Image forming apparatus, correction parameter setting device, and density non-uniformity correction device
    122.
    发明授权
    Image forming apparatus, correction parameter setting device, and density non-uniformity correction device 有权
    图像形成装置,校正参数设定装置以及密度非均匀性校正装置

    公开(公告)号:US07489884B2

    公开(公告)日:2009-02-10

    申请号:US11446400

    申请日:2006-06-05

    IPC分类号: G03G15/00 G03G15/043

    摘要: An image forming apparatus includes a first submodule used for image formation; a first phase detector detecting a phase of the first submodule; a second submodule used for image formation with the first submodule; a second phase detector detecting a phase of the second submodule; a density detector detecting density of an image formed by the first and second submodules; a correction setting section setting a first and second parameters to correct density non-uniformity in a slow-scan direction caused by the first and second submodules, respectively, based on the detected image density data; an output setting section deriving a first correction value for the phase of the first submodule from the first parameter and a second correction value for the phase of the second submodule from the second parameter, and outputting a correction value generated by merging the first and second correction values; and an imaging condition changing section changing imaging conditions in accordance with the correction value.

    摘要翻译: 图像形成装置包括用于图像形成的第一子模块; 检测第一子模块的相位的第一相位检测器; 用于与第一子模块成像的第二子模块; 检测第二子模块的相位的第二相位检测器; 密度检测器,检测由第一和第二子模块形成的图像的密度; 校正设置部分,基于检测到的图像浓度数据,分别设置第一和第二参数以分别校正由第一和第二子模块引起的慢扫描方向上的浓度不均匀性; 输出设定部,从第一参数导出第一子模块的相位的第一校正值,从第二参数导出第二子模块的相位的第二校正值,并输出通过合并第一和第二校正而产生的校正值 价值观 以及成像条件改变部分,根据校正值改变成像条件。

    Electronic component unit and electronic apparatus
    123.
    发明申请
    Electronic component unit and electronic apparatus 失效
    电子元件单元和电子设备

    公开(公告)号:US20080278910A1

    公开(公告)日:2008-11-13

    申请号:US12153583

    申请日:2008-05-21

    IPC分类号: H05K7/20

    摘要: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

    摘要翻译: 气流通过电子部件单元中的空气入口引入外壳。 空气流向第一电子部件。 气流吸收来自第一电子部件的热量。 因此,第一电子部件被充分冷却。 第二电子部件安装在印刷电路板上,位于远离第一电子部件的位置的空气入口的位置。 在外壳中形成进气口。 进气口限定在至少在第一和第二电子部件之间的与印刷线路板相对的外壳的一部分处。 通过进气口向第二电子部件引入气流。 因此,第二电子开口被充分冷却。 以这种方式,第一和第二电子部件被最大限度地冷却。

    Electronic apparatus
    125.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号:US07365977B2

    公开(公告)日:2008-04-29

    申请号:US11387768

    申请日:2006-03-24

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20736

    摘要: Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section, airflow blocked in the first section is forced to run into the second section. A smooth airflow can be established in the first section. Moreover, if the pressure in the first section is set larger than the pressure in the second section, a smoother airflow is established from the first section to the second section. A further superior airflow can be established in the first section.

    摘要翻译: 允许第一部分中的空气通过电子设备中的第一和第二通风口进入第二部分。 这导致第一部分中的气流量的增加。 特别地,如果第一部分的压力损失较大,则在第一部分中阻塞的气流被迫流入第二部分。 在第一部分可以建立平稳的气流。 此外,如果第一部分中的压力设定为大于第二部分中的压力,则从第一部分到第二部分建立更平滑的气流。 在第一部分可以建立更好的气流。

    DEVELOPING UNIT AND PROCESS CARTRIDGE FOR REDUCING TONER SCATTERING, AND IMAGE FORMING APPARATUS USING THE SAME
    126.
    发明申请
    DEVELOPING UNIT AND PROCESS CARTRIDGE FOR REDUCING TONER SCATTERING, AND IMAGE FORMING APPARATUS USING THE SAME 有权
    用于减少调色剂的开发单元和过程盒,以及使用其的图像形成装置

    公开(公告)号:US20080013982A1

    公开(公告)日:2008-01-17

    申请号:US11777645

    申请日:2007-07-13

    申请人: Hideki Kimura

    发明人: Hideki Kimura

    IPC分类号: G03G15/08

    CPC分类号: G03G15/0898

    摘要: A developing unit for developing a latent image formed on an image carrier includes a developer carrier, a developer regulator, and a sealing member. The developer carrier bears a developer, and is disposed facing the image carrier at a first position. The developer regulator regulates an amount of the developer, and is disposed facing the developer carrier at a second position upstream of the developer carrier in a moving direction thereof relative to the first position. The sealing member comes into contact with the image carrier at a third position upstream of the image carrier in a moving direction thereof relative to the first position. Therefore, gas is prevented from flowing from an outside area of the developing unit into an area defined by the second position to the third position.

    摘要翻译: 用于显影形成在图像载体上的潜像的显影单元包括显影剂载体,显影剂调节剂和密封构件。 显影剂载体带有显影剂,并且在第一位置处被布置成面向图像载体。 显影剂调节剂调节显影剂的量,并且相对于第一位置在显影剂载体的上游的第二位置处朝着显影剂载体的移动方向布置。 密封构件在图像载体的上游第三位置处与图像载体相对于第一位置在其移动方向上接触。 因此,防止气体从显影单元的外部区域流入由第二位置到第三位置限定的区域。

    Method for bonding heatsink and semiconductor device with heatsink
    128.
    发明申请
    Method for bonding heatsink and semiconductor device with heatsink 失效
    散热片和半导体器件与散热片的接合方法

    公开(公告)号:US20070224734A1

    公开(公告)日:2007-09-27

    申请号:US11387769

    申请日:2006-03-24

    申请人: Hideki Kimura

    发明人: Hideki Kimura

    IPC分类号: H01L21/00

    CPC分类号: H01L21/50

    摘要: A simple method for bonding a heatsink for improving heat-radiating efficiency, comprising the steps of sticking a double-sided adhesive tape to an end portion on an adhesion surface of at least either the heatsink or the semiconductor device; applying an adhesive onto the adhesion surface of at least either the heatsink or the semiconductor device; bringing the end portion into contact with a corresponding portion of the other one of the heatsink or the semiconductor device; and turning at least either the heatsink or the semiconductor device with the contacting portion as a rotation center to bond together the adhesion surfaces of the heatsink and the semiconductor device.

    摘要翻译: 一种用于粘接散热器以提高散热效率的简单方法,包括以下步骤:将双面胶带粘贴在散热片或半导体装置中的至少任一者的粘合表面上的端部; 将粘合剂施加到至少散热器或半导体器件的粘合表面上; 使所述端部与所述散热器或所述半导体器件中的另一个的对应部分接触; 以及将所述接触部分的所述散热片或所述半导体器件中的至少一个转动为旋转中心,以将所述散热器和所述半导体器件的粘附表面粘合在一起。

    Electronic component unit and electronic apparatus
    129.
    发明申请
    Electronic component unit and electronic apparatus 有权
    电子元件单元和电子设备

    公开(公告)号:US20070223200A1

    公开(公告)日:2007-09-27

    申请号:US11387761

    申请日:2006-03-24

    IPC分类号: H05K7/16

    摘要: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

    摘要翻译: 气流通过电子部件单元中的空气入口引入外壳。 空气流向第一电子部件。 气流吸收来自第一电子部件的热量。 因此,第一电子部件被充分冷却。 第二电子部件安装在印刷电路板上,位于远离第一电子部件的位置的空气入口的位置。 在外壳中形成进气口。 进气口限定在至少在第一和第二电子部件之间的与印刷线路板相对的外壳的一部分处。 通过进气口向第二电子部件引入气流。 因此,第二电子开口被充分冷却。 以这种方式,第一和第二电子部件被最大限度地冷却。