公开(公告)号：US20200158645A1

公开(公告)日：2020-05-21

申请号：US16074368

申请日：2016-04-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Zhizhang Chen ,  Chien-Hua Chen ,  James E Abbott

IPC: G01N21/65 ,  G01N21/05

Abstract: A method for forming a surface enhanced Raman spectroscopy (SERS) sensing apparatus may include providing a body having an internal microfluidic passage, the microfluidic passage having an interior surrounded by an interior surface, depositing a conformal inorganic passivation film onto the interior surface so as to continuously surround the interior by atomic layer deposition and positioning a SERS sensor in connection with the microfluidic passage after the depositing of the conformal inorganic film.

公开(公告)号：US10532571B2

公开(公告)日：2020-01-14

申请号：US15544999

申请日：2015-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhizhang Chen ,  James Elmer Abbott, Jr. ,  Michael W Cumbie ,  Roberto A Pugliese

IPC: B41J2/14 ,  B41J2/16

Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.

公开(公告)号：US20190152226A1

公开(公告)日：2019-05-23

申请号：US16094953

申请日：2016-07-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhizhang Chen ,  Mohammed S Shaarawi

IPC: B41J2/14 ,  B41J2/16

Abstract: According to an example, a printhead including a thin film passivation layer, an adhesion layer, and a fluidics layer; wherein the thin film passivation layer is an atomic layer deposition thin film layer is disclosed

公开(公告)号：US20180154576A1

公开(公告)日：2018-06-07

申请号：US15558633

申请日：2015-08-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Qin Liu ,  Hua Tan ,  Zhizhang Chen

IPC: B29C64/277 ,  B29C64/112 ,  B29C64/209 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B41J2/14 ,  B41J11/00

CPC classification number: B29C64/277 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C64/209 ,  B29C64/393 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29C2035/0833 ,  B29K2105/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B41J2/14016 ,  B41J2/14201 ,  B41J2/155 ,  B41J2/44 ,  B41J11/002

Abstract: Examples include a printhead comprising a plurality of nozzles for ejecting printing material drops. Examples include at least one emission device positioned proximate the printhead, where the at least one emission device is to emit energy to thereby expose ejected printing material drops to emitted energy to change at least one material property of ejected printing material drops in-flight.

公开(公告)号：US20180001636A1

公开(公告)日：2018-01-04

申请号：US15544999

申请日：2015-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhizhang Chen ,  James Elmer Abbott, JR. ,  Michael W. Cumbie ,  Roberto A. Pugliese

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14129 ,  B41J2/14024 ,  B41J2/1603 ,  B41J2/1642 ,  B41J2/1646

Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.

公开(公告)号：US11230098B2

公开(公告)日：2022-01-25

申请号：US16603581

申请日：2018-05-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhizhang Chen ,  Lawrence H. White

IPC: B41J2/14 ,  B41J2/16 ,  C23C16/455 ,  C23C16/40

Abstract: A passivation stack can include a laminated film, including from 8 to 40 alternating layers of HfO2 and SiO2. The layers can individually have a thickness from 8 Angstroms to 40 Angstroms, and the laminated film can have a total thickness of 280 Angstroms to 600 Angstroms. The passivation stack can also include a barrier film of HfO2 having a thickness from 50 Angstroms to 300 Angstroms applied to the laminated film.

公开(公告)号：US20210331471A1

公开(公告)日：2021-10-28

申请号：US16603581

申请日：2018-05-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhizhang Chen ,  Lawrence H. White

IPC: B41J2/14 ,  B41J2/16 ,  C23C16/40 ,  C23C16/455

Abstract: A passivation stack can include a laminated film, including from 8 to 40 alternating layers of HfO2 and SiO2. The layers can individually have a thickness from 8 Angstroms to 40 Angstroms, and the laminated film can have a total thickness of 280 Angstroms to 600 Angstroms. The passivation stack can also include a barrier film of HfO2 having a thickness from 50 Angstroms to 300 Angstroms applied to the laminated film.

公开(公告)号：US10479094B2

公开(公告)日：2019-11-19

申请号：US15765255

申请日：2016-01-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Zhizhang Chen ,  Mohammed Shaarawi ,  Brian Bolf ,  Paul Krause

IPC: B41J2/16 ,  B41J2/175 ,  B41J2/14 ,  B41J2/335

Abstract: Energy efficient printheads are disclosed. An example printhead includes a substrate with channels to direct ink toward a plurality of nozzles of the printhead. The example printhead further includes a passivation layer on the substrate. The passivation layer includes a first thin film of a first dielectric material formed using atomic layer deposition.

公开(公告)号：US10449762B2

公开(公告)日：2019-10-22

申请号：US15748301

申请日：2015-10-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James R. Przybyla ,  Zhizhang Chen

IPC: B41J2/14 ,  B41J2/16

Abstract: According to an example, a fluid ejection device may include a substrate, a resistor positioned on the substrate, an overcoat layer positioned over the resistor, a fluidics layer having surfaces that form a firing chamber about the resistor, in which the overcoat layer is positioned between the resistor and the firing chamber, and a thin film membrane covering the surfaces of the fluidics layer that form the firing chamber and a portion of the overcoat layer that is in the firing chamber.

公开(公告)号：US20180372543A1

公开(公告)日：2018-12-27

申请号：US16062356

申请日：2016-04-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Zhizhang Chen ,  Chien-Hua Chen ,  James Elmer Abbott, JR.

IPC: G01J3/44 ,  G01N21/65 ,  B01L3/00

Abstract: In an example, a lab-on-chip Raman spectroscopy system is described. The lab-on-chip system includes a housing having a fluid channel formed thereon. The fluid channel is coupled to an inlet and to an outlet. A surface-enhanced Raman spectroscopy substrate is positioned inside the fluid channel. The surface-enhanced Raman spectroscopy substrate includes a plasmonic nanostructure and a sacrificial, conformal passivation coating deposited over at least the plasmonic nanostructure.