公开(公告)号：US4171761A

公开(公告)日：1979-10-23

申请号：US888091

申请日：1978-03-20

Applicant: Robert L. Boldt ,  George R. Wood, Jr.

Inventor： Robert L. Boldt ,  George R. Wood, Jr.

IPC: B23K3/06 ,  B23K1/08 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: Apparatus is disclosed herein for extending the length of a trailing wave of a double sided laminar wave of solder by the use of a dam in an oil intermix wave soldering system to create a dead zone while still being able to remove oil from the surface of the dead zone area on a continuous basis to prevent contaminants from interfering with soldering operations.

Abstract translation: 本文公开了用于通过在油混合波峰焊系统中使用坝来延长双面层状波焊料的拖尾波长的装置，以产生死区，同时仍然能够从 死区区域，以防止污染物干扰焊接操作。

公开(公告)号：US4162034A

公开(公告)日：1979-07-24

申请号：US902612

申请日：1978-05-03

Applicant: Emil P. Pavlas

Inventor： Emil P. Pavlas

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K3/06 ,  B23K2201/42

Abstract: Solder is forced through an ejector and flow well to impinge a solder fountain against soldered leads extending through a circuit board from a component. The solder on the leads is melted to permit the removal and replacement of the component. Overflowing solder is collected and recirculated by action of the ejector. The construction of the solder fountain is such that there are no close fitting moving parts which may become clogged by solder inclusions.

Abstract translation: 焊料被迫通过喷射器并且流动良好以将焊料喷射到从部件延伸穿过电路板的焊接引线上。 引线上的焊料熔化，以允许部件的拆卸和更换。 收集溢出的焊料并通过喷射器的作用再循环。 焊盘的构造使得没有紧密配合的运动部件可能被焊料夹杂物阻塞。

公开(公告)号：US4046105A

公开(公告)日：1977-09-06

申请号：US587946

申请日：1975-06-16

Applicant: Nicolas Gueco Gomez

Inventor： Nicolas Gueco Gomez

IPC: H05K3/34 ,  B23K1/08 ,  B23K3/06 ,  B05C5/02

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: For use in soldering the backplanes of printed circuit or other type electronic boards, a solder wave generator is disclosed with opposed side jet walls. The side jet configuration, because of opposed jet flow, provides an inertia necessary to balance the side forces and the pressure developed by the central pool of fluid, in this instance solder. The central pool, as supported by the side flow, is nearly stationary and the width of the pool can be varied substantially without increasing the total flow rate or the head of the pumping system.

Abstract translation: 为了用于焊接印刷电路板或其他类型的电子板的背板，公开了一种具有相对的侧面喷射壁的焊波发生器。 由于相对的喷射流动，侧喷式构造提供了平衡侧力和由中央流体池（在这种情况下为焊料）形成的压力所需的惯性。 由侧流支撑的中央池几乎是静止的，并且池的宽度可以基本上变化而不增加总流量或泵送系统的头部。

公开(公告)号：US3989180A

公开(公告)日：1976-11-02

申请号：US543886

申请日：1975-01-24

Applicant: Louis V. Tardoskegyi

Inventor： Louis V. Tardoskegyi

IPC: B23K3/06 ,  B23K1/08 ,  B23K31/02

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: Workpieces, such as printed circuit boards, are processed by passing the boards in contact with a standing wave of molten solder formed by circulating molten solder upwardly through a nozzle to overflow at least one edge thereof to form a standing wave which is accelerated by gravity so as normally to have an upper surface ballistically curved in the direction of flow. In accordance with the invention, the undersurface of the standing wave is supported to have a ballistic curvature, in the direction of flow, such that a major portion of the upper surface of the wave is substantially planar with the cross-sectional area of the wave varying, in the direction of flow, in a manner similar to the variation of the cross-sectional area of an unsupported wave following a ballistic curve in is trajectory. This results in the upper surface of the wave being substantially planar throughout a major portion of its length, and inclined downwardly from the horizontal, at a small angle, in the direction of flow of the solder. The angle to the horizontal may be varied between 3.degree.-10.degree. but preferably is from 4.degree. to 6.degree.. Supporting of the undersurface of the wave is effected by an extension of at least one wall of the nozzle, in the direction of solder flow, this extendsion having a ballistic curvature in the direction of solder flow of an extent such that the upper surface of the standing wave is substantially flat and inclined downwardly in the direction of the flow.

Abstract translation: 诸如印刷电路板的工件通过将与熔融焊料的驻波接触的板通过使熔融焊料向上延伸通过喷嘴而至少溢出其至少一个边缘而形成由重力加速的驻波而进行处理 通常具有在流动方向上弹性弯曲的上表面。 根据本发明，驻波的下表面被支撑成具有在流动方向上的弹道曲率，使得波的上表面的主要部分与波的横截面积基本上是平面的 以与轨迹中的弹道曲线之后的无支撑波的横截面面积的变化类似的方式在流动方向上变化。 这导致波的上表面在其长度的大部分基本上是平面的，并且沿着焊料的流动方向以水平方向以小的角度向下倾斜。 与水平面的角度可以在3°-10°之间变化，但优选在4°至6°之间。 通过在焊料流动的方向上延伸喷嘴的至少一个壁来支撑波浪的下表面，这种延伸在焊料流动方向上具有一定程度的弹道曲率，使得 驻波基本上平坦并且在流动方向上向下倾斜。

公开(公告)号：US3926360A

公开(公告)日：1975-12-16

申请号：US47369874

申请日：1974-05-28

Applicant: BURROUGHS CORP

Inventor： MOISTER JR DOUGLAS E

IPC: B23K1/005 ,  H05K3/34 ,  H05K3/36 ,  H01R43/00

CPC classification number: H01R12/62 ,  B23K1/0053 ,  B23K2201/42 ,  H05K3/3494 ,  H05K3/363 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455

Abstract: An improved method for soldering the terminals of a rigid printed circuit board to those of a flexible printed circuit board, such method comprising the steps of focusing a radiant heating source upon each of a plurality of solder globules deposited in a like number of through holes in the terminals of the rigid printed circuit board for controlling of the capillary flow of the molten solder radially from the through holes to form solder points of controlled depth and pattern between the terminals of the boards.

公开(公告)号：US3865298A

公开(公告)日：1975-02-11

申请号：US38830573

申请日：1973-08-14

Applicant: ATOMIC ENERGY COMMISSION

Inventor： ALLEN TRAVIS A ,  SYLVESTER ROBERT T

IPC: H05K3/24 ,  B23K1/00 ,  B23K1/008 ,  B23K1/018 ,  B23K1/08 ,  B23K3/06 ,  B23K3/08 ,  H05K3/34 ,  B23K3/00

CPC classification number: B23K1/008 ,  B23K1/08 ,  B23K3/0646 ,  B23K3/08 ,  B23K2201/42 ,  H05K3/3468 ,  H05K2203/044 ,  H05K2203/045 ,  H05K2203/081 ,  H05K2203/1518 ,  Y10S134/902

Abstract: Removal of excess or undesirable solder from printed circuit boards that may contain through-holes, conductors, connectors, etc. is accomplished by covering such boards with liquid flux, contacting with liquid solder, removing from the solder, and subsequently passing intermediate offset, hot gas jets which flow hot gas under pressure onto the boards and sweep off undesired solder, clear the holes, and leave an optimum thickness solder layer.

Abstract translation: 从可能包含通孔，导体，连接器等的印刷电路板上去除多余的或不需要的焊料是通过用液体焊剂覆盖这种板，与液体焊料接触，从焊料中除去，随后通过中间偏移热 将压力下的热气体流入板上并清除不需要的焊料的气体喷嘴，清除孔，并留出最佳厚度的焊料层。

公开(公告)号：US3773242A

公开(公告)日：1973-11-20

申请号：US3773242D

申请日：1972-02-24

Applicant: GALE SYSTEMS

Inventor： FITZSIMMONS R

IPC: B23K3/06 ,  B23K1/08

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: The wave soldering apparatus of present disclosure includes a sump for receipt of a predetermined level of molten solder and having a driveshaft-receiving opening in the bottom wall thereof. A fountain is disposed in such sump and is formed with a chamber that leads upwardly above the predetermined level and terminates in a horizontally disposed outlet orifice. Molten solder is pumped into the lower portion of such fountain by pump means which includes an impeller having a driveshaft projecting therefrom and through the driveshaft-receiving opening. Barrier means surrounds such driveshaft means to block molten solder from coming into contact therewith and leaking out through the driveshaft-receiving opening.

Abstract translation: 本公开的波峰焊装置包括用于接收预定水平的熔融焊料并且在其底壁中具有驱动轴接收开口的贮槽。 喷泉设置在这样的贮槽中，并且形成有通向上方高于预定水平并且终止于水平布置的出口孔的室。 熔化的焊料通过泵装置泵送到这种喷泉的下部，该装置包括具有从其突出的驱动轴并通过驱动轴接收开口的叶轮。 阻挡装置围绕这种驱动轴装置以阻止熔融焊料与其接触并通过驱动轴接收开口泄漏。

公开(公告)号：US3752383A

公开(公告)日：1973-08-14

申请号：US3752383D

申请日：1971-11-11

Applicant: TECHNICAL DEVICES CO

Inventor： ALLEN M ,  ESCHENBRUCHER H

IPC: B23K3/06 ,  B23K1/08

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: Homogenization of petroleum oil in molten solder is produced in stages in an agitation chamber formed about the outlet of a solder pump of a standing wave soldering machine. In the first stage, a high pressure stream of oil is directed at the pressure faces of the pump propeller blades to produce intermittent counteracting forces creating turbulence which reduces the oil to small particles and distributing them in the oppositely moving stream of molten solder. In the second stage, droplets or globules of oil remaining in the stream of oil and molten solder separate rising to the top of the agitation chamber to be drawn through an impeller agitator which completes the reduction of the oil globules to finely divided particles which are distributed uniformly throughout the surrounding molten solder by shearing action of the agitator. The homogenized mixture of oil and molten solder flows into a pressure tank of the soldering machine to produce a standing wave of solder at a duct orifice.

Abstract translation: 熔融焊料中的石油的均质化是在形成在驻波焊接机的焊料泵的出口周围的搅拌室内分阶段制成的。 在第一阶段，高压油流被引导到泵螺旋桨叶片的压力面，以产生间歇性的反作用力，产生湍流，将油减少到小颗粒并将它们分布在相反移动的熔融焊料流中。 在第二阶段中，保留在油和熔融焊料流中的油滴和小球分开地上升到搅拌室的顶部，以通过叶轮搅拌器进行抽吸，该叶轮搅拌器完成将油球还原成分散的细颗粒， 通过搅拌器的剪切作用使整个周围的熔融焊料均匀地均匀。 油和熔融焊料的均质化混合物流入焊接机的压力罐，以在管道孔处产生焊料驻波。

公开(公告)号：US3726007A

公开(公告)日：1973-04-10

申请号：US3726007D

申请日：1971-02-02

Applicant: MARTIN MARIETTA CORP

Inventor： KELLER J

IPC: B23K3/06 ,  H05K3/30 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K2201/42 ,  H05K3/305 ,  H05K3/3421 ,  H05K3/3468 ,  H05K2201/10689 ,  H05K2203/1581 ,  Y10T29/49144

Abstract: A method of securing at least one multilead electronic component upon a supporting medium in an electrically correct manner, involving the leads of the component to a large extent disposed on the same side of the supporting medium or board as the component, with the component itself being passed through molten solder during the soldering of the component leads to the circuitry of the supporting medium. Because the necessity of through holes in the supporting medium is thus essentially eliminated, the practice of my method can result in the manufacture of circuit boards having an extremely high component density, with this method also making possible the use of wave solder techniques, and therefore the production of high density circuit boards and the like in a very rapid manner. A novel circuit board is also taught herein, involving at least one multilead component placed on a supporting medium with its lead terminations to a large extent located on the same side of the supporting medium as the component itself. Single sided as well as double sided boards of high density can be made in this manner.

Abstract translation: 一种以电气正确的方式将至少一个多列电子部件固定在支撑介质上的方法，包括部件的引线在很大程度上被设置在与部件一起在支撑介质或板的同一侧上，部件本身是 在组件的焊接期间通过熔融焊料通过支撑介质的电路。 因为基本上消除了支撑介质中的通孔的必要性，所以我的方法的实践可以导致制造具有非常高的组分密度的电路板，这种方法也可以使用波峰焊技术，因此 以非常快速的方式生产高密度电路板等。

公开(公告)号：US3657508A

公开(公告)日：1972-04-18

申请号：US3657508D

申请日：1970-11-18

Applicant: WESTERN ELECTRIC CO

Inventor： STUDNICK WILLIAM R

IPC: B23K1/005 ,  H05K3/34 ,  B23K1/04

CPC classification number: H05K3/3494 ,  B23K1/0053 ,  B23K2201/42 ,  H05K2203/304

Abstract: A radiant energy transmissive member, such as of quartz, is formed with a plurality of peculiarly contoured grooves therein to accommodate, align and facilitate the simultaneous reflow soldering of a plurality of wires or leads to aligned and preferably solder-coated elements, such as circuit path extremities on a printed circuit board. Each groove is contoured such that the solder confined therein, when heated to a molten state, will be drawn at least in part by capillary attraction over the top of the associated wire or lead, with the solder merging on either side with the adjacent element so as to form a reliable fillet-shaped reflow solder connection. Also, by masking one surface of the quartz member so as to be selectively opaque, the radiant energy can be directed more precisely in accordance with a resultant transparent pattern only specific areas to be heated.

Abstract translation: 诸如石英的辐射能传递元件在其中形成有多个特殊轮廓的凹槽，以容纳，对准和促进多个电线或引线同时回流焊接到对准且优选焊接涂覆的元件，例如电路 印刷电路板上的路径四肢。 每个凹槽的轮廓使得当加热到熔融状态时，限制在其中的焊料将至少部分地通过毛细管吸引在相关联的导线或引线的顶部上被拉伸，焊料在相邻元件的任一侧上合并，因此 以形成可靠的圆角回流焊接。 此外，通过掩盖石英构件的一个表面以便选择性地不透明，可以根据所得到的透明图案更精确地引导辐射能量，仅限制特定的被加热区域。