SUBSTRATE MEASURING DEVICE AND A METHOD OF USING THE SAME

    公开(公告)号:US20210341842A1

    公开(公告)日:2021-11-04

    申请号:US17374753

    申请日:2021-07-13

    IPC分类号: G03F7/20 G03F1/42 G03F9/00

    摘要: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.

    Lithographic method and lithographic apparatus

    公开(公告)号:US11156923B2

    公开(公告)日:2021-10-26

    申请号:US15557802

    申请日:2015-12-10

    IPC分类号: G03F7/20 G03F9/00

    摘要: A method includes exposing number of fields on a substrate, obtaining data about a field and correcting exposure of the field in subsequent exposures. The method includes defining one or more sub-fields of the field based on the obtained data. Data relating to each sub-field is processed to produce sub-field correction information. A subsequent exposure of the one or more sub-fields is corrected using the sub-field correction information. By controlling a lithographic apparatus by reference to data of a particular sub-field within a field, overlay error can be reduced or minimized for a critical feature, rather than being averaged over the whole field. By controlling a lithographic apparatus with reference to a sub-field rather than only the whole field, a residual error can be reduced in each sub-field.

    Shaping apparatus and article manufacturing method

    公开(公告)号:US11137680B2

    公开(公告)日:2021-10-05

    申请号:US16141304

    申请日:2018-09-25

    发明人: Shintaro Narioka

    摘要: A shaping apparatus that shapes a composition on a substrate by using a mold, includes a substrate positioning mechanism for positioning the substrate, a mold positioning mechanism for positioning the mold, a dispenser for arranging the composition on a shot region of the substrate, and a gas supply for supplying a gas onto the substrate from a gas supply port in a state in which the substrate is driven by the substrate positioning mechanism. A flow rate of the gas supplied onto the substrate by the gas supply starts to decrease in a period during which the substrate is driven by the substrate positioning mechanism so that the shot region where the composition is arranged by the dispenser is moved under the mold.

    DETECTION APPARATUS, EXPOSURE APPARATUS, AND ARTICLE MANUFACTURING METHOD

    公开(公告)号:US20210286275A1

    公开(公告)日:2021-09-16

    申请号:US17194877

    申请日:2021-03-08

    IPC分类号: G03F9/00 G03F7/20

    摘要: A detection apparatus detects an orientation reference of an object to be detected which includes an edge including the orientation reference. The apparatus includes a first detection system configured to detect the edge such that the orientation reference is detected, and a second detection system configured to detect, by projecting a pattern to a surface of the object and detecting an image formed by reflected light from the surface, a position of the surface in a direction perpendicular to the surface. After a focusing operation of the first detection system is performed based on the position of the surface detected by the second detection system, the first detection system detects the orientation reference.

    Moiré target and method for using the same in measuring misregistration of semiconductor devices

    公开(公告)号:US11119419B2

    公开(公告)日:2021-09-14

    申请号:US16349089

    申请日:2019-04-10

    发明人: Mark Ghinovker

    IPC分类号: H01L21/66 G03F7/20 G03F9/00

    摘要: A target for use in the optical measurement of misregistration in the manufacture of semiconductor devices, the target including a first periodic structure formed on a first layer of a semiconductor device and having a first pitch along an axis and a second periodic structure formed on a second layer of the semiconductor device and having a second pitch along the axis, different from the first pitch, the second periodic structure extending beyond the first periodic structure along the axis.

    Pattern drawing device, pattern drawing method, and method for manufacturing device

    公开(公告)号:US11112598B2

    公开(公告)日:2021-09-07

    申请号:US16090545

    申请日:2017-03-28

    申请人: NIKON CORPORATION

    摘要: An exposure device that draws a pattern on a substrate by shining a beam from a light source device on substrate and scanning the beam in a main scanning direction while varying the intensity of beam according to pattern information, including: a scanning unit having a beam scanning unit that includes a polygonal mirror whereby the beam is oriented to scan the beam, and light detector for photoelectric detection of reflected light generated when beam is shined on substrate; an electro-optical element for controlling the beam's intensity modulation according to pattern information such that at least part of second pattern to be newly drawn is drawn on top of at least part of first pattern formed on substrate; and a measurement unit measuring relative positional relationship between the first and second pattern on the basis of a detection signal output by the detector while second pattern is drawn on substrate.

    Lithography system and method
    140.
    发明授权

    公开(公告)号:US11106146B2

    公开(公告)日:2021-08-31

    申请号:US16901506

    申请日:2020-06-15

    IPC分类号: G03F9/00

    摘要: A system is disclosed. The system includes a cleaning device and a scanner device. The cleaning device is configured to clean a mask. The scanner device is coupled to the cleaning device and is configured to receive the mask, a reference image and a real-time image that is captured at the mask. The reference image includes at least one first mark image having a plurality of mapping marks on the mask. The real-time image includes at least one second mark image having the plurality of mapping marks on the mask. The scanner device is configured to map the at least one second mark image in the real-time image with the at least one first image in the reference image, when a lithography exposing process is performed. A method is also disclosed herein.