公开(公告)号：US20220353619A1

公开(公告)日：2022-11-03

申请号：US17244885

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H04R19/02 ,  B81B7/00 ,  B81C1/00 ,  H04R1/02 ,  H04R7/04 ,  H04R31/00

Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

公开(公告)号：US11488901B2

公开(公告)日：2022-11-01

申请号：US16862453

申请日：2020-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen Hung Huang

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00 ,  H01L21/48

Abstract: A package structure and a method for manufacturing a package structure are provided. The package structure includes a substrate, at least one redistribution structure, at least one electronic component and at least one semiconductor die. The substrate has a first surface and a second surface opposite to the first surface. The at least one redistribution structure is disposed on the first surface of the substrate. The at least one electronic component is disposed on the first surface of the substrate. The at least one semiconductor die is disposed on the at least one redistribution structure and electrically connected to the at least one electronic component through the substrate.

公开(公告)号：US20220345812A1

公开(公告)日：2022-10-27

申请号：US17242093

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/24 ,  H04R1/26 ,  G02C11/00

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US20220345811A1

公开(公告)日：2022-10-27

申请号：US17242060

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/26 ,  H04R1/24

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.

公开(公告)号：US20220344246A1

公开(公告)日：2022-10-27

申请号：US17239482

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH ,  Jen-Chieh KAO

IPC: H01L23/498 ,  H01L25/10 ,  H01L23/31 ,  H01L25/00

Abstract: The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.

公开(公告)号：US11482460B2

公开(公告)日：2022-10-25

申请号：US16703385

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Yun Hsu ,  Ying-Chung Chen

IPC: H01L23/04 ,  H01L31/0203 ,  H01L31/02 ,  H01L23/00 ,  H01L23/10

Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.

公开(公告)号：US20220336406A1

公开(公告)日：2022-10-20

申请号：US17233245

申请日：2021-04-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Dao WANG ,  Tung Yao LIN ,  Rong He GUO

IPC: H01L23/00

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

公开(公告)号：US20220336332A1

公开(公告)日：2022-10-20

申请号：US17233294

申请日：2021-04-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/053 ,  H01L21/48 ,  H01L21/56

Abstract: A conductive structure, a package structure and a method for manufacturing the same are provided. The conductive structure includes a main portion, a first electrical contact, a second electrical contact, a first post and a second post. The main portion has a first surface and a second surface opposite to the first surface. The first electrical contact is disposed adjacent to the first surface of the main portion. The second electrical contact is disposed adjacent to the second surface of the main portion and electrically connected to the first electrical contact. The first post is electrically connected to the first electrical contact. The second post is electrically connected to the second electrical contact.

公开(公告)号：US20220328446A1

公开(公告)日：2022-10-13

申请号：US17225828

申请日：2021-04-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Cheng HUNG ,  Wei-Han LAI

IPC: H01L23/00

Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

公开(公告)号：US20220313163A1

公开(公告)日：2022-10-06

申请号：US17219562

申请日：2021-03-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Jung CHANG ,  Ming-Tau HUANG

IPC: A61B5/00 ,  H04R1/10 ,  A61B5/25

Abstract: The present disclosure provides a wearable device. The wearable device includes a first element and a second element. The first element is configured to sense a bio-signal from a user. The second element is configured to transmit the bio-signal to a processor. The second element has a first surface and a second surface non-coplanar with the first surface. The first element is in contact with the first surface and the second surface of the second element.