Sutherland

IPC分类号： H03F3/08 ,  H03F3/45 ,  H03F3/191

CPC分类号： H03F3/45977 ,  H03F3/08

摘要： One embodiment of the present invention provides a capacitively-coupled receiver amplifier that has an input with no DC coupling. A DC voltage is programmed on the input. During programming, a transmitter is held at a voltage at a midpoint between a voltage that represents a logical “1” and a voltage that represents a logical “0” and the input voltage of the receiver amplifier is programmed to be substantially the switching-threshold voltage for the receiver amplifier. Then, during normal data communication, the transmitter drives high and low electrical signals that are coupled to the receiver amplifier. Since the input of the receiver amplifier has been substantially set to the DC voltage, the receiver amplifier need not control the DC voltage of the input for each transition in the electrical signals.

摘要翻译： 本发明的一个实施例提供一种具有不具有直流耦合的输入的电容耦合接收放大器。 在输入端编程一个直流电压。 在编程期间，发射机被保持在表示逻辑“1”的电压和表示逻辑“0”的电压之间的中点处的电压，并且接收机放大器的输入电压被编程为基本上是切换阈值 接收放大器的电压。 然后，在正常数据通信期间，发射机驱动耦合到接收放大器的高电平和低电信号。 由于接收机放大器的输入已基本设置为直流电压，所以接收放大器不需要控制电信号中每个转换的输入的直流电压。

公开(公告)号：US20050054139A1

公开(公告)日：2005-03-10

申请号：US10879607

申请日：2004-06-28

申请人： Robert Drost ,  Ivan Sutherland ,  Ronald Ho

发明人： Robert Drost ,  Ivan Sutherland ,  Ronald Ho

IPC分类号： H01L27/04 ,  H01L21/822 ,  H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/48 ,  H01L25/0657 ,  H01L2225/06531 ,  H01L2924/0002 ,  H01L2924/00

摘要： One embodiment of the present invention provides a system that facilitates capacitive inter-chip communication. During operation, the system first determines an alignment between a first semiconductor die and a second semiconductor die. Next, electrical signals are selectively routed to at least one interconnect pad in a plurality of interconnect pads based on the alignment thereby facilitating communication between the first semiconductor die and the second semiconductor die. The plurality of interconnect pads can include transmitting pads, receiving pads, and transmitting and receiving pads. The alignment may be determined continuously or at times separated by an interval, where the interval is fixed or variable. Several variations on this embodiment are provided.

摘要翻译： 本发明的一个实施例提供一种便于电容芯片间通信的系统。 在操作期间，系统首先确定第一半导体管芯和第二半导体管芯之间的对准。 接下来，基于对准，电信号被选择性地路由到多个互连焊盘中的至少一个互连焊盘，从而便于第一半导体管芯和第二半导体管芯之间的连通。 多个互连焊盘可以包括传输焊盘，接收焊盘以及发射和接收焊盘。 可以连续地或有时间隔地间隔地确定对准，其中间隔是固定的或可变的。 提供了该实施例的几个变型。