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公开(公告)号：US20210366641A1
公开(公告)日：2021-11-25
申请号：US16989089
申请日：2020-08-10
发明人： Hwi Dae KIM , Dong Hwan LEE , Sang Soo PARK , Chan YOON , Dong Jin LEE , Hye Mi YOO
摘要： A coil component includes a body, a coil portion disposed in the body and having first and second lead-out portions exposed to at least one surface of the body to be spaced apart from each other, first and second external electrodes disposed on the at least one surface of the body to be spaced apart from each other, and respectively connected to the first and second lead-out portions, a dielectric layer disposed on a surface of the body, and a third external electrode disposed on the surface of the body having the dielectric layer disposed thereon to be spaced apart from each of the first and second external electrodes, and covering the dielectric layer.
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公开(公告)号：US20210350985A1
公开(公告)日：2021-11-11
申请号：US17383961
申请日：2021-07-23
发明人： Hwi Dae KIM , Sang Soo PARK , Young Ghyu AHN
摘要： A capacitor component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and including a first dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in the first direction with the first dielectric layer interposed therebetween, and a first side margin portion and a second side margin portion, respectively including a second dielectric layer, a first margin electrode, and a second margin electrode, disposed in parallel with the fifth and sixth surfaces of the body, and respectively disposed on the fifth and sixth surfaces of the body.
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公开(公告)号：US20210313115A1
公开(公告)日：2021-10-07
申请号：US17349275
申请日：2021-06-16
发明人： Gu Won JI , Heung Kil PARK , Sang Soo PARK , Young Ghyu AHN
摘要： An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc≤1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.
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公开(公告)号：US20210090809A1
公开(公告)日：2021-03-25
申请号：US16990288
申请日：2020-08-11
发明人： Gu Won JI , Heung Kil PARK , Sang Soo PARK , Young Ghyu AHN
摘要： An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc≤1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.
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公开(公告)号：US20200126720A1
公开(公告)日：2020-04-23
申请号：US16212567
申请日：2018-12-06
发明人： Soo Hwan SON , Ho Yoon KIM , Sang Soo PARK , Woo Chul SHIN
摘要： An electronic component includes a multilayer capacitor including a capacitor body, and an external electrode disposed on an external surface of the capacitor body, an interposer including an interposer body, and an external terminals disposed on an external surface of the interposer body, and an encapsulation portion disposed to cover the multilayer capacitor. The external terminal includes a bonding portion disposed on a first surface of the interposer body to be electrically connected to the external electrode, a mounting portion disposed on a second surface of the interposer opposing the first surface, and a connection portion disposed on an end surface of the interposer to electrically connect the bonding portion to the mounting portion. A thickness of the encapsulation portion is within a range from 0.001 to 0.01 of a length of the electronic component.
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公开(公告)号：US20200082979A1
公开(公告)日：2020-03-12
申请号：US16195399
申请日：2018-11-19
发明人： Ho Yoon KIM , Sang Soo PARK , Woo Chul SHIN
摘要： An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04≤t/T≤0.80.
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公开(公告)号：US20190244760A1
公开(公告)日：2019-08-08
申请号：US16389245
申请日：2019-04-19
发明人： Sang Soo PARK , Young Ghyu AHN , Hwi Dae KIM
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/236 , H01G4/248 , H05K1/111 , H05K1/181 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
摘要： A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.
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公开(公告)号：US20180130605A1
公开(公告)日：2018-05-10
申请号：US15865803
申请日：2018-01-09
发明人： Byoung Hwa LEE , Kyo Kwang LEE , Min Cheol PARK , Young Ghyu AHN , Sang Soo PARK
IPC分类号： H01G4/30 , H01G4/248 , H01G2/06 , H01G4/008 , H01G4/12 , H05K1/18 , H05K1/11 , H01G4/232 , H05K3/34
CPC分类号： H01G4/30 , H01G2/065 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/248 , H05K1/111 , H05K1/181 , H05K3/3436 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
摘要： A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044≤LG*log [1/AT]≤0.00150.
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公开(公告)号：US20180130604A1
公开(公告)日：2018-05-10
申请号：US15865773
申请日：2018-01-09
发明人： Byoung Hwa LEE , Kyo Kwang LEE , Min Cheol PARK , Young Ghyu AHN , Sang Soo PARK
IPC分类号： H01G4/30 , H01G4/248 , H01G2/06 , H01G4/008 , H01G4/12 , H05K1/18 , H05K1/11 , H01G4/232 , H05K3/34
CPC分类号： H01G4/30 , H01G2/065 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/248 , H05K1/111 , H05K1/181 , H05K3/3436 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
摘要： A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044≤LG*log [1/AT]≤0.00150.
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公开(公告)号：US20180019059A1
公开(公告)日：2018-01-18
申请号：US15716241
申请日：2017-09-26
发明人： Sang Soo PARK , Min Cheol PARK
CPC分类号： H01G4/1227 , H01G2/065 , H01G4/232 , H01G4/30 , H05K3/3442 , H05K2201/10015
摘要： There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor includes: three external electrodes disposed to be spaced apart from one another on a mounting surface of a ceramic body; first internal electrodes each including first and second lead portions connected to the outermost external electrodes, respectively; and second internal electrodes each including a third lead portion connected to the middle external electrode, in which a first region in which the first internal electrodes are laminated is disposed in a central portion of the ceramic body in a width direction of the ceramic body, and second regions in which the first and second internal electrodes are alternately laminated are disposed on both sides of the intervening first region in the width direction of the ceramic body.
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