摘要:
An airbag covering cap including a support layer and a covering layer of different elasticities, having at least one tear-off line along which the airbag covering cap tears open when the airbag is deployed. The covering layer is weakened by a groove in the region of the tear-off line and the support layer extends into this groove. The covering layer has a section adjacent to the section of the support layer, which extends into said support layer. The edge between the sections of the support and covering layers, each extending into the other layer is configured as a tear-off edge.
摘要:
A battery-operable portable electronic device, having a removable main power source and an auxiliary power source, generates a power failure interrupt signal when it detects a power failure of the removable main power source. Upon detection of the power failure, the electronic device enters a power down mode in which it monitors recovery from the power failure. The electronic device monitors recovery from the power failure by using a battery check routine it pushes on the stack of a microcontroller, and pops off the battery check routine from the stack upon determining a stable recovery, while returning to an exact point in a main program it left when it detected the power failure, the exact point in the main program being represented by a program counter value automatically pushed on the stack upon occurance of the power failure interrupt signal.
摘要:
The present invention relates to a method for coloring ceramic surfaces, wherein the surfaces are treated with an aqueous solution of alkali metal or ammonium dithiosulphatoaurate(I) with a gold concentration of 0.1-10% by weight, the water is evaporated and the dithiosulphatoaurate(I) is decomposed at temperatures of 300-1400.degree. C.
摘要:
An integrated optical circuit is described for coupling an optical fiber amplifier with two or four terminals in such a way that the optical fiber amplifier is supplied with optical signals in a prescribed direction, and the optical signals are coupled out to an optical network via a directed directional coupler. The necessary optical switches, couplers, terminals and light guides are integrated into the integrated optical circuit.
摘要:
This disclosure is directed to an improved semiconductor capacitor structure especially useful in an integrated semiconductor structure with an MOS device and fabrication methods therefor. This semiconductor capacitor is particularly useful for forming the capacitor portion of a single MOS memory cell structure in a dynamic MOS random access memory which utilizes one MOS device in combination with a capacitor. In one specific disclosure embodiment, the semiconductor capacitor comprises a boron (P) implanted region in a substrate of P- type conductivity followed by a shallow arsenic (N) implant into the boron implanted region. The boron implanted region provides a P type conductivity which has a higher concentration of P type impurities than the concentration of impurities contained in the substrate which is of P- type conductivity. Thus, the boron implanted region performs the important function of preventing a surface N type inversion layer from being formed across the semiconductor surface beneath the silicon dioxide insulating layer which could occur across the substrate P- surface if the arsenic implant region was made into the P- substrate without the P type boron implant. The arsenic implant is of N type conductivity and has a higher concentration of impurities than the boron implant region. The dielectric portion of the semiconductor capacitor is the portion of the silicon dioxide layer located on the surface of the arsenic implanted region. A doped polysilicon electrode is formed over this portion of the silicon dioxide insulating layer and provides the other plate of the capacitor structure. In another embodiment that is disclosed, this above described semiconductor capacitor structure or device is combined with an MOS device in a single integrated semiconductor structure in order to provide a single MOS memory cell for dynamic random access memory chip utilizing the MOS device and the capacitor. Preferably, the semiconductor capacitor is shown as a connected extension of either the source or drain region of the MOS device.
摘要:
A novel MOSFET circuit and method of manufacture utilizing a double ion implant process for manufacturing a low voltage high performance n-channel device that includes an enhancement transistor inverter combined with a depletion transistor load. The process starts with high resistivity material and uses a first ion implant process to dope the field region and to give the required threshold voltage for an enhancement device. A second ion implant is used to dope the channel region for the depletion device.