公开(公告)号：US20210229439A1

公开(公告)日：2021-07-29

申请号：US16955600

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael G. Groh ,  Zhizhang Chen

IPC: B41J2/14

Abstract: Fluid feed paths having enhanced wettability characteristics are disclosed. An example printhead includes a nozzle to expel fluid therefrom, and a fluid feed path to fluidly couple a fluid source and the nozzle. Fluid feed path walls are composed of a first material having a first wettability characteristic and a second material having a second wettability characteristic. The second wettability characteristic differing from the first wettability characteristic. A coating is formed on at least a portion of the fluid feed path defined by the first material and the second material of the substrate. The coating to harmonize the first wettability characteristic and the second wettability characteristic.

公开(公告)号：US11007712B2

公开(公告)日：2021-05-18

申请号：US16073115

申请日：2016-04-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Qin Liu ,  Chien-Hua Chen ,  Michael G. Monroe ,  Bruce Cowger

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y70/00 ,  B29K105/00 ,  B29C64/112 ,  B29K63/00

Abstract: In a three-dimensional printing method example, a build material, including an epoxy resin powder, is applied. A hardener liquid is selectively applied on at least a portion of the build material. The portion of the build material in contact with the hardener liquid is allowed to cure to form a layer of a 3D part. In another three-dimensional printing method example, a filler build material is applied. A liquid epoxy resin is selectively applied on at least a portion of the filler. A hardener liquid is selectively applied on the at least the portion of the filler. The portion of the filler in contact with the liquid epoxy resin and the hardener liquid is allowed to cure to form a layer of a 3D part.

公开(公告)号：US20210129549A1

公开(公告)日：2021-05-06

申请号：US16605071

申请日：2017-10-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen ,  Tony Studer

IPC: B41J2/175 ,  G01F23/24 ,  G01F23/26

Abstract: In one example, a fluid property sensor includes a proximal elongated circuit (EC), a distal EC, and an external interface. The proximal EC has multiple point sensors distributed along its length. The distal EC is extended in the direction of the length from a distal end of the proximal EC and is electrically coupled from the distal end of the proximal EC to a proximal end of the distal EC. The proximal and distal ECs share a common interface bus. The external interface is electrically coupled to a proximal end of the proximal EC. The proximal EC, the distal EC, and the external interface are packaged together to form the fluid property sensor.

公开(公告)号：US10994539B2

公开(公告)日：2021-05-04

申请号：US16920313

申请日：2020-07-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/16

Abstract: A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.

公开(公告)号：US10933640B2

公开(公告)日：2021-03-02

申请号：US16231057

申请日：2018-12-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/15 ,  B41J2/175 ,  B41J2/155

Abstract: A fluid dispenser may include fluid dispensing dies in an end-to-end staggered arrangement, a non-fluid dispensing die electronic device and a molding covering the fluid dispensing dies and the electronic device.

公开(公告)号：US20200282738A1

公开(公告)日：2020-09-10

申请号：US16493045

申请日：2017-11-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Jeffrey R. Pollard ,  Michael W. Cumbie ,  Si-La in Choy

IPC: B41J2/18

Abstract: A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.

公开(公告)号：US10751997B2

公开(公告)日：2020-08-25

申请号：US16025218

申请日：2018-07-02

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael G. Groh ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/16

Abstract: In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.

公开(公告)号：US10685898B2

公开(公告)日：2020-06-16

申请号：US16299538

申请日：2019-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/00

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US20200180314A1

公开(公告)日：2020-06-11

申请号：US16704122

申请日：2019-12-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie

IPC: B41J2/16

Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

公开(公告)号：US20200061992A1

公开(公告)日：2020-02-27

申请号：US16495456

申请日：2017-05-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Si-lam J Choy

IPC: B41J2/14 ,  B41J2/18

Abstract: A fluid ejection device includes a fluid ejection die to eject drops of fluid and a body to support the fluid ejection die, with the fluid ejection die including a fluid ejection chamber, a drop ejecting element within the fluid ejection chamber, and a fluid feed hole communicated with the fluid ejection chamber, and with the body including a fluid feed slot communicated with the fluid feed hole of the fluid ejection die. The fluid ejection device includes a micro-recirculation system to recirculate fluid within the fluid ejection die through the fluid ejection chamber, and a macro-recirculation system to recirculate fluid within the body through the fluid feed slot across the fluid feed hole of the fluid ejection die.