公开(公告)号：US11499077B2

公开(公告)日：2022-11-15

申请号：US16233169

申请日：2018-12-27

Applicant: Samsung Display Co. Ltd. ,  Sekisui Chemical Co., Ltd.

Inventor： Se Ki Park ,  Dong Yeol Yeom ,  Mariko Noda ,  Satoshi Doi ,  Shigeki Matsuki ,  Yuki Iwai ,  Tomoya Kawamoto

IPC: C09J201/02 ,  C09J7/38 ,  C09J133/08 ,  C09J7/24 ,  C09J7/29 ,  C09J133/14 ,  C08K3/04 ,  C08K5/54

Abstract: A double-sided tape including: a first adhesive layer including about 100 parts by weight of an acrylic polymer, about 1 to about 2 parts by weight of a silane coupling agent, and about 0.1 to about 0.18 parts by weight of carbon black; a foamed polymer layer disposed on the first adhesive layer, including a urethane foam; an interlayer polymer layer disposed on the foamed polymer layer, including a polyolefin (PO), polyethylene terephthalate (PET), a polyester, or a combination thereof; and a second adhesive layer disposed on the interlayer polymer layer, including about 100 parts by weight of an acrylic polymer, about 1 to about 2 parts by weight of a silane coupling agent, and about 0.1 to about 0.18 parts by weight of carbon black, wherein an overall thickness of the double-sided tape is in a range of about 0.4 millimeters to about 1.3 millimeters.

公开(公告)号：US11254842B2

公开(公告)日：2022-02-22

申请号：US16328028

申请日：2017-08-21

Applicant: AMOGREENTECH CO., LTD.

Inventor： In Yong Seo ,  Ui Young Jeong

IPC: C09J7/38 ,  C09J9/02 ,  C09J7/21 ,  C09J7/29 ,  C09J201/00 ,  C09J201/02 ,  D04H3/005 ,  B32B37/00

Abstract: Provided are a pressure-sensitive adhesive tape, a method of manufacturing the same, and an electronic device having the same. The pressure-sensitive adhesive tape includes: a fiber accumulation type substrate in which a plurality of fibers are accumulated to form a plurality of pores therebetween; a metal coating layer coated on the outer circumferential surfaces of the plurality of fibers of the fiber accumulation type substrate; and an electrically conductive adhesive layer formed on one side or both sides of the fiber accumulation type substrate on which the metal coating layer is formed, wherein the electrically conductive adhesive layer is formed of an electrically conductive adhesive material filled in the plurality of pores and is electrically connected by an applied pressure.

公开(公告)号：US11251055B2

公开(公告)日：2022-02-15

申请号：US16979781

申请日：2019-03-01

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takahiro Kuroda ,  Tomohiro Nagoya ,  Naoki Tomori

IPC: H01L21/56 ,  C09J7/25 ,  C09J7/35 ,  C09J11/06 ,  C09J201/02 ,  H01L23/495 ,  H01L23/00

Abstract: Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

公开(公告)号：US20220020606A1

公开(公告)日：2022-01-20

申请号：US17489922

申请日：2021-09-30

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Takahiro KURODA ,  Tomohiro NAGOYA ,  Naoki TOMORI

IPC: H01L21/56 ,  C09J7/25 ,  C09J7/35 ,  C09J11/06 ,  C09J201/02 ,  H01L23/495 ,  H01L23/00

Abstract: A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

公开(公告)号：US11208577B2

公开(公告)日：2021-12-28

申请号：US16316641

申请日：2017-07-11

Applicant: Lohmann GmbH & Co. KG ,  LOGIS AG ,  LOGIS TECHNOLOGIES GMBH

Inventor： Thomas Fogel ,  Christoph Frieb ,  Martin Haag

IPC: C09J7/29 ,  B32B27/36 ,  B60P7/08 ,  C09J201/02

Abstract: The present invention relates to a method for producing a single-sided adhesive film (1) for securing a load, comprising providing a backing layer (2) and coating a first side of the backing layer (2) with an adhesive layer (3), wherein a plastic (4) is applied to a second side of the backing layer (2) in order to form a non-slip surface on the adhesive film (1). Moreover, the present invention relates to a single-sided adhesive film (1) produced by the above method.

公开(公告)号：US11141326B2

公开(公告)日：2021-10-12

申请号：US15767243

申请日：2016-10-14

Applicant: NITTO DENKO CORPORATION

Inventor： Shinsuke Ikishima ,  Muneshige Nakagawa

IPC: A61F13/58 ,  B32B27/00 ,  C09J201/00 ,  C09J7/20 ,  B32B7/04 ,  B32B7/05 ,  A61F13/62 ,  C09J7/24 ,  B32B5/02 ,  B32B27/12 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  C09J201/02

Abstract: Provided is an ultrasmall-sized fixing tape suitable for a disposal tape for an absorbent article, such as a disposable diaper, a sanitary napkin, or an incontinence pad. The ultrasmall fixing tape of the present invention includes: an extending portion; and a non-extending portion that is substantially free from extending, in which: the non-extending portion includes securing means in at least part thereof; the ultrasmall fixing tape has a base material layer B; the base material layer B has a thickness of 50 μm or more; and the base material layer B has an upper yield strength in a longitudinal direction thereof at a temperature of 23° C. and a humidity of 50% of from 5 N/25 mm to 15 N/25 mm.

公开(公告)号：US11052560B2

公开(公告)日：2021-07-06

申请号：US16095162

申请日：2017-03-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Garry Cyrille Alfred VanDenBerghe

IPC: B26D1/547 ,  B44C1/10 ,  C09J7/38 ,  C09J201/02

Abstract: A vehicle is wrapped by an adhesive film which is then slit by applying first tape to the vehicle having a longitudinally extending filament carried by the tape at a position spaced from the side edges. A second tape is applied over the film at the first tape body so as to bridge to each side of the filament and pulling the filament so as to tear through the film and the first ad second tapes body with the second tape applying a force to the film acting to reduce tendency of the film to pull away from the object during the cutting by the filament as the filament is pulled.

公开(公告)号：US10815404B2

公开(公告)日：2020-10-27

申请号：US15748900

申请日：2016-08-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Richard Y. Liu ,  Jingjing Ma ,  Zhong Chen ,  Victor Ho ,  Nathaniel I. Lehn ,  Harold T. Munson

IPC: C09J167/06 ,  C09J7/38 ,  C09J7/22 ,  C08G63/54 ,  C08G63/676 ,  C09J167/02 ,  C09J201/02 ,  C09J7/25 ,  C08G63/12 ,  C08G63/16 ,  C08G63/52 ,  C08G63/66 ,  C08G63/672

Abstract: Polyester pressure-sensitive adhesives are described. The polyester includes at least two different diacid residues and at least two different diol residues. The polyester includes at least one pendant group containing an alkenyl group. A ratio of a total number of the at least one pendant group to the total number of ester groups in the polyester is in a range of 0.001 to 0.1. The polyester has a glass transition temperature in a range of −50° C. to −10° C.

公开(公告)号：US10717844B2

公开(公告)日：2020-07-21

申请号：US15916368

申请日：2018-03-09

Applicant: Lintec of America, Inc.

Inventor： Marcio D. Lima ,  Julia Bykova

IPC: C08K3/04 ,  B32B5/02 ,  B32B7/12 ,  C09J9/02 ,  C09J7/38 ,  C09J7/22 ,  C08J5/18 ,  C08J7/04 ,  B32B5/12 ,  B32B7/06 ,  B32B15/14 ,  C09J201/02 ,  B32B9/00 ,  B32B17/10 ,  B32B27/30 ,  C08J5/04 ,  C08L23/08 ,  C08L29/14 ,  C08K3/08 ,  C08K7/06 ,  B32B9/04 ,  B82Y40/00

Abstract: A composite including a heat conformable polymer and a nanofiber sheet is disclosed. The heat conformable polymer can be a hot melt adhesive, and the combination can provide an electrically conductive hot melt adhesive composite. The nanofiber layer is protected and the composite is conformable and/or can be adhered to a variety of surfaces.

公开(公告)号：US10577520B2

公开(公告)日：2020-03-03

申请号：US15371436

申请日：2016-12-07

Applicant: The Swatch Group Research and Development Ltd

Inventor： Claire Rannoux ,  Maria Fernandez Ciurleo

IPC: C09J5/04 ,  C09J201/02 ,  C09J153/00 ,  C09J5/00 ,  C08F293/00 ,  C09J201/00 ,  C08F220/06 ,  G04B15/14 ,  B32B7/12 ,  C09J5/06 ,  G04B37/22 ,  C09J155/04 ,  G04B29/02 ,  G04B29/04

Abstract: An assembly of timepiece parts assembled together with an adhesive at a temperature TA and to be repositioned when the adhesive is at a temperature TC. The adhesive includes a formulation, which at TC includes a mixture of polymer chains with pendant diene units X and coupling molecules including two dienophile end groups Y, wherein the X units and the Y groups are arranged to react with one another and to bond together with the Diels-Alder reaction at a temperature TDA and to regenerate with the retro-Diels-Alder reaction at a temperature TRDA, at TA forms a three-dimensional network, in which the polymer chains are linked to one another by the coupling molecules with the Diels-Alder reaction, where TA