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公开(公告)号:US20210341842A1
公开(公告)日:2021-11-04
申请号:US17374753
申请日:2021-07-13
发明人: Min-Cheng WU , Chi-Hung LIAO
摘要: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.
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公开(公告)号:US11156923B2
公开(公告)日:2021-10-26
申请号:US15557802
申请日:2015-12-10
发明人: Hakki Ergün Cekli , Xing Lan Liu , Stefan Cornelis Theodorus Van Der Sanden , Richard Johannes Franciscus Van Haren
摘要: A method includes exposing number of fields on a substrate, obtaining data about a field and correcting exposure of the field in subsequent exposures. The method includes defining one or more sub-fields of the field based on the obtained data. Data relating to each sub-field is processed to produce sub-field correction information. A subsequent exposure of the one or more sub-fields is corrected using the sub-field correction information. By controlling a lithographic apparatus by reference to data of a particular sub-field within a field, overlay error can be reduced or minimized for a critical feature, rather than being averaged over the whole field. By controlling a lithographic apparatus with reference to a sub-field rather than only the whole field, a residual error can be reduced in each sub-field.
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公开(公告)号:US11137680B2
公开(公告)日:2021-10-05
申请号:US16141304
申请日:2018-09-25
发明人: Shintaro Narioka
IPC分类号: G03F7/00 , B29C43/56 , B29C59/02 , G03F9/00 , H01L21/027 , H01L21/311 , H01L21/3105
摘要: A shaping apparatus that shapes a composition on a substrate by using a mold, includes a substrate positioning mechanism for positioning the substrate, a mold positioning mechanism for positioning the mold, a dispenser for arranging the composition on a shot region of the substrate, and a gas supply for supplying a gas onto the substrate from a gas supply port in a state in which the substrate is driven by the substrate positioning mechanism. A flow rate of the gas supplied onto the substrate by the gas supply starts to decrease in a period during which the substrate is driven by the substrate positioning mechanism so that the shot region where the composition is arranged by the dispenser is moved under the mold.
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公开(公告)号:US20210294209A1
公开(公告)日:2021-09-23
申请号:US17011020
申请日:2020-09-03
申请人: Kioxia Corporation
发明人: Jun WATANABE , Anupam MITRA , Kazuya FUKUHARA
摘要: A template includes: a base material having a surface including a first pattern, a second pattern and a third pattern, the first pattern including a first recess, the second pattern including a second recess. The base material containing a first material having a first refractive index; a first layer disposed in the first recess and containing a second material, the second material having a second refractive index different from the first refractive index; and a second layer disposed in the second recess, containing the second material, and being thicker than the first layer.
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135.
公开(公告)号:US11127565B2
公开(公告)日:2021-09-21
申请号:US16486061
申请日:2018-02-12
申请人: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE , SORBONNE UNIVERSITE , UNIVERSITE PARIS DIDEROT—PARIS
IPC分类号: H01J37/317 , G01N21/64 , G03F7/20 , G03F9/00
摘要: Disclosed is a lithography process on a sample including at least one structure and covered by at least a lower layer of resist and a upper layer of resist the process including: using an optical device to image or determine, in reference to the optical device, a position of the selected structure and positions of markers integral with the sample; using an electron-beam device, imaging or determining the position of each marker in reference to the electron-beam device; deducing the position of the selected structure in reference to the electron-beam device; exposing to an electron beam the upper layer of resist above the position of the selected structure to remove all the thickness of the upper layer of resist above the position of the selected structure but none or only part of the thickness of the lower layer of resist above the position of the selected structure.
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公开(公告)号:US11126093B2
公开(公告)日:2021-09-21
申请号:US16099452
申请日:2017-05-17
发明人: Richard Johannes Franciscus Van Haren , Reiner Maria Jungblut , Leon Paul Van Dijk , Willem Seine Christian Roelofs , Wim Tjibbo Tel , Stefan Hunsche , Maurits Van Der Schaar
摘要: A method is proposed involving obtaining data regarding an expected focus offset during a patterning process due to topography of a region of a substrate surface. A modification of, e.g., a transmission or reflection of a region of a patterning device associated with the region of the substrate surface is determined based on the data. Using the patterning device modified according the determined modification during the patterning process mitigates an impact of the substrate topography on a parameter of the patterning process.
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公开(公告)号:US20210286275A1
公开(公告)日:2021-09-16
申请号:US17194877
申请日:2021-03-08
发明人: Kazuki Ota , Hironori Maeda
摘要: A detection apparatus detects an orientation reference of an object to be detected which includes an edge including the orientation reference. The apparatus includes a first detection system configured to detect the edge such that the orientation reference is detected, and a second detection system configured to detect, by projecting a pattern to a surface of the object and detecting an image formed by reflected light from the surface, a position of the surface in a direction perpendicular to the surface. After a focusing operation of the first detection system is performed based on the position of the surface detected by the second detection system, the first detection system detects the orientation reference.
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138.
公开(公告)号:US11119419B2
公开(公告)日:2021-09-14
申请号:US16349089
申请日:2019-04-10
发明人: Mark Ghinovker
摘要: A target for use in the optical measurement of misregistration in the manufacture of semiconductor devices, the target including a first periodic structure formed on a first layer of a semiconductor device and having a first pitch along an axis and a second periodic structure formed on a second layer of the semiconductor device and having a second pitch along the axis, different from the first pitch, the second periodic structure extending beyond the first periodic structure along the axis.
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公开(公告)号:US11112598B2
公开(公告)日:2021-09-07
申请号:US16090545
申请日:2017-03-28
申请人: NIKON CORPORATION
发明人: Yoshiaki Kito , Masakazu Hori , Yosuke Hayashida , Masaki Kato
摘要: An exposure device that draws a pattern on a substrate by shining a beam from a light source device on substrate and scanning the beam in a main scanning direction while varying the intensity of beam according to pattern information, including: a scanning unit having a beam scanning unit that includes a polygonal mirror whereby the beam is oriented to scan the beam, and light detector for photoelectric detection of reflected light generated when beam is shined on substrate; an electro-optical element for controlling the beam's intensity modulation according to pattern information such that at least part of second pattern to be newly drawn is drawn on top of at least part of first pattern formed on substrate; and a measurement unit measuring relative positional relationship between the first and second pattern on the basis of a detection signal output by the detector while second pattern is drawn on substrate.
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公开(公告)号:US11106146B2
公开(公告)日:2021-08-31
申请号:US16901506
申请日:2020-06-15
发明人: Hao-Yu Lan , Po-Chung Cheng , Ching-Juinn Huang , Tzung-Chi Fu , Tsung-Yen Lee
IPC分类号: G03F9/00
摘要: A system is disclosed. The system includes a cleaning device and a scanner device. The cleaning device is configured to clean a mask. The scanner device is coupled to the cleaning device and is configured to receive the mask, a reference image and a real-time image that is captured at the mask. The reference image includes at least one first mark image having a plurality of mapping marks on the mask. The real-time image includes at least one second mark image having the plurality of mapping marks on the mask. The scanner device is configured to map the at least one second mark image in the real-time image with the at least one first image in the reference image, when a lithography exposing process is performed. A method is also disclosed herein.
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