Abstract:
An electron emitting device having a lower electrode on a side near to a substrate and an upper electrode on a side remote from the substrate respectively, formed of a plurality of electron emitting elements remitting electrons from a side of the upper electrode side, wherein space is formed between the electron emitting elements, and the upper electrode extends across the plurality of electron emitting elements and the space by a bridging portion of the upper electrode.
Abstract:
The dielectric device includes a substrate, a lower electrode, a dielectric layer, and an upper electrode. The lower electrode is bonded onto the substrate. The dielectric layer is bonded onto the lower electrode. The dielectric layer is obtained through thermal treatment of a film layer formed by spraying of a powdery dielectric material and a fine-particulate metal. In the thus-formed film layer, the metal is dispersed in the matrix of the dielectric material. Thermal treatment of the film layer causes migration of the metal in the film layer. This metal migration causes a lower-electrode-adjacent portion and upper-surface-adjacent portion of the dielectric layer to have different metal contents.
Abstract:
Disclosed herein is an image display device including: plural pixels arranged two-dimensionally; and a thin film electron emitter that has a lower electrode formed of one of data lines, an electron acceleration layer formed by an anodic oxidation of a surface of the lower electrode, and an upper electrode stacked on the electron acceleration layer to emit electrons thereby provided in each of the plural pixels, in which a ratio of hydrate-alumina to the total of the hydrate-alumina and anhydrous-alumina contained in the electron acceleration layer (the anodic oxide film) arranged in each of the pixels in regulated in a range from 0.25 to 0.42.
Abstract:
In order too control the non-uniformity of electron emission amount within the surface or between adjacent pixels which is a cause for formation non-uniformity when forming, using anodization, an electron acceleration layer for an MIM type diode element which is appropriate for a thin film electron source, there is provided an insulation layer 12 which forms a MIM type diode element as a non-crystalline oxidized film which is formed by anodization of the surface of a lower electrode 11 with the formation of the lower electrode 11 as laminated layers which have a single layer film of aluminum or aluminum alloy or an outer layer of any of these, with a non-phosphor as a single layer film of aluminum or aluminum alloy which is anodized.
Abstract:
Provided are a surface electron emission device and a display device having the same. The surface electron emission device may include a lower electrode, an insulating layer, and an upper electrode sequentially stacked, and a nano structure layer formed on the upper electrode.
Abstract:
A light source has a rear glass substrate and a front glass substrate having a plate surface disposed in facing relation to a principal surface of the rear glass substrate. The plate surface of the front glass substrate is coated with a phosphor. A two-dimensional array of electron emitters is disposed on the principal surface of the rear glass substrate. A space defined between the rear glass substrate and the front glass substrate is filled with a gas. The gas may be an Hg (mercury) gas or an Xe (xenon) gas.
Abstract:
An emitter has a dielectric layer formed on a conductor, with a thin metal layer over the dielectric. A plurality of conducting centers is in the dielectric layer to allow electrons to pass through the dielectric from the conductor to the thin metal layer via quantum tunneling.
Abstract:
A dielectric-film-type electron emitter includes an emitter section, a first electrode, and a second electrode. The emitter section is formed of a thin layer of a polycrystalline dielectric material. The dielectric material constituting the emitter section is formed of a material having high mechanical quality factor (Qm). Specifically, the dielectric material has a Qm higher than that of a so-called low-Qm material (a material having a Qm of 100 or less). The Qm of the dielectric material is preferably 300 or more, more preferably 500 or more.
Abstract:
An emitter for an electron-beam projection lithography (EPL) system and a manufacturing method therefor are provided. The electron-beam emitter includes a substrate, an insulating layer overlying the substrate, and a gate electrode including a base layer formed on top of the insulating layer to a uniform thickness and an electron-beam blocking layer formed on the base layer in a predetermined pattern. The manufacturing method includes steps of: preparing a substrate; forming an insulating layer on the substrate; forming a base layer of a gate electrode by depositing a conductive metal on the insulating layer to a predetermined thickness; forming an electron-beam blocking layer of the gate electrode by depositing a metal capable of anodizing on the base layer to a predetermined thickness; and patterning the electron-beam blocking layer in a predetermined pattern by anodizing. The emitter provides a uniform electric field within the insulating layer and simplify the manufacturing method therefor.
Abstract:
An electron-emitting device includes an emitter section composed of a dielectric material, a lower electrode disposed on the lower side of the emitter section, and an upper electrode disposed on the upper side of the emitter section so as to be opposed to the lower electrode with the emitter section therebetween, electrons being emitted from the emitter section through the upper electrode by the application of a drive voltage between the lower electrode and the upper electrode, wherein the upper electrode is provided with a plurality of through-holes which expose the emitter section and which have an average diameter of 10 nm or more and less than 100 nm, and a peripheral portion of each through-hole facing the emitter section is separated at a predetermined distance from the emitter section.