Bulk substrate FET integrated on CMOS SOI
    121.
    发明授权
    Bulk substrate FET integrated on CMOS SOI 有权
    集成在CMOS SOI上的散装衬底FET

    公开(公告)号:US08232599B2

    公开(公告)日:2012-07-31

    申请号:US12683456

    申请日:2010-01-07

    CPC classification number: H01L27/1207 H01L21/84

    Abstract: An integrated circuit is provided that integrates an bulk FET and an SOI FET on the same chip, where the bulk FET includes a gate conductor over a gate oxide formed over a bulk substrate, where the gate dielectric of the bulk FET has the same thickness and is substantially coplanar with the buried insulating layer of the SOI FET. In a preferred embodiment, the bulk FET is formed from an SOI wafer by forming bulk contact trenches through the SOI layer and the buried insulating layer of the SOI wafer adjacent an active region of the SOI layer in a designated bulk device region. The active region of the SOI layer adjacent the bulk contact trenches forms the gate conductor of the bulk FET which overlies a portion of the underlying buried insulating layer, which forms the gate dielectric of the bulk FET.

    Abstract translation: 提供了一种集成电路,其将同一芯片上的体FET和SOI FET集成在一起,其中,本体FET包括在大块衬底上形成的栅极氧化物上的栅极导体,其中本体FET的栅极电介质具有相同的厚度, 与SOI FET的掩埋绝缘层基本共面。 在优选实施例中,通过在指定的大容量器件区域中与SOI层的有源区相邻的SOI层和SOI晶片的掩埋绝缘层形成体接触沟槽,从SOI晶片形成本体FET。 邻近体接触沟槽的SOI层的有源区域形成体FET的栅极导体,其覆盖形成本体FET的栅极电介质的下层掩埋绝缘层的一部分。

    BULK SUBSTRATE FET INTEGRATED ON CMOS SOI
    122.
    发明申请
    BULK SUBSTRATE FET INTEGRATED ON CMOS SOI 有权
    集成在CMOS SOI上的基极FET

    公开(公告)号:US20120187492A1

    公开(公告)日:2012-07-26

    申请号:US13425681

    申请日:2012-03-21

    CPC classification number: H01L27/1207 H01L21/84

    Abstract: An integrated circuit is provided that integrates an bulk FET and an SOI FET on the same chip, where the bulk FET includes a gate conductor over a gate oxide formed over a bulk substrate, where the gate dielectric of the bulk FET has the same thickness and is substantially coplanar with the buried insulating layer of the SOI FET. In a preferred embodiment, the bulk FET is formed from an SOI wafer by forming bulk contact trenches through the SOI layer and the buried insulating layer of the SOI wafer adjacent an active region of the SOI layer in a designated bulk device region. The active region of the SOI layer adjacent the bulk contact trenches forms the gate conductor of the bulk FET which overlies a portion of the underlying buried insulating layer, which forms the gate dielectric of the bulk FET.

    Abstract translation: 提供了一种集成电路,其将同一芯片上的体FET和SOI FET集成在一起,其中,本体FET包括在大块衬底上形成的栅极氧化物上的栅极导体,其中本体FET的栅极电介质具有相同的厚度, 与SOI FET的掩埋绝缘层基本共面。 在优选实施例中,通过在指定的大容量器件区域中与SOI层的有源区相邻的SOI层和SOI晶片的掩埋绝缘层形成体接触沟槽,从SOI晶片形成本体FET。 邻近体接触沟槽的SOI层的有源区域形成体FET的栅极导体,其覆盖形成本体FET的栅极电介质的下层掩埋绝缘层的一部分。

    Apparatus and method to harden computer system
    123.
    发明授权
    Apparatus and method to harden computer system 有权
    硬化计算机系统的装置和方法

    公开(公告)号:US08132267B2

    公开(公告)日:2012-03-06

    申请号:US12286352

    申请日:2008-09-30

    Abstract: In some embodiments, a processor-based system may include a processor, the processor having a processor identification, one or more electronic components coupled to the processor, at least one of the electronic components having a component identification, and a hardware security component coupled to the processor and the electronic component. The hardware security component may include a secure non-volatile memory and a controller. The controller may be configured to receive the processor identification from the processor, receive the at least one component identification from the one or more electronic components, and determine if a boot of the processor-based system is a provisioning boot of the processor-based system. If the boot is determined to be the provisioning boot, the controller may be configured to store a security code in the secure non-volatile memory, wherein the security code is based on the processor identification and the at least one component identification. Other embodiments are disclosed and claimed.

    Abstract translation: 在一些实施例中,基于处理器的系统可以包括处理器,处理器具有处理器标识,耦合到处理器的一个或多个电子部件,具有部件识别的电子部件中的至少一个以及耦合到 处理器和电子元件。 硬件安全组件可以包括安全的非易失性存储器和控制器。 控制器可以被配置为从处理器接收处理器标识,从一个或多个电子部件接收至少一个组件标识,并且确定基于处理器的系统的启动是否是基于处理器的系统的供应引导 。 如果确定引导是供应启动,则控制器可以被配置为将安全代码存储在安全非易失性存储器中,其中安全代码基于处理器标识和至少一个组件标识。 公开和要求保护其他实施例。

    Providing Integrity Verification And Attestation In A Hidden Execution Environment
    124.
    发明申请
    Providing Integrity Verification And Attestation In A Hidden Execution Environment 有权
    在隐藏的执行环境中提供完整性验证和证明

    公开(公告)号:US20110145598A1

    公开(公告)日:2011-06-16

    申请号:US12639616

    申请日:2009-12-16

    CPC classification number: G06F21/554 G06F21/44 G06F21/57 G06F21/64

    Abstract: In one embodiment, a processor includes a microcode storage including processor instructions to create and execute a hidden resource manager (HRM) to execute in a hidden environment that is not visible to system software. The processor may further include an extend register to store security information including a measurement of at least one kernel code module of the hidden environment and a status of a verification of the at least one kernel code module. Other embodiments are described and claimed.

    Abstract translation: 在一个实施例中,处理器包括微代码存储器,其包括处理器指令,用于创建和执行在系统软件不可见的隐藏环境中执行的隐藏资源管理器(HRM)。 处理器还可以包括扩展寄存器,用于存储包括隐藏环境的至少一个内核代码模块的测量值和至少一个内核代码模块的验证状态的安全信息。 描述和要求保护其他实施例。

    FIELD EFFECT TRANSISTOR CONTAINING A WIDE BAND GAP SEMICONDUCTOR MATERIAL IN A DRAIN
    128.
    发明申请
    FIELD EFFECT TRANSISTOR CONTAINING A WIDE BAND GAP SEMICONDUCTOR MATERIAL IN A DRAIN 有权
    含有宽带带隙半导体材料的场效应晶体管

    公开(公告)号:US20090121258A1

    公开(公告)日:2009-05-14

    申请号:US11939017

    申请日:2007-11-13

    Applicant: Arvind Kumar

    Inventor: Arvind Kumar

    Abstract: A field effect transistor comprising a silicon containing body is provided. After formation of a gate dielectric, gate electrode, and a first gate spacer, a drain side trench is formed and filled with a wide band gap semiconductor material. Optionally, a source side trench may be formed and filled with a silicon germanium alloy to enhance an on-current of the field effect transistor. Halo implantation and source and drain ion implantation are performed to form various doped regions. Since the wide band gap semiconductor material as a wider band gap than that of silicon, impact ionization is reduced due to the use of the wide band gap semiconductor material in the drain, and consequently, a breakdown voltage of the field effect transistor is increased compared to transistors employing silicon in the drain region.

    Abstract translation: 提供了包括硅含量体的场效应晶体管。 在形成栅极电介质,栅极电极和第一栅极间隔物之后,形成漏极侧沟槽并填充宽带隙半导体材料。 可选地,可以形成源极沟槽并填充硅锗合金以增强场效应晶体管的导通电流。 进行光晕注入和源极和漏极离子注入以形成各种掺杂区域。 由于宽带隙半导体材料作为比硅的带隙宽的带隙,由于在漏极中使用宽带隙半导体材料,因此冲击电离降低,因此,场效应晶体管的击穿电压比较 涉及在漏极区域中使用硅的晶体管。

    Techniques for Enabling Multiple Vt Devices Using High-K Metal Gate Stacks
    129.
    发明申请
    Techniques for Enabling Multiple Vt Devices Using High-K Metal Gate Stacks 失效
    使用高K金属栅极堆栈启用多个Vt器件的技术

    公开(公告)号:US20090108373A1

    公开(公告)日:2009-04-30

    申请号:US11927964

    申请日:2007-10-30

    CPC classification number: H01L27/1104 H01L27/11 H01L27/1108

    Abstract: Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.

    Abstract translation: 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面,一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET,每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层,其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ,SRAM nFET和SRAM pFET。

    System and method for identity confirmation of a contact published on a network
    130.
    发明授权
    System and method for identity confirmation of a contact published on a network 有权
    在网络上发布的联系人身份确认的系统和方法

    公开(公告)号:US07437566B2

    公开(公告)日:2008-10-14

    申请号:US10837131

    申请日:2004-05-01

    Abstract: A system and method is provided for confirmation of the identity of a contact on the network. A notification that a nearby user is present on a network is signed with a private key associated with the nearby user. The private key is also associated with a public key. A local user that has the nearby user's public key can verify the signature on the notification and confirm that the nearby user is the source of the notification. The verification of identity of the nearby user allows rich content previously stored for the nearby user to be displayed along with the nearby user's presence information.

    Abstract translation: 提供了用于确认网络上的联系人身份的系统和方法。 附近用户在网络上的通知用与附近用户相关联的私钥进行签名。 私钥也与公钥相关联。 具有附近用户公钥的本地用户可以验证通知上的签名,并确认附近用户是通知的来源。 对附近用户的身份的验证允许与附近用户的存在信息一起显示先前为附近用户存储的丰富内容。

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