公开(公告)号：US07608900B2

公开(公告)日：2009-10-27

申请号：US11503945

申请日：2006-08-15

Applicant: Yoshihide Tasaki

Inventor： Yoshihide Tasaki

IPC: H01L29/84

CPC classification number: G01P15/123 ,  B81B2201/0235 ,  B81C99/004 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0842

Abstract: An accelerator sensor includes a semiconductor substrate having a main front surface and a main rear surface, a first groove portion being formed along a front surface pattern, in the main front surface, a second groove portion being formed along a rear surface pattern, in the main rear surface, a through-hole being formed because of connection between at least parts of the first groove portion and the second groove portion and at least one groove width variation portion being formed in at least one of inner walls of the first groove portion. An offset of the rear surface pattern to the front surface pattern can be inspected easily by existence of the groove width variation portion.

Abstract translation: 加速器传感器包括：主表面和主后表面的半导体基板，沿着前表面图案形成的第一凹槽部分，在主表面上形成有沿着后表面图案形成的第二凹槽部分， 主后表面，由于第一槽部分和第二槽部分的至少一部分之间的连接而形成有通孔，并且至少一个槽宽度变化部分形成在第一槽部分的至少一个内壁中。 可以通过存在槽宽度变化部分来容易地检查后表面图案与前表面图案的偏移。

公开(公告)号：US07568390B2

公开(公告)日：2009-08-04

申请号：US11043997

申请日：2005-01-28

Applicant: Yoshinori Shizuno

Inventor： Yoshinori Shizuno

IPC: G01P1/02 ,  G01P15/12

CPC classification number: G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.

Abstract translation: 虽然固定在芯片焊盘上的加速度传感器芯片的重量部分涂覆有低弹性的凝胶状树脂部分，但是重量部分容易被外部加速度移位。 因此，可以精确地检测加速度。 此外，由于不用于加速度感测的加速度传感器装置的那些部分用树脂部件密封，因此确保与常规树脂封装相当的长期可靠性。

公开(公告)号：US07562575B2

公开(公告)日：2009-07-21

申请号：US11481003

申请日：2006-07-06

Applicant: Hiroyuki Hatano ,  Yoshiaki Takada ,  Masakatsu Saitoh

Inventor： Hiroyuki Hatano ,  Yoshiaki Takada ,  Masakatsu Saitoh

IPC: G01P3/00

CPC classification number: G01P15/123 ,  G01P1/023 ,  G01P15/18 ,  G01P2015/0842

Abstract: An acceleration sensor, which has realized such a high impact-resistance that a weight bottom surface of an acceleration sensor element does not directly collide with an inner bottom plate of a protection case made of ceramic, glass or silicon to avoid edges and corners of the weight bottom surface of the acceleration sensor element chipping, even when an excessive acceleration or impact is applied to the acceleration sensor. The acceleration sensor comprises the acceleration sensor element having in a center a weight that works as a pendulum when acceleration is applied, and the protection case housing the acceleration sensor element. The inner bottom plate of the protection case works as a regulation plate to prevent the weight from excessively swing downwards. An impact buffer material of a metal layer or a resin layer is provided on the weight bottom surface or the inner bottom plate of the protection case.

Abstract translation: 实现了加速度传感器元件的重量底面不直接与由陶瓷，玻璃或硅制成的保护壳体的内底板直接碰撞的高抗冲击性的加速度传感器，以避免边缘和角部 即使当对加速度传感器施加过大的加速度或冲击时，加速度传感器元件的重量底部表面也会破裂。 加速度传感器包括加速度传感器元件，该加速度传感器元件具有在施加加速度时用作摆锤的重量的中心，并且保护壳体容纳加速度传感器元件。 保护壳的内底板作为调节板，以防止重量向下摆动。 金属层或树脂层的冲击缓冲材料设置在保护壳体的重量底面或内底板上。

公开(公告)号：US07540190B2

公开(公告)日：2009-06-02

申请号：US11531700

申请日：2006-09-14

Applicant: Makoto Sasaki

Inventor： Makoto Sasaki

IPC: G01P1/02 ,  G01P15/00

CPC classification number: G01P15/18 ,  B81B7/0048 ,  B81B2201/0235 ,  G01P1/023 ,  G01P15/123 ,  G01P2015/084 ,  G01P2015/0842

Abstract: A semiconductor device includes a package having a cavity in the interior thereof, a support member that extends out from a face of the cavity, and a semiconductor element fixed to the support member without contacting the faces that form the cavity.

Abstract translation: 半导体器件包括在其内部具有空腔的封装，从腔的表面延伸的支撑构件以及固定到支撑构件而不接触形成空腔的面的半导体元件。

公开(公告)号：US20090128171A1

公开(公告)日：2009-05-21

申请号：US11887476

申请日：2006-03-30

Applicant: Katsuya Okumura ,  Masami Yakabe ,  Naoki Ikeuchi

Inventor： Katsuya Okumura ,  Masami Yakabe ,  Naoki Ikeuchi

IPC: G01R31/02

CPC classification number: G01C19/56 ,  B81C99/005 ,  G01P15/123 ,  G01P15/18 ,  G01P21/00 ,  G01P2015/084 ,  G01P2015/0842

Abstract: An inspecting method which is for a microstructure with a movable portion and executes a highly precise inspection without damaging a probe or an inspection electrode by supressing the effect of a needle pressure in contacting the probe to the inspection electrode is provided.When inspection on a microstructure is performed, first a pair of probes (2) are caused to contact respective electrode pads (PD), and the pair of probes (2) and a fritting power source (50) are connected together through relays (30). Next a voltage is applied from the fritting power source (50) to one probe (2) in the pair of probes (2). As the voltage is gradually increased, an oxide film between the pair of probes (2) is destroyed and a current flows between the pair of probes (2) by fritting phenomenon, and the probes (2) and the electrode pad (PD) are electrically conducted each other. Subsequently, the pair of probes (2) are switched to a measuring unit (40) side from the fritting power source (50) through the relays (30), and electrically connected to the measuring unit (40).

Abstract translation: 提供了一种用于具有可移动部分的微结构的检查方法，并且通过抑制将探针接触检查电极​​的针头压力的影响来执行高精度检查而不损坏探针或检查电极。 当对微结构进行检查时，首先使一对探针（2）与相应的电极焊盘（PD）接触，并且一对探针（2）和熔接电源（50）通过继电器（30）连接在一起 ）。 接下来，从熔接电源（50）向一对探针（2）中的一个探针（2）施加电压。 随着电压逐渐增加，一对探针（2）之间的氧化膜被破坏，并且通过烧结现象在一对探针（2）之间流动电流，并且探针（2）和电极焊盘（PD）是 相互导电。 随后，一对探针（2）通过继电器（30）从熔接电源（50）切换到测量单元（40）侧，并且电连接到测量单元（40）。

公开(公告)号：US07444870B2

公开(公告)日：2008-11-04

申请号：US11655576

申请日：2007-01-19

Applicant: Takeshi Uchiyama ,  Mitsuo Yarita ,  Akira Egawa

Inventor： Takeshi Uchiyama ,  Mitsuo Yarita ,  Akira Egawa

IPC: G01P9/04

CPC classification number: G01P15/125 ,  G01C19/56 ,  G01P15/18 ,  G01P2015/0842

Abstract: An angular velocity sensor amplifies a plurality of detection signals using one amplifying circuit and separates these detection signals after amplification. The angular velocity sensor detects displacements of a mass in the axial directions using x-, y- and z-axis detection circuits. A carrier wave whose phase is shifted 90° from that of a carrier wave of the z-axis detection circuit is applied to the x- and y-axis detection circuits and outputs of the axis detection circuits are collectively inputted to a current/voltage conversion circuit which outputs a combined signal to three synchronous detection circuits that separate the signal into x-, y- and z-axis detection signal components. In the synchronous detection circuits, by applying phase division processing to the combined signal, the z-axis detection signal component is separated from cross axis detection signal components and by applying time division processing to the signal components based on switching timing of the carrier wave, the x- and y-axis detection signal components are separated from each other.

Abstract translation: 角速度传感器使用一个放大电路放大多个检测信号，并在放大后分离这些检测信号。 角速度传感器使用x轴，y轴和z轴检测电路检测轴向质量的位移。 将与z轴检测电路的载波相位偏移90°的载波施加到x轴检测电路和y轴检测电路，并将轴检测电路的输出集中输入到电流/电压转换 将组合信号输出到将信号分离成x轴，y轴和z轴检测信号分量的三个同步检测电路的电路。 在同步检测电路中，通过对组合信号进行相位分割处理，将z轴检测信号分量与交叉轴检测信号分量分离，并且通过基于载波的切换定时对信号分量进行时分处理， x轴和y轴检测信号分量彼此分离。

公开(公告)号：US20070261490A1

公开(公告)日：2007-11-15

申请号：US11706281

申请日：2007-02-15

Applicant: Takayuki Kai

Inventor： Takayuki Kai

IPC: G01P15/09 ,  H01L21/00

CPC classification number: G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842

Abstract: An acceleration sensor includes a weight; a base portion, a beam; and a piezo resistance element. The weight is arranged to displace upon receiving acceleration. The base portion is disposed around the weight apart from the weight. The beam has one end portion connected to the weight and the other end portion connected to the base portion. The beam also has a thick layer portion and a thin layer portion having a thickness smaller than that of the thick layer portion. The piezo resistance element is disposed over the thick layer portion and the thin layer portion.

Abstract translation: 加速度传感器包括一个重量; 基部，梁; 和压电电阻元件。 重量被设置为在接收加速度时移位。 底座部分配置在重量之外。 梁具有连接到重物的一个端部和连接到基部的另一端部。 光束还具有厚层部分和薄层部分，其厚度小于厚层部分的厚度。 压电电阻元件设置在厚层部分和薄层部分之上。

公开(公告)号：US20070240509A1

公开(公告)日：2007-10-18

申请号：US11703017

申请日：2007-02-06

Applicant: Takeshi Uchiyama ,  Mitsuo Yarita ,  Akira Egawa

Inventor： Takeshi Uchiyama ,  Mitsuo Yarita ,  Akira Egawa

IPC: G01P15/125

CPC classification number: G01P15/18 ,  G01C19/56 ,  G01P1/023 ,  G01P15/125 ,  G01P2015/0842

Abstract: It is an object of the invention to promote a detection sensitivity by effectively utilizing an arranged fixed electrode. Inclinations in x-axis and y-axis directions of a mass are detected in a two-axis detecting circuit. The two-axis detecting circuit is constituted by fixed electrodes having both of an x-axis detecting circuit function and a y-axis detecting circuit function and also having functions for detecting displacements in an x-axis direction and a y-axis direction. The two-axis detecting circuit switches the x-axis detecting circuit function and the y-axis detecting circuit function by switching wirings in the circuit by way of a switching circuit. Switching of a wiring state of the two-axis detecting circuit is carried out at each constant period based on a timing of a specific clock signal. In this way, the fixed electrodes can be used in both of the two circuit functions, and therefore, components in respective axes directions of an angular velocity can be detected based on a total sum of electrode sensitivities of the fixed electrodes. Thereby, a detection sensitivity can be promoted without increasing a sensor size, or increasing electrodes for detection.

Abstract translation: 本发明的目的是通过有效利用布置的固定电极来提高检测灵敏度。 在双轴检测电路中检测质量的x轴方向和y轴方向的倾斜度。 双轴检测电路由具有x轴检测电路功能和y轴检测电路功能的固定电极构成，并且还具有用于检测x轴方向和y轴方向的位移的功能。 双轴检测电路通过切换电路切换电路中的布线来切换x轴检测电路功能和y轴检测电路功能。 基于特定时钟信号的定时，以每个恒定周期进行双轴检测电路的布线状态的切换。 以这种方式，固定电极可以用于两个电路功能中，因此可以基于固定电极的电极灵敏度的总和来检测角速度的各轴方向上的分量。 因此，可以在不增加传感器尺寸或增加用于检测的电极的情况下促进检测灵敏度。

公开(公告)号：US07243546B2

公开(公告)日：2007-07-17

申请号：US11362176

申请日：2006-02-27

Applicant: Akihiro Sakamoto

Inventor： Akihiro Sakamoto

IPC: G01P15/09 ,  G01P15/00

CPC classification number: G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0842

Abstract: An acceleration sensor chip has a frame portion having a frame body portion and protruding portions. The acceleration sensor chip also includes a mobile structure having a central weight portion supported movably by four beam portions. The mobile structure also has four rectangular parallelepiped-form protruding weight portions The acceleration sensor chip also includes a plurality of stoppers extending above the protruding weight portions.

Abstract translation: 加速度传感器芯片具有框架部分，该框架部分具有框架主体部分和突出部分。 加速度传感器芯片还包括具有由四个梁部分可移动地支撑的中心重量部分的移动结构。 移动结构还具有四个长方体形的突出重量部分。加速度传感器芯片还包括在突出重量部分上方延伸的多个止动件。

公开(公告)号：US07237316B2

公开(公告)日：2007-07-03

申请号：US11182844

申请日：2005-07-18

Applicant: Akihiro Sakamoto

Inventor： Akihiro Sakamoto

IPC: G01R3/00

CPC classification number: H01S4/00 ,  B81B7/0012 ,  B81B2201/0235 ,  B81C1/00595 ,  B81C2201/0133 ,  G01P15/00 ,  G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0842 ,  Y10T29/49002 ,  Y10T29/49007

Abstract: According to the present invention, a method for fabricating a three-dimensional acceleration sensor, comprising: providing a semiconductor substrate having first and second surfaces; forming an insulating layer on the first surface of the semiconductor substrate; forming an active layer on the insulating layer; forming a plurality of openings on the active layer at a first region, which is to be located above a movable mass with a predetermined space; selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of openings; and selectively removing the active layer to form a groove separating the first region from a movable mass.